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WO/2010/036503A2 |
A process to laser micro-machine a metal part with a high cosmetic quality surface includes applying a protective coating layer to at least one surface of the part before micro-machining the part with a laser. The protective coating appl...
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WO/2010/034697A1 |
The invention relates to a method for assembling titanium parts and steel parts by diffusion welding that comprises placing two thin spacers (14, 16) made of niobium or vanadium and of copper, respectively, between a titanium part (10) a...
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WO/2010/031410A1 |
The invention relates to a flame cutting unit (1) for cast workpieces in a continuous casting system having a conveyor belt (4), on which a cast strand (2) to be severed by flame cutters into workpieces is guided transversely to the tran...
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WO/2010/029169A1 |
The invention relates to a solder material, a carrier element or component with contact surfaces for solder connections, and a fluxing agent for soldering. According to the invention, in addition to the solder material, a filler material...
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WO/2010/024141A1 |
Disclosed is a cleaning composition which exhibits sufficient cleaning power even when an object obtained by using a lead-free solder flux is cleaned, and can be easily separated from pre-rinse water. Also disclosed is a system for remo...
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WO/2010/022883A1 |
The invention relates to a coating method for coating at least one surface of a workpiece (1) by means of a coating element (2), from which material is transferred to the surface of the workpiece (1), wherein in a first method step at le...
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WO/2010/023790A1 |
Disclosed is a manufacturing method for a pattern-forming body that enables easy formation of a dot‑like pattern without deforming the shape of a recessed part. The method is for manufacturing a pattern-forming body formed by the arran...
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WO/2010/018680A1 |
Disclosed is a surface-mounting machine (10) that is suitable for electronic components having terminals to which the solder is already attached, and particularly for rear surface contact type electronic components. The machine is equipp...
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WO/2010/018679A1 |
A method of manufacturing a printed wiring board (107) on which a surface-mount component (100) is mounted. The surface-mount component includes a plurality of electrodes (100a, 100b). The printed wiring board includes a plurality of l...
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WO/2010/018674A1 |
Provided is a molten metal supply pipe with which the admixing of oxides produced on the surface of a solid-phase, low melting point metal material can be limited with a construction that is simpler than prior constructions. The molten m...
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WO/2010/019735A2 |
A method for treating a wear reducing material welded to a surface of a tool used in a wellbore operation that includes friction stirring the wear reducing material into the surface of the tool is disclosed. Method for improving the prop...
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WO/2010/019733A2 |
A method for applying a wear reducing material to a tool used in a wellbore operation that includes welding a hardfacing alloy to a surface of the tool, wherein the welding comprises friction stirring the alloy into the tool's surface is...
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WO/2010/012255A2 |
In a process for producing a join between a first component (10) and a second component (20), wherein the second component (20) contains a single-crystal or directionally solidified material, a first component (10) and a second component...
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WO/2010/010852A1 |
An electrode unit (32) configuring a resistance welding device (10) is provided with a first chassis section (52) and a second chassis section (54). A plurality of stepped hole sections (56) are formed in the first chassis section (52),...
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WO/2010/006930A1 |
The invention relates to a method for manufacturing finned tubes made of metal, in particular heat exchanger tubes, wherein at least one continuous strip (4) forming the fins (1) is fed tangentially to a tubular body (2) that is set into...
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WO/2010/001603A1 |
Disclosed is a zero point setting-based workpiece welding control method that enables greater machining precision, that enables the control of machine tool wear, loosening and damage and so on, and that enables the efficient implementati...
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WO/2009/158332A2 |
A nickel (Ni), chromium (Cr), cobalt (Co), iron (Fe), molybdenum (Mo), manganese (Mn), aluminum (Al), titanium (Ti), niobium (Nb), silicon (Si) welding alloy, articles made therefrom for use in producing weldments and methods for produci...
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WO/2009/157570A1 |
Disclosed is a method for manufacturing a laser-welded steel pipe stably in a high yield by deciding a laser welding situation highly precisely and by changing a welding condition on the basis of the decision result. The irradiating reg...
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WO/2009/074858A9 |
A case body (a first member) (30) and a cap member (a second member) (40) that have not been subjected to welding include a protrusion (25) consisting of at least one of a first protrusion (35) that protrudes from a first outer surface (...
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WO/2009/157130A1 |
Provided is a joint structure whereby an electronic element (12) and an electrode (14) which form an electronic component are joined. The joint structure includes a solder layer containing 0.2 to 6 wt% copper, 0.02 to 0.2 wt% germanium ...
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WO/2009/154295A1 |
Provided is a collective ceramic substrate which has dividability wherein the substrate can be excellently divided when intended and cannot be easily divided by mistake when unintended. Further provided are a ceramic substrate excellent...
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WO/2009/148086A1 |
Disclosed is a laser processing apparatus for processing a substrate to be processed which is used for a solar cell. The laser processing apparatus comprises a holding part (65) for holding a substrate (60) to be processed, a laser osci...
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WO/2009/143909A1 |
The present invention provides a welding device for welding workpieces (9) made of high-temperature resistant super alloys. The device comprises: - a heat source (3) for creating a heat application zone (11) on the workpiece surface (10)...
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WO/2009/142070A1 |
Provided are a method for producing a heat exchanger plate with a small number of work steps, and a heat exchanger plate. A method for producing a heat exchanger plate comprises a step for inserting a pipe (16) for heating medium into a ...
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WO/2009/138142A1 |
The invention relates to a method for positioning two components (11, 12) to be joined to each other along a common joint line (13), wherein the two components (11, 12) are connected to each other by limited-length tack welds (14) firmly...
