Title:
SYSTEMS AND METHODS FOR REDUCING STRESS AND IMPROVING SURFACE ADHESION IN A DIE
Document Type and Number:
WIPO Patent Application WO/2024/045154
Kind Code:
A1
Abstract:
A die, an integrated circuit (IC) device including two or more stacked dies, and a process of forming a die are provided. The die includes a circuit, a passivation layer arranged above the circuit and includes a top side and a bottom side, and a polyimide layer disposed on the top side of the passivation layer. The top side of the passivation layer includes portions of different respective heights extending vertically away from the circuit. A top side of the polyimide layer opposite the top side of the passivation layer includes portions of different respective heights extending vertically away from the circuit such that the surface area of the top side of the polyimide layer is increased compared to a planar top side.
More Like This:
Inventors:
XU ZHIJUN (US)
CHRISTIE JAMES ELDON (US)
CHRISTIE JAMES ELDON (US)
Application Number:
PCT/CN2022/116715
Publication Date:
March 07, 2024
Filing Date:
September 02, 2022
Export Citation:
Assignee:
SK HYNIX NAND PRODUCT SOLUTIONS CORP DBA SOLIDIGM (US)
XU ZHIJUN (US)
XU ZHIJUN (US)
International Classes:
H01L23/485
Foreign References:
| US20200105634A1 | 2020-04-02 | |||
| US6322903B1 | 2001-11-27 | |||
| US6589712B1 | 2003-07-08 | |||
| US20150130052A1 | 2015-05-14 | |||
| US5795833A | 1998-08-18 | |||
| US20220059485A1 | 2022-02-24 | |||
| CN110660650A | 2020-01-07 |
Attorney, Agent or Firm:
NTD PATENT & TRADEMARK AGENCY LTD. (CN)
Download PDF: