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Title:
THERMALLY-CONDUCTIVE ELECTRICAL CONDUCTING LAYER
Document Type and Number:
WIPO Patent Application WO/2023/182329
Kind Code:
A1
Abstract:
Provided is a thermally-conductive electrical conducting layer excelling in thermal conductivity in the thickness direction. The thermally-conductive electrical conducting layer (1) comprises a binder component (11) and electrically-conductive particles (12). The electrically-conductive particles (12) comprise: electrically-conductive particles A (12a) having a thermal conductivity of 20 W/mK or more and a median diameter that is larger than the thickness (T) of the thermally-conductive electrical conducting layer (1); and electrically-conductive particles B (12b) having a median diameter that is smaller than the thickness (T) of the thermally-conductive electrical conducting layer (1). The resistivity of the thermally-conductive electrical conducting layer (1) is 2.0×10-5 Ω·m or more.

Inventors:
HARUNA YUUSUKE (JP)
TAJIMA HIROSHI (JP)
NAGATAKE TOMOHIRO (JP)
Application Number:
PCT/JP2023/011136
Publication Date:
September 28, 2023
Filing Date:
March 22, 2023
Export Citation:
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Assignee:
TATSUTA ELECTRIC WIRE & CABLE CO LTD (JP)
International Classes:
H01B5/16; H05K1/02; H05K7/20; H05K9/00
Domestic Patent References:
WO2022024757A12022-02-03
WO2020235573A12020-11-26
Attorney, Agent or Firm:
G-CHEMICAL INTELLECTUAL PROPERTY FIRM (JP)
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