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WO/2009/135553A1 |
The present invention relates to a weld rivet connection (2) of one or more components (6) comprising a base component (7), wherein the component or components have a hole (8) through which the shaft (4) of a weld rivet (1) comprising a ...
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WO/2009/131178A1 |
Disclosed is a lead-free solder alloy having improved surface properties, which is suppressed in occurrence of fine recesses/projections or shrinkage cavity. The lead-free solder alloy has a composition consisting of 0.1-1.5% of Ag, 2.5-...
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WO/2009/124455A1 |
A method of producing grizzly includes the steps: coiling grizzly bar (11) on a shaft with smooth surface; placing trim strips (13) on coiled grizzly bar (11) along the axial direction; the shaft coiled with grizzly bar acting as the axi...
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WO/2009/124802A1 |
The invention relates to a welding method in which the power (P) is controlled in accordance with the temperature (T) of the welding point.
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WO/2009/121614A1 |
Copper and Nickel containing metals are joined together by ultrasonic welding particularly to provide connectors for use in multi cell battery systems where the nickel containing metal is required for spot welding to the cell terminals a...
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WO/2009/122912A1 |
Disclosed is a solder structure which suppresses formation of Sn whiskers in an Sn alloy solder. A method for forming the solder structure is also disclosed. A solder structure (2) is composed of an Sn alloy (4) which can be in a solid-l...
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WO/2009/118213A1 |
Welding methods are often carried out using a protective gas but the effect of said gas is often insufficient. According to the invention, the component (4) to be welded is arranged in a process chamber (31).
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WO/2009/117246A1 |
Processes for friction stir welding, typically for comparatively thick plate materials using multiple passes and multiple layers of a friction stir welding tool. In some embodiments a first portion (10) of a fabrication preform and a sec...
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WO/2009/116186A1 |
Provide is a laser welding apparatus capable of performing laser welding while holding conductors so as not to have the tips of the conductors deviated from their positions on terminals. The laser welding apparatus (10) is provided for l...
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WO/2009/114861A1 |
A multi-shouldered friction stir welding tool (10) comprises an integral shank-pin unit (11) having a plurality of pin portions on the shank-pin unit, where the plurality of pin portions for driving into a plurality of joints to perform ...
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WO/2009/109304A1 |
A device (1) for positioning at least one weld backing (8, 9) on an inner side of at least one plate (51, 52, 53, 54) of a double casing, with at least two parallel supporting elements (2, 3), at least one weld backing (8, 9) and/or mean...
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WO/2009/105697A1 |
A compression based tubular structure (20) and a method of making same is disclosed. The compression based tubular structure (20) has at least one structural joint (24) using the friction welding process to improve the durability of tubu...
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WO/2009/104806A1 |
Provided is a submerged arc welding method with multiple electrodes for a steel material suitable for use in welding for manufacturing a large-diameter steel pipe such as a UOE steel pipe, a spiral steel pipe, or the like the base materi...
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WO/2009/090798A1 |
Disclosed is a flux creeping-up preventive composition for a solder that has flux creeping-up preventive properties comparable with those of a conventional flux creeping-up preventive agent comprising a polymer containing a polyfluoroalk...
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WO/2009/078342A1 |
In supplying a flux to a member for heat exchangers which is to be brazed, a given amount of the flux is stably adhered to a brazing area without interposing any substance which becomes unnecessary for the brazing, such as a binder. In p...
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WO/2009/078126A1 |
Disclosed is an in-vacuum welding treatment apparatus (1) comprising a vacuum chamber (100), a carrier (400) arranged in the vacuum chamber (100) and capable of moving in an X-direction while carrying a work, a carrier drive device arran...
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WO/2009/077064A1 |
The invention relates to a method and to a device for the marginal connection of sheet metals (8, 9), particularly of auto body sheets in automotive construction, wherein in a device (1) the edge of a first sheet metal (8) is crimped ove...
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WO/2009/078231A1 |
Highly accurate dicing is performed without being affected by steps on a wafer surface, and particle generation due to abrasion is eliminated. A laser dicing apparatus (10), which forms a modified layer on a wafer (W) by irradiating the ...
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WO/2009/077081A2 |
The invention relates to a method and a device for producing annular, rotationally symmetrical workpieces (5), such as rings or cores for matrices, made of metal and/or ceramic powder, particularly for dies for pressing powder or massive...
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WO/2009/075137A1 |
A laser processing machine which can process a substrate while protecting against damage due to roughening or burring of the table surface and can collect dust generated through processing efficiently while controlling scatter and readhe...
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WO/2009/068119A1 |
The invention relates to a method for connecting at least two heat exchanger plates to form one plate packet for a heat exchanger, having at least one opening formed by through holes in the heat exchanger plates. With the aid of the meth...
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WO/2009/068733A1 |
The present invention related to a method of manufacturing a coiler drum (5) to be used in a coiler furnace and a coiler drum (5). The method comprises the step of forming a trinickel aluminide containing surface layer (7) onto a coiler ...
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WO/2009/069510A1 |
This aims to provide a working object cutting method capable of cutting a working object highly precisely. The working object cutting method comprises irradiating a working object (1) with a laser beam by focusing the laser beam, thereby...
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WO/2009/060821A1 |
A circuit board is provided with an insulating substrate (1) and a circuit (3) formed on the insulating substrate (1). The circuit is provided with a plated base layer (4) whereupon a pattern is formed by irradiating a metal thin film (2...
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WO/2009/057558A1 |
A laser beam (L), i.e., a pulsed laser beam, is radiated with a pulse width of 31ns-54ns and a pulse pitch of 7.5μm-10μm, to form a modified region (7) to be a cut start point along a planned cut line (5) on a GaAs substrate (12). Thus...
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