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Title:
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2023/070944
Kind Code:
A1
Abstract:
The present disclosure relates to the technical field of semiconductors, and provides a semiconductor structure and a method for manufacturing the semiconductor structure. The semiconductor structure comprises a substrate; an isolation structure, which is formed in the substrate; a word line, which is partially located in the isolation structure; and a conductive part, which is located at the bottom of the isolation structure and used for repelling electrons.

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Inventors:
LIU XIANG (CN)
Application Number:
PCT/CN2022/070379
Publication Date:
May 04, 2023
Filing Date:
January 05, 2022
Export Citation:
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Assignee:
CHANGXIN MEMORY TECH INC (CN)
International Classes:
H01L27/108; H01L21/8242
Foreign References:
CN110957318A2020-04-03
CN106783743A2017-05-31
KR20010091733A2001-10-23
Attorney, Agent or Firm:
BEIJING INTELLEGAL INTELLECTUAL PROPERTY AGENT LTD. (CN)
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