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JP2022055919A |
To improve durability and precision in a mouse for an e sport.This mouse pad stabilizes reaction of a mouse by keeping a distance between the mouse and a mouse pad. This mouse pad is made of metal, and improves slipping performance and s...
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JP7047797B2 |
To provide a terrace processing method for laminated wafers capable of reducing the thickness variation of a terrace flat part in a circumferential direction.A terrace processing method for laminated wafers includes: a first process of m...
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JP2022051112A |
To provide a grinding device and a grinding method that can prevent the outer periphery of an edge-trimmed wafer from cracking and becoming large fragments of a thin wafer and scattering into a device during grinding from the side of the...
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JP2022047538A |
To provide preferable surface roughness even when it is a process of grinding a notch groove, to reduce load of polishing process that is post-process, thereby improving final surface roughness and shape accuracy.In a chamfer grinding me...
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JP2022043853A |
To provide a new wafer processing method for forming a chip of a desired thickness from a wafer.A wafer processing method includes a groove forming step of forming a groove (cutting groove 141) having a depth 140 which is equal to or mor...
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JP7035777B2 |
To provide a substrate for a semiconductor without deformation or with less deformation even when deposition or high-temperature heat treatment is performed; and provide a manufacturing method of the substrate for a semiconductor.The sub...
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JP2022042631A |
To provide a punching method for a metal plate which forms a punching hole excellent in fatigue strength.A metal plate punching method forms a circular punch hole 3 in a metal plate 1, uses a die 13 that has a circular opening and suppor...
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JP7035153B2 |
To eliminate cracking of a surface layer part of a substrate and peeling or the like of an oxide coating layer and an adhesion layer, so as to achieve processing with less damage.A chamfering device, which grinds an outer periphery part ...
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JP2022035502A |
To cut a workpiece by applying ultrasonic vibration to a cutting blade and to reduce excessive wear of the cutting blade.A cutting method for cutting a workpiece by using a cutting device including a chuck table for holding a workpiece, ...
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JP7025249B2 |
To reduce the thickness variation of a workpiece after back surface grinding when grinding the back surface of the workpiece having different thicknesses in a device forming region and a device non-forming region.Only a portion adhered t...
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JP7021632B2 |
A manufacturing method of a wafer with a notch includes: polishing principal surfaces of the wafer; mirror-polishing a notch chamfered portion of the notch; mirror-polishing an outer-periphery chamfered portion of an outer peripheral por...
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JP7016930B2 |
To prevent a grind stone from falling off from a rotary shaft of a spindle due to ultrasonic excitation in an ultrasonic tool which is mounted on a grinding spindle that rotates at high speed and in which ultrasonic vibration is applied ...
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JP6995818B2 |
The invention relates to a tool device which is suitable for use with a machine tool, in particular a hand guided machine tool, having a driving device moving, in particular in an oscillating manner, around a driving axis. The tool devic...
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JP2022021441A |
To provide a wafer processing method which can satisfactorily remove an outer circumferential surplus region even in the case that a wafer surface is covered with resin such as polyimide and prevents a device from being damaged even in t...
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JP2022021124A |
To provide a method of grinding a wafer that hardly produces a large wafer fragment by separating an outer peripheral region of the wafer to a previously set size in a grinding process.A method of grinding a wafer includes: a laser irrad...
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JP2022018650A |
To provide a method for grinding a wafer, capable of suppressing the occurrence of a processing failure.There is provided a method for grinding a workpiece, including: a groove formation step of feeding a grinding unit for grinding while...
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JP2022504169A |
The embodiment relates to a system and a method for forming a multi-tile display panel, and more specifically to a system and a method for forming a display tile having a wraparound type edge electrode.
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JP6991206B2 |
A method for manufacturing a member to be treated includes: a first bonding step of bonding a member to be treated containing metal oxide and a first support to each other with a first adhesive layer; a first surface processing step of f...
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JP2022002889A |
To provide a cutting tool free from the risk of breakage, even if a heavy mechanical load is applied thereto, and an ultrasonic working device capable of exciting ultrasonic oscillation with a sufficient size.The tip of the rotational ax...
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JP6979607B2 |
To achieve good cutting of a wafer.The polisher, polishing a rear face of a wafer formed with a laser modified region therein, includes: polishing means of executing polishing so that a rear face temperature of a wafer is at least 70°C ...
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JP6979608B2 |
To achieve good cutting of a wafer.The grinder includes grinding means of grinding a rear face of a wafer with a laser modified region formed therein and control means of controlling a progress degree of cracking extending from the laser...
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JP2021186739A |
To provide a wiping clean tool which can efficiently wipe and remove stains, such as water scales, adhering to a tile floor surface of a bathroom, a tile wall surface, and a glass surface of a building etc., and to provide a wiping clean...
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JP6976713B2 |
To provide preferable surface roughness even when it is a process of grinding a notch groove, to reduce load of polishing process that is post-process, thereby improving final surface roughness and shape accuracy.In a chamfer grinding me...
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JP2021533314A |
To provide a thrust bearing assembly and a method capable of applying a higher speed and a load without initiating a thermochemical reaction. A thrust bearing assembly including a thrust ring for defining a thrust surface and an opposed ...
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JP6972169B2 |
An ultrasonic roller burnishing system comprises a roller and a controller. The roller is configured to be pressed against a surface of a workpiece to a pressing depth, roll on the surface at a feed rate, and vibrate at an ultrasonic fre...
