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JP2002127020A |
To provide a method for regenerating a grinding wheel allowing the effective use of abrasive grains and other resources.A vitrified grinding wheel is formed with its outer periphery grinding wheel portion bonded to a metal core. When it ...
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JP2002512298A |
Alumina-based abrasive material having at least an internal core structure is provided. Preferably, the abrasive material results from co-extrusion of at least two different sols. In some preferred processing, steps to provide multiple i...
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JP2002086313A |
To provide a disc type tool of a laminated structure having a high damping characteristic and high rigidity and low in manufacturing cost.The disc type tool 10 is a laminated structure constituted by partially connecting, laminating and ...
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JP3261687B2 |
PURPOSE: To prevent the characteristics deterioration of a semiconductor device and improve the yield of products by forming a substrate with a sintered body made of silicon carbide or graphite, coating the surface with a polycrystalline...
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JP3260764B2 |
Textured indentations in the cutting surface of the core of a cutting tool are designed to accommodate a single layer of superabrasive grain. The superabrasive grain contained in these textured indentations is thereby oriented during met...
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JP2002502713A |
A grinding wheel for use in grinding glass, has an outer periphery of abrasive material secured to a body portion made of a lightweight material.
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JP2002502714A |
A cylindrical, abrasive grinding wheel having a cylindrical abrasive region with an abrasive surface at an outer circular band thereof. The abrasive region includes layers of abrasive particles. The layers of abrasive particles can be ti...
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JP2002028871A |
To form moldable discrete pellets used for molding a component, e.g. a grinding/cutting grinding wheel, with a molding resin and abrasive grains.The grinding/cutting grinding wheel is manufactured as follows: a die, moldable discrete com...
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JP2002018724A |
To provide a polishing molding and a polishing surface plate using the polishing molding applicable to a machining process and a CMP process for polishing a substrate material and an optical material, reducible in costs because of the ab...
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JP3238007B2 |
PURPOSE: To manufacture an abrasive compact having excellent filling characteristic by use of compact synthesis conditions. CONSTITUTION: An ultra-hard abrasive particle mass having a particle size in a specified particle size range is u...
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JP2001524398A |
A polymeric foam finishing pad is made by attaching a dense array of individual foam members to a suitable support substrate. The foam members are individually inserted into a support substrate and attached to the substrate by an adhesiv...
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JP2001524396A |
A method and apparatus for polishing and planarizing workpieces such as semiconductor wafers is presented. Conditioning rings, which are used to condition polishing pads used in the planarization or polishing of semiconductor wafers, are...
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JP2001523171A |
The present invention provides an abrasive material (50) comprising a base surface having a plurality of pyramidal shapes protruding therefrom the base surface and the protrusions (52) being formed of the same material, each protrusion (...
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JP2001522728A |
The invention relates to a composite honing ring comprising a honing part and a carrier part, whereby both components are made of different materials and can contain plastic resins in particular. The invention is characterized in that th...
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JP3226632B2 |
PURPOSE: To enhance the bonding force between a superabrasive grain layer and a base body by tilting a boundary surface between a base body part and a tip part relating to a surface vertical to a shaft-shaped body axis, in a shaft- shape...
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JP2001519250A |
An abrasive article comprising an abrasive fabric comprising a fabric having discrete areas of electro-deposited metal extending on or therethrough and having abrasive material embedded in the metal, a layer of adhesive, and a backing su...
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JP3215432B2 |
Uncured molded abrasive articles having low volatile organic chemical content are prepared using water as a temporary binder. The abrasive articles preferably contain a uniformly coated abrasive grain comprising a novolac resin having a ...
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JP2001516652A |
Abrasive slurries, abrasive articles made from the abrasive slurries, and methods for the production of the abrasive articles are disclosed. The abrasive slurries and abrasive articles made therefrom comprise at least two grades of abras...
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JP2001252873A |
To provide a tool for polishing dressing to be used for mechanically and chemically flattening and polishing the surface of a precise and flat workpiece requiring fine polishing such as a semiconductor wafer, and a method of manufacturin...
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JP2001246566A |
To provide a cutting grinding wheel with excellent spontaneous effect having a high cutting force with high precision, without causing deterioration in cutting performance by clogging even in a long-time grinding.This cutting grinding wh...
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JP3203254B2 |
A measurement of polyurethane pad characteristics is used to predict performance characteristics of polyurethane pads used for chemical mechanical planarization (CMP) of semiconductor wafers, and to adjust process parameters for manufact...
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JP2001225224A |
To provide a tool for fine machining that excels in cutting performance and is simultaneously less liable to breakage and the effect of impact.The tool T comprises a central layer and two outer layers a, b and c bonded together. The cent...
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JP2001219376A |
To restrain occurrence of breakage, crushing, etc., of sharp parts of super abrasive grains.Roughly columnar rising parts 21 are arranged and formed in a roughly matrix shape in a central region of one surface 19a of a base metal 19. An ...
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JP3196030B2 |
Grinding disc has a profiled or cylindrical shape with an approx. 3mm thick outer abrasive layer(1) of diamond particles in a metallic, pref. bronze, binder. The abrasive layer (1) is carried on a metallic ring, e.g. copper, with good he...
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JP2001205566A |
To provide a resin impregnated vitrified grinding wheel capable of highly efficient grinding without impairing grinding performance and causing inconveniences in manufacture, and its manufacture. Pores are properly filled with an impregn...
