Title:
THERMOPLASTIC MULTILAYER ADHESIVE FILM
Document Type and Number:
WIPO Patent Application WO/2024/014534
Kind Code:
A1
Abstract:
The present invention addresses the problem of achieving a thermoplastic multilayer adhesive film that is capable of bonding adherends, which are ordinarily difficult to be bonded to each other by one adhesive, with a high adhesive force that is able to exhibit a sufficient tensile shear adhesive strength and a sufficient 90 degree peel strength. The present invention provides, as a means for solving the problem, a thermoplastic multilayer adhesive film which has the resin layer A and the resin layer B described below. Resin layer A: a layer which contains a carboxylic acid-modified polyolefin and/or an ionomer
Resin layer B: a layer which contains a crosslinking agent and at least one copolymer that is selected from among a carboxy-modified styrene-butadiene copolymer, a carboxy-modified acrylonitrile-styrene-butadiene copolymer and a carboxy-modified methyl methacrylate-butadiene copolymer
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Inventors:
OHTSUKA RYOCHI (JP)
Application Number:
PCT/JP2023/026030
Publication Date:
January 18, 2024
Filing Date:
July 14, 2023
Export Citation:
Assignee:
AICELLO CORP (JP)
International Classes:
B32B27/00; C09J7/35; C09J11/06; C09J109/00; C09J109/02; C09J109/06; C09J123/26; C09J125/10; C09J201/02
Foreign References:
| JP2014008694A | 2014-01-20 | |||
| JPS55111937U | 1980-08-06 | |||
| JP2015117335A | 2015-06-25 | |||
| JP2008120062A | 2008-05-29 | |||
| JPS564797A | 1981-01-19 |
Attorney, Agent or Firm:
OCHANOMIZU INTERNATIONAL PATENT OFFICE (JP)
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