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JP6872709B1 |
To provide a surface polishing jig capable of efficiently performing surface polishing even for an object to be polished having an insulating layer on the entire surface. A cylindrical insulator 12 is arranged inside a cylindrical electr...
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JP2021510639A |
A method of grinding and / or polishing a defective portion (1) in the surface coating of a workpiece, in which a grinding or polishing disc held by a tool is rotated and / or a circular trajectory while applying pressure over the defect...
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JP6865470B2 |
To provide a chuck member for an ultrasonic polishing device capable of polishing to a relatively narrow groove part from a planar surface.A chuck member 5 comprises on one end part, a slit part 5a for dividing the chuck member 5 into a ...
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JP6863613B2 |
An ultrasonic vibration application tool equipped with a Langevin type ultrasonic vibrator which is suitably employable for ultrasonic processing devices and which efficiently generates ultrasonic vibration includes: a cylindrical housin...
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JP6859581B2 |
The invention relates to a method of processing a substrate. The substrate has one side and a side opposite to the one side. The substrate has, on the one side or on the side opposite to the one side, at least one recess. The method comp...
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JP2021049580A |
To solve a problem that the quality of molded products is different due to unevenness on a material surface, in a pressure molding device of a servo motor rotor plate.A pressure molding device includes a mounting base 1, a pressure moldi...
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JPWO2019177092A1 |
To realize a method for polishing a diamond crystal capable of removing a processed altered portion including dislocations from the main surface, and a diamond crystal in which the processed altered portion is removed from the main surfa...
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JP6848361B2 |
To provide a diamond polishing method for polishing a diamond at a high polishing speed without generating defects, an insulative grinder, a method for manufacturing a diamond cutting tool, and a method for producing a diamond.A diamond ...
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JP2021044498A |
To provide a manufacturing method of a semiconductor device with improved yield.A manufacturing method of a semiconductor device according to an embodiment includes the steps of forming a groove in a first wafer in which a first semicond...
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JP6844733B1 |
To provide a method for manufacturing a substrate wafer, which can produce a substrate wafer having a warp and good nanotopography. A wafer having a first main surface and a second main surface is prepared, a flattening resin layer is fo...
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JP6838162B2 |
A device and method for manufacturing artificial solid bone by metal 3D printing technology comprises: a metal 3D printing technology is used and preferably with Co—Cr alloy and laser sintering to form a solid bone with a specific chan...
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JP6832555B1 |
To propose a surface texturing method which facilitates various processing on the surface of a work. When applying surface texture to the work W, first, the rotation of the head 100 is changed to a rotational movement around the rotation...
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JP6831541B2 |
To provide a method for manufacturing a high quality optical element, capable of processing the surface of the optical element material used for an optical system having a wavelength band from a vacuum ultraviolet region to a hard X-ray ...
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JP6827289B2 |
To provide a wafer processing method and a polishing device which enable rapid transfer to the formation of a gettering layer after polishing, and which enable a wafer processing as designed.A wafer processing method hereof is a method f...
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JP2021012152A |
To provide a method of accurately evaluating hydrogen embrittlement resistance, etc. of metal materials while preventing cracking associated with intrusion of hydrogen during a polishing process.A metal material evaluation method is prov...
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JP2021008013A |
To decrease, when processing stuck wafers with a cavity in a sticking surface thereof to expose the cavity, roughness formed around the cavity.A wafer processing method in which stuck wafers W having a cavity W1d in a sticking surface W1...
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JP2021005621A |
To provide a wafer processing method that can prevent a wafer from being damaged during the transfer of the wafer even when the thickness of a thinned portion is further reduced.A wafer processing method includes a holding step of holdin...
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JP6804209B2 |
To achieve low-damage processing by eliminating a crack of a substrate surface layer part and peeling of an oxide film layer and adhesive layer or the like even in processing of forming a terrace shape on an upper surface layer side.A ch...
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JP6783401B2 |
A glass blank is cut out from a glass plate by forming a crack starting portion inside the glass plate by moving a first laser beam relative to the glass plate such that a focal position of the laser beam is located in an inner portion o...
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JP6780800B1 |
To provide a wafer polishing method and a polishing apparatus capable of reducing the variation in the shape of a wafer generated in the polishing process in the first stage in the polishing process in the second stage. In order to corre...
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JP6775453B2 |
Embodiments provide a polishing composition for a magnetic disk substrate, which contains colloidal silica having an average primary particle size of 5 to 200 nm, fumed silica having an average particle size of 30 to 800 nm, pulverized w...
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JP6771918B2 |
To prevent falling of a grind stone from a rotary shaft of a grinding spindle due to ultrasonic vibration in an ultrasonic tool which is fitted to the grinding spindle which is rotated at a high speed, and by which ultrasonic vibration i...
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JP6758715B2 |
A novel mode of ultrasonic oscillation is generated in a Langevin ultrasonic transducer comprising a metal block, a metal block provided with a supporting means protruding in a ring shape on its side surface, and polarized piezoelectric ...
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JP6749806B2 |
To provide a structure capable of achieving both of accuracy improvement of precision finishing and miniaturization of a precision hole processing device.A precision hole processing device 1a includes vibration generation means 13 for vi...
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JP2020121367A |
To provide a diamond polishing device and a diamond polishing method, in which high efficiency in polishing can be achieved to reduce a running cost.A diamond polishing device includes: a polishing tool 14 which polishes a diamond surfac...
