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JP7338516B2 |
To change the direction of water flowing toward a painted surface so as to flow toward the center side of a hood, a water deflecting member is provided that extends toward the center side of the hood while extending toward the painted su...
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JP7337449B2 |
To use instead of a dummy wafer, a dressing plate that allows information on thickness to be obtained easily when an unused cutting blade is dressed.When a cutting blade fixed with abrasive grains via a bond is dressed, a dressing plate ...
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JP2023537561A |
A method for cutting a plurality of slices from a work piece by a wire saw during a series of cutting operations divided into an initial cut and subsequent cuts, the wire saw having a wire array and a drive of a movable wire section of t...
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JP7336954B2 |
To provide a processing device configured so that a blade cover can be cleaned.A processing device 1 comprises a first cutting unit 20-1, a second cutting unit 20-2, a first cleaning part 30-1, and a second cleaning part 30-2. The first ...
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JP7336914B2 |
To provide a processing device that can obtain data that enables a processing step to be verified, improved and disclosed, with respect to occurrence of an error caused by a kerf check.A processing device 1 comprises: a camera 30 that ph...
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JP2023537084A |
A polishing system is presented. The system includes a first vibrating structure with a first plurality of protrusions. The system also includes a second vibrating structure with a second plurality of protrusions. The system also include...
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JP7335617B2 |
The present invention provides an aluminum nitride wafer and a method for making the same. The method includes forming at least one alignment notch in or at least one flat alignment edge on a periphery of the aluminum nitride wafer. The ...
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JP7333830B2 |
The invention relates to a device with a machine tool and a braking device, the machine tool having an eccentrically supported, rotatable backing pad for receiving a tool. According to one embodiment, the braking device has a frame, whic...
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JP7330086B2 |
To provide a processing method capable of reducing an influence from heat generation due to re-utilization in a shorter time than a conventional one.A processing method includes an idling step and a cutting step. The idling step is a ste...
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JP2023115592A |
To provide a grinding device 1 which realizes rotation of an abrasive wheel 33 with a configuration that does not correspond to a fire instrument and can perform grinding processing.A grinding device 1 comprises: a frame 10 which can be ...
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JP2023114583A |
To provide a cutting device excellent in workability.A cutting device 2 comprises: cutting means 6 that applies cutting processing to a work-piece W held on a chuck table 4; X-axis feeding means 32 and Y-axis feeding means which feed the...
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JP2023114528A |
To dispose a protective member in a predetermined area of a workpiece easily at low cost.A protective member disposing method is to expose a workpiece partitioned by a plurality of division scheduled lines crossing each other and having ...
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JP7328507B2 |
To suppress the residue of scraps on a jig that supports a workpiece.A manufacturing method of a semiconductor device includes a step (A) of preparing a composite substrate having a device area including a plurality of unit structures an...
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JP7327217B2 |
An automatic wet sanding apparatus is equipped with a suction unit having a suction nozzle that is located under an automatic wet sanding unit in a state where automatic wet sanding is performed and a suction device that generates a suct...
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JP7325911B2 |
Provided is a method for machining a workpiece including a substrate that has front and back surfaces and a ductile material layer that contains a ductile material and is disposed on the front or back surface. The method includes a tape ...
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JP7325905B2 |
To suppress the peeling of a membrane from a substrate, when cutting the substrate with the membrane.A manufacturing method of multiple chips for manufacturing the multiple chips from a substrate with a membrane by cutting the substrate ...
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JP7326012B2 |
To provide a processing device designed to share an operation skill between operators and improve the skills of the operators.A processing device comprises: a processing unit 13 that processes a wafer 100 held on a chuck table 11; an ima...
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JP7325904B2 |
An objective of the present invention is to properly carry out a setup process. A method for detecting the position of a cutting unit uses a cutting apparatus including a cutting unit to cut a workpiece by a cutting blade, an edge positi...
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JP2023534608A |
A method of cutting a plurality of slices from a workpiece with a wire saw during a series of cutting operations, the cutting operations being divided into an initial cut and a subsequent cut, the wire saw cutting a movable wire section ...
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JP2023110631A |
To suppress peeling of an electrode.A semiconductor wafer comprises a semiconductor substrate, a plurality of circuit parts formed on a surface of the semiconductor substrate, and a plurality of electrodes formed corresponding to the plu...
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JP2023534119A |
A method for cutting a plurality of slices from a work piece by a wire saw during a series of cutting operations divided into an initial cut and subsequent cuts, the wire saw having a wire array and a drive of a movable wire section of t...
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JP2023109276A |
To provide a processing device which prevents a function stop of a proximity sensor during processing of a workpiece by monitoring a state of the proximity sensor used for detecting a frame unit, and to provide an abnormality detection m...
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JP2023109359A |
To suppress deviation from a target position in a thickness direction in separation of an aluminum nitride single crystal body.A fixing jig used for separating an aluminum nitride single crystal body from a laminate includes a placing su...
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JP7323323B2 |
To correctly set an expanded amount if a chip interval is expanded by expanding a tape.In a division device 1, a table 30 comprises: a transparent plate 300 having a suction port communicating an upper surface and a suction source so as ...
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JP7321643B2 |
To provide a method of cutting a workpiece that can easily detect the size of a wafer. A method of cutting a workpiece includes: a holding mechanism for holding the workpiece having electrodes in the plural regions divided by the plural ...
