Title:
THERMOSETTING RESIN COMPOSITION AND PREPREG, LAMINATE AND HIGH FREQUENCY CIRCUIT SUBSTRATE CONTAINING SAME
Document Type and Number:
WIPO Patent Application WO/2020/047920
Kind Code:
A1
Abstract:
Disclosed are a thermosetting resin composition, and a prepreg, a laminate and a high frequency circuit substrate which contain same. The thermosetting resin composition comprises the following components: 12-50 parts by weight of a cyanate ester resin; 30-60 parts by weight of an epoxy resin; and 10-28 parts by weight of a biphenyl phenolic resin. The prepreg and a copper-cladded substrate, which are prepared from the provided thermosetting resin composition, have a high glass transition temperature, excellent dielectric properties, a low water absorption, a high thermal resistance, a high peel strength, and a high interlaminar adhesive force and have a good processability.
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Inventors:
LUO CHENG (CN)
TANG GUOFANG (CN)
TANG GUOFANG (CN)
Application Number:
PCT/CN2018/108196
Publication Date:
March 12, 2020
Filing Date:
September 28, 2018
Export Citation:
Assignee:
SHENGYI TECHNOLOGY CO LTD (CN)
International Classes:
C08L63/00; B32B15/14; B32B15/20; B32B17/04; B32B17/06; B32B33/00; C08G59/62; C08K5/3492; C08K5/5313; C08K7/18; C08L79/04; H05K1/03
Foreign References:
| CN101974208A | 2011-02-16 | |||
| CN108117723A | 2018-06-05 | |||
| CN102911501A | 2013-02-06 | |||
| CN107129589A | 2017-09-05 | |||
| CN103131130A | 2013-06-05 |
Attorney, Agent or Firm:
BEYOND ATTORNEYS AT LAW (CN)
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