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Title:
THERMALLY CONDUCTIVE RESIN COMPOSITION, CURED PRODUCT, HEAT TRANSFER MEMBER AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/007894
Kind Code:
A1
Abstract:
A thermally conductive resin composition which contains an epoxy resin and a thermally conductive powder, wherein: the thermally conductive powder contains aluminum nitride, which has a silicon-containing oxide coating film on the surface, and another thermally conductive powder; the content of the epoxy resin is from 1% by mass to 20% by mass relative to the total amount of the thermally conductive resin composition; the content of the thermally conductive powder is from 80% by mass to 99% by mass relative to the total amount of the thermally conductive resin composition; the content of the aluminum nitride, which has a silicon-containing oxide coating film on the surface, is from 10% by mass to 70% by mass relative to the total amount of the thermally conductive resin composition; and the content of the other thermally conductive powder is from 10% by mass to 89% by mass relative to the total amount of the thermally conductive resin composition.

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Inventors:
YUKUTAKE HAJIME (JP)
FUNAHASHI HAJIME (JP)
SATOH HIKARU (JP)
Application Number:
PCT/JP2022/019257
Publication Date:
February 02, 2023
Filing Date:
April 28, 2022
Export Citation:
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Assignee:
SHOWA DENKO KK (JP)
International Classes:
C08L63/00; C01B21/072; C08K3/22; C08K9/02; H01L23/373
Domestic Patent References:
WO2019124147A12019-06-27
WO2022014129A12022-01-20
Foreign References:
JP2020073626A2020-05-14
JP2011084657A2011-04-28
JP2019067955A2019-04-25
JPH05247181A1993-09-24
JP2020073625A2020-05-14
Other References:
THE TRC NEWS, October 2016 (2016-10-01)
See also references of EP 4245806A4
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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