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JP7321848B2 |
To provide a wafer processing method that can finish a device chip to the desired thickness while measuring the thickness of the device chip without being affected by the waviness of the device chip, even if the size of the device chip i...
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JP7321639B2 |
To clearly observe a rear surface side of a device chip to be formed.A wafer processing method for dividing a wafer in which a plurality of devices are formed in each region on a surface partitioned by division schedule lines into indivi...
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JP2023533805A |
A grinding setting selection system for a robotic grinding system is presented. The system includes an abrasive rotational speed acquirer that acquires the current rotational speed of a grinder within the robotic grinding system. The sys...
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JP7320220B1 |
An object of the present invention is to provide a rotating blade for removing deposits that can suppress chipping of a base material, facilitates the work of removing deposits from the corners of concave portions of steel materials, and...
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JP7318216B2 |
To suppress the dropping of a wafer during and after cutting a crystalline ingot, and the occurrence of cracking during the cutting by means of low-cost and easy means.In a fixation method of a crystalline ingot, as the fixation method o...
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JP2023104068A |
To provide a blade mounting fixture with which blades can be mounted safely and reliably even if there is only one operator without unstable operating posture or any negative effect on the operation safety or blade damages.A blade mounti...
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JP7316901B2 |
An object of the present invention is to be able to identify blade information of a cutting blade. An identification method of a cutting blade comprises: a blade management step of associating an image of the surface of a cutting edge of...
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JP7314876B2 |
To provide a metal plate grinding device and grinding method in which the surface of a metal plate can be ground in a short time, and furthermore the surface roughness after the grinding can be reduced, and provide a metal plate manufact...
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JP7313766B2 |
To provide a carrying mechanism that is able to inhibit decreases in the quality and yielding percentage of chips, etc., obtained by processing of work pieces.A carrying mechanism 12 for carrying a work piece 11, comprises: a carrying ar...
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JP7313968B2 |
To provide a processing method of a wafer, capable of solving a problem that it is difficult for a base wafer covered with a mold resin to be divided into individual package devices due to the curving of a base wafer.A processing method ...
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JP7313805B2 |
A cutting apparatus includes a processing feed direction determining mechanism. The processing feed direction determining mechanism includes an imaging unit that images a region including a cut groove and a recording unit that records ch...
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JP2023102132A |
To provide a cutting method which can suppress chipping of a blade for gear milling, and suppress abrasion loss of an abrasive cutting wheel.A cutting method is given in which a blade of a gear milling is cut by a disc shaped and rotatin...
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JP7313202B2 |
A cutting apparatus includes a mount flange having a mount land that has a surface for holding a cutting blade as a consumable part, a changing apparatus for changing cutting blades, and a moving unit for moving the changing apparatus be...
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JP2023101881A |
To provide a cutting device capable of suppressing worsening of responsiveness and the occurrence of overshooting in flow rate control of process water, and a method for manufacturing a cut product.The cutting device receives process wat...
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JP7312058B2 |
To measure fine water pressure distribution around a processing point.A measurement jig 8 comprises: a lower table 80 having a mounting surface 80b mounted on a base 22; a side part 81 erecting from an upper surface 80a of the lower tabl...
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JP2023530636A |
A method of cutting a plurality of slices from a workpiece with a wire saw during a series of cutting operations, the cutting operations being divided into an initial cut and a subsequent cut, the wire saw cutting a movable wire section ...
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JP7308621B2 |
To enable a low cost and suppression of duration required for completion.A division device 1 at least comprises: a cutting unit that divides a processed material 200 held by a holding table into a plurality of device chips; a cleaning un...
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JP7306818B2 |
To provide a fine frog manufacturing method that can form fine frogs by forming multiple columns with pointed tips on a surface of a workpiece.A fine frog manufacturing method of the present invention is constituted of at least an aspect...
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JP7306859B2 |
Provided are a support sheet a method for processing a transparent plate. The support sheet for supporting a workpiece at least comprises a transparent sheet with a front surface for supporting the workpiece and a reflection film stacked...
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JP2023098764A |
To provide a processing method for suppressing elongation of burrs generated when cutting an electrode portion in processing for dividing a package substrate by cutting.In a processing method of a package substrate 10, a plurality of int...
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JP7304792B2 |
To provide a method capable of suppressing the occurrence of cracks to efficiently obtain a rare earth iron garnet crystal film substrate with a high yield when grinding and removing an unnecessary nonmagnetic garnet single crystal subst...
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JP7304787B2 |
To enable grasping that an attaching/detaching jig is mounted on a spindle while suppressing the attaching/detaching jig from colliding with another member.A cutting method includes: a blade fitting step ST1 of fixing a cutting blade to ...
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JP2023095080A |
To provide a method for slicing a silicon ingot, by which the variation in wafer thickness can be reduced, and the worsening of quality of wafers can be prevented.A method for slicing a silicon ingot comprises the step of supplying a coo...
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JP7303635B2 |
A workpiece holding method for a workpiece having a bowl-shaped warp includes a mounting step of mounting the workpiece on a holding unit having a holding surface, a suction hole opening to the holding surface, and a suction passage for ...
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JP2023092774A |
To enable telescopic motion of a bellows without contacting a rail when moving a suspension type spindle unit in a bellows mechanism.A suspension type bellows mechanism 4 has one end connected to a first spindle unit 61 and the other end...
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