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JP2021180203A |
To provide a chip manufacturing method capable of suppressing occurrence of a processing defect.A chip manufacturing method for manufacturing a plurality of chips by dividing a workpiece divided into a plurality of regions by predetermin...
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JP2021174934A |
To suppress the adhesion of contamination to a device, the decrease in production efficiency, and the damage, and to solve various problems caused by the edge trimming of bonded wafers.A chip manufacturing method includes: a wafer bondin...
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JP2021171909A |
To solve the occurrence of reduction in accuracy and strength (metal fatigue strength in particular) and non-uniformization of a surface associated with variations in processing surface residual stress after processing, due to difficulty...
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JP6955797B1 |
To provide a processing apparatus and a processing method capable of processing diamond (or a diamond-containing material) at low cost and easily even in processing such as drilling or cutting. A machining apparatus 1 includes a jig 5 fo...
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JP2021167046A |
To provide a cutting method for an SiC substrate, which can suppress wasting of a cutting blade during the cutting of the SiC substrate while inhibiting the breakage and chipping of the cutting blade.In a cutting method for an SiC substr...
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JP2021160068A |
To set the amplitude amount of vibration in a vertical direction transmitted to a grinding wheel to the amplitude amount capable of increasing the grinding speed even in the case of grinding a hard workpiece.A piezoelectric actuator 92 t...
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JP6939845B2 |
To provide a method and a device for removing oxided scale, which enable the relatively thick oxided scale to be removed execution of acid cleaning, and a method of manufacturing a steel material.An oxided scale removal method for removi...
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JP6939581B2 |
The present invention provides a method for processing a curved glass substrate with high precision and a method for producing a glass molded body. A method for processing the curved glass substrate (10) involves holding a curved glass s...
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JP6937132B2 |
To provide a supersonic vibration rotary cutting device capable of cutting a hard brittle material with stable cut quality.Provided is a supersonic vibration rotary cutting device 10 where a supersonic resonator 15 in which both the side...
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JP2021137885A |
To provide a concrete placing surface polishing device which can undergo downsizing and a reduction in cost, can reduce construction cost because it is portable by manual work and requires a small workload and is suitable to polish a sma...
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JP2021141387A |
To provide a manufacturing method of a piezoelectric oxide single crystal substrate using a new processing process that does not involve a lapping process to prevent the substrate from cracking due to a lapping process performed after a ...
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JP2021133490A |
To provide a correction-polishing processing method and a correction-polishing processing device which can suppress occurrence of streaks in a static processing trace, and do not cause anisotropy in surface roughness even when increasing...
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JP2021130187A |
PURPOSE: To provide practical means with high productivity as means that performs flat-processes of an end face of a small-diameter straight pin with high efficiency and with high accuracy in length and means that performs hemisphere-fac...
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JP2021132209A |
To provide a polishing pad for performing the polishing while suppressing damage to the surface of a conductive semiconductor substrate, and also to provide a method of manufacturing the conductive semiconductor substrate.Disclosed is po...
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JP6931661B2 |
The invention relates to a method for smoothing and polishing metals via ion transport by means of free solid bodies, and the solid bodies that are electrically conductive for carrying out said method, comprising the connection of the pa...
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JP6928328B2 |
[Problem] To provide a processing method and a processing apparatus capable of realizing high-efficiency, high-precision processing with a simple configuration, using dry polishing for processing diamonds, etc. [Solution] A processing ap...
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JPWO2019230883A1 |
To provide an ultrasonic vibration imparting tool provided with a Langevin type ultrasonic vibrator suitable for incorporating into an ultrasonic processing apparatus to generate an annular traveling wave. A cylindrical housing having a ...
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JP6923374B2 |
To reduce the occurrence of a flaw in polishing of an outer circumferential surface of an object to be polished having the outer circumferential surface positioned at an equal distance from and along the central axis of the object to be ...
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JP6916648B2 |
To provide a magnetic disk substrate polishing method capable of enhancing surface accuracy while suppressing reduction in polishing efficiency.A polishing method provided by the present invention includes a polishing step of polishing a...
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JP6912284B2 |
A grinding apparatus includes: a holding table for holding a workpiece thereon; a grinding unit including a grinding wheel for grinding the workpiece held on the holding table, the grinding wheel including a grinding stone made of abrasi...
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JP6904368B2 |
[Problem] To provide a technique by which it is possible to smooth a protective film when forming the protective film on a surface side (one side) before the step of reducing the thickness of a back surface side (the other side) of a sem...
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JP2021094686A |
To provide a new work-piece processing method that can easily process a work-piece with high accuracy.In a work-piece processing method that is used in processing a work-piece with a disk-like blade including abrasive grain, an auxiliary...
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JP2021084153A |
To provide a grinding device and a vibration grinding method capable of giving optional vibration to a grinding wheel shaft by a simple structure.A grinding device 1 includes a grinding wheel 50, a grinding wheel shaft 52 to which the gr...
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JP6879272B2 |
The present invention is a method for producing a silicon wafer, which comprises a dry etching step between a rough polishing step and a final polishing step, and which is characterized in that a silicon wafer after the rough polishing s...
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JP2021074831A |
To provide a simple polishing method of a crystal material capable of suppressing dispersion of a thickness; and to provide a manufacturing method of a Faraday rotator.In a polishing method of a crystal material 2, when polishing the cry...
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