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JP2001205560A |
To prevent falling-off of a grinding stone by intensifying the connection between the grinding stone and a wheel base and enhance the grinding accuracy by equalizing the quality of the grinding stone in the grinding wheel with the grindi...
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JP3193690B2 |
To simply detach abrasive grains from a core to easily recycle the core by providing strippable binder composition for a polishing tool having a core of which the main component is iron containing a specific rate of bronze alloy having s...
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JP3184519B2 |
An improved abrading device (1, 2 and 3) made with predetermined cavities (6). In this device, metal grit (4) is magnetically positioned and then brazed on a metal surface to form a generally uniform distribution of the metal grit on the...
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JP2001179624A |
To provide a tool and its manufacturing method for dressing a cutting, honing and cut-off tool or a precision tool, manufactured in a short time and at a low cost. Hard material abrasive grains 5 are nickel deposited onto the inner face ...
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JP2001507634A |
The present invention relates to a method and an article for rapidly polishing a glass workpiece surface using a structured abrasive article including cerium oxide particles dispersed in a binder. The abrasive article for rapid polishing...
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JP2001507290A |
An method of making a metal bonded, abrasive tool uses a perforated stencil to place abrasive parcels in a pattern on the cutting surface of the tool. The stencil is placed against the tool preform so that the perforations define cavitie...
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JP2001121433A |
To providing a manufacturing method for a grinding tool for removing an insulating layer and solder chips from an IC socket. The manufacturing method for the grinding tool has a plurality of hemispherical projections made of rubber conta...
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JP2001101985A |
To provide a luminous display that reduces the Likelihood of pollution between an anode and a cathode, with gap setting and positioning between the cathode and the anode easily executed at the same time. The luminous display has an elect...
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JP2001088041A |
To improve the performance of grinding for the practical application of share mode grinding to a fragile material. This is a grinding tip to execute grinding relatively moving in a grinding direction parallel with a surface of a workpiec...
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JP3128088B2 |
PURPOSE: To perform evaluation of performance adapted to the actual using state of a binder for the grinding grain layer of a super grain grinding wheel without performing an actual polishing test. CONSTITUTION: A test piece S formed of ...
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JP2001500434A |
A molded bonded abrasive grinding wheel adapted for relatively rough grinding operations is provided with a plurality of protuberances spaced in a predetermined pattern along the peripheral surface thereof and extending substantially ort...
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JP2000515567A |
The present invention is directed to compositions for use as additives in the automotive industry, which compositions contain waste powder prime and a plasticizer selected from the group consisting of 2-ethylhexyl diphenyl phosphate, dii...
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JP3110710B2 |
To provide a dressing material for grinding wheel and manufacture thereof in the ground chip of whose pellet impurities are not mixed. In a first process, the raw material powder of uranium dioxide is compressed and formed by a forming p...
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JP3108094B2 |
A product and a process for producing a matrix and a tool for use in abrasive or cutting applications including a base tool structure which may be armed with a plurality of triangular or conically shaped structures 24B consisting of abra...
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JP2000280176A |
To realize a working surface of high quality by including the solid reducing agent for reducing the metal powder of a conductive grinding wheel including the metal powder, resin and abrasive grains. A mixture of metal powder, resin, abra...
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JP3080305B2 |
An abrasive grit for a metal bonded Single Layer abrasive tool includes abrasive grains coated with a first active component. The active component is mechanically-bound to the surface of the superabrasive grains. Preferably the abrasive ...
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JP3081912B2 |
To facilitate the control of array interval of grain by arraying non- magnetic material within a surface or in three dimensions by applying dc magnetic field which is horizontal and uniform for a magnetic recording medium surface or appl...
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JP3078020B2 |
A wire-saw used for cutting an electronic or optical material and its manufacturing method. Abrasive grains (3) whose particle diameters are not less than 2/3 of the thickness of a resin bonding layer (5) and not larger than 1/2 of the d...
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JP2000510054A |
An abrasive tool for cutting, drilling, milling or the like, including a diamond grain positioning structure (2) attached to the circumference of a holder (6). A skeleton with open pores (12) in the outer surface thereof is provided in s...
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JP2000218504A |
To obtain a favorable wafer cut surface and also machine efficiently at a low cost, in the cutting by the wire with fixed abrasive grains. In this cutting method, the wire with fixed abrasive grains, in which the abrasive grains having a...
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JP2000210853A |
To provide a deburring method and a deburring tool to be used, capable of deburring a part entirely at one time so as to be free from burrs with its rotation made higher in speed than a conventional one. Burrs generated by a work W are r...
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JP2000176843A |
To simply inject-mold a core for a supporting structure or a polishing tool by making the back face of a perforated sheet adjacent to the surface of the core, making the back face of another perforated sheet adjacent to the another surfa...
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JP2000507165A |
An abrasive body for grinding optical glass, precious and natural stones (marble) or other materials such as wood, metal, plastics or the like, consists of a base body (3) made of a woven, knitted or embroidered fabric made of carbon fib...
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JP2000506452A |
A method of preparing an abrasive article, and the article produced therefrom is provided. The method includes the steps of: providing a backing having a first major surface; coating the first major surface of the backing with a tie coat...
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JP3016588B2 |
A composite material is formed of a carrier having a cellular structure and diamonds or other hard, abrasive particles received within the cellular structure. A matrix material holds the diamonds in the carrier, and the matrix material m...
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