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JP6740091B2 |
To provide a processing method for a wafer capable of easily manufacturing a device chip in which a gettering layer is formed on a rear face and a lateral face.A processing method for a wafer has a mask formation step ST1 of forming a ma...
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JPWO2019043890A1 |
A method for manufacturing a semiconductor wafer, which includes a multi-step polishing step including three or more steps of polishing steps performed by using a polishing agent containing abrasive grains, and is used in the final polis...
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JP6731510B2 |
The present invention relates to an automatic fault diagnosable integrated sheet body punching and grinding assembly, including a frame and a conveying slot seat, a processing frame is provided on the conveying slot seat, the processing ...
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JP2020113606A |
To provide a wafer processing method capable of suppressing cracks generated on a wafer during cutting.A wafer processing method is a processing method of rotating a holding table 31 with a cutting blade 33 cut into a predetermined thick...
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JP2020109841A |
To provide a backside treatment process for a backside illuminated photoelectric device capable of reducing a demand for CMP apparatus, reducing costs of a backside treatment of a photoelectric device, improving manufacturing efficiency ...
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JP2020099962A |
To provide a single crystal substrate polishing method by which deformation of a single crystal substrate due to a foreign matter such as dusts is prevented without requirement for huge capital investment, and a recess or the like is not...
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JP2020519462A |
The present invention relates to a method for processing a workpiece (14) and a grinding / erosion machine (10). A tool (12) used for both grinding and erosion is used, which is used for the same clamp for erosion of the workpiece (14) a...
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JP6717353B2 |
A method of producing a silicon wafer includes: a laser mark printing step of printing a laser mark having a plurality of dots on a silicon wafer; an etching step of performing etching on at least a laser-mark printed region in a surface...
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JP6713214B2 |
To prevent mounting failure without fixing foreign matter on a side face of a device chip.A processing method for a device wafer having a surface on which devices are formed in respective areas separated by a plurality of dividing lines ...
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JP6703073B2 |
To provide a wafer processing method and a wafer processing system, capable of efficiently obtaining a chip having stable quality.A wafer processing method comprises a modified region forming step and a grinding step. The modified region...
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JP6703072B2 |
To provide a wafer processing method and a wafer processing system, capable of efficiently obtaining a chip having stable quality.A wafer processing method comprises a modified region forming step and a grinding step. The modified region...
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JP6695428B2 |
A textured work roll can impart a desired texture on a metal substrate, such as an aluminum or aluminum alloy sheet. The textured work roll can be used for applying a gloss finish on the metal substrate. The textured work roll can be tex...
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JP6692006B2 |
Letting a particle diameter be Dx (μm) when a cumulative particle volume cumulated from the small particle diameter side reaches x (%) of the total particle volume in a particle size distribution obtained regarding cerium oxide included...
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JP2020061500A |
To provide a wafer processing method capable of performing plasma etching while holding down costs.A wafer processing method for dividing a wafer in which a plurality of devices are formed on a surface comprises a protection member arran...
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JP2020059087A |
To provide a super finishing device which can improve a strength of a tool, and can reliably and satisfactorily improve a surface roughness of an inner peripheral side surface of a piston ring groove in a piston.A super finishing device ...
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JP2020061501A |
To provide a wafer processing method capable of performing plasma etching while holding down costs.A wafer processing method for dividing a wafer in which a plurality of devices are formed on a surface comprises a protection member arran...
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JP2020061495A |
To provide a wafer processing method capable of performing plasma etching while holding down costs.A wafer processing method for dividing a wafer including a device region in which a device is formed and an outer peripheral excess region...
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JP2020061496A |
To provide a wafer processing method capable of performing plasma etching while holding down costs.A wafer processing method for dividing a wafer in which a plurality of devices are formed by a functional layer laminated on a surface com...
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JP2020061398A |
To provide a processing method for a wafer, capable of appropriately dividing the wafer into individual device chips, as well as reducing a thickness of the wafer by grinding a back surface of the wafer.A processing method for a wafer 10...
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JP2020061494A |
To provide a wafer processing method capable of performing plasma etching while holding down costs.A wafer processing method for dividing a wafer including a device region in which a device is formed and an outer peripheral excess region...
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JP2020061499A |
To provide a wafer processing method capable of performing plasma etching while holding down costs.A wafer processing method for dividing a wafer in which a plurality of devices are formed on a surface comprises a protection member arran...
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JP6682252B2 |
To make the polishing speed of a polishing tool in contact with a plate-like workpiece the same at the rotation center and the outer circumference in order to shorten the time for polishing in polishing the plate-like workpiece.A polishi...
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JP2020057675A |
To provide a cutter capable of efficiently transmitting acoustic wave vibration or ultrasonic wave vibration to a ring blade.A ring blade 20 is fitted, from a side having a screw hole 16 of a resonator 10, to a fitting protrusion part 14...
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JP6665026B2 |
To provide a grinding device which can relatively easily grind a wafer formed of a material having high hardness.A grinding device 2 includes: holding means 6 having a chuck table 26 which can rotate and holds a wafer 66; grinding means ...
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JP6663980B2 |
The present invention is a novel technique for setting a multiplicity of diamonds such as diamonds into a unique setting to enhance the beauty and presentation, with the technique including steps of assorting, blocking, mapping, sawing, ...
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