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WO/2020/018555A1 |
This invention relates to polymer-based parti ally-open, hollow reservoirs in the nano-size to micro-size range that encapsulate an additive, which can be released from the reservoirs using specific event stimuli such as reduction-oxidat...
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WO/2020/017481A1 |
This resin sheet is formed from a resin composition that contains a thermosetting component (A). The resin sheet is characterized in that the thermosetting component (A) contains a compound having a maleimide resin (A1) and a triazine sk...
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WO/2020/016954A1 |
The resin varnish according to one aspect of the present invention comprises a polyimide precursor which is a product of reaction between aromatic tetracarboxylic dianhydrides and an aromatic diamine, wherein the polyimide precursor has ...
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WO/2020/017697A1 |
The present invention provides a polyimide film including: a polyimide resin; a fluorine-containing silane additive; and carbon black. The polyimide film contains 2.7 parts by weight to 10 parts by weight of the fluorine-containing silan...
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WO/2020/013980A1 |
A composite has repeating domains of an inorganic glass and a polymer, such that the inorganic glass and the polymer each have a glass transition temperature (Tg) or softening temperature of less than 450oC, and at least 50% of the inorg...
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WO/2020/009001A1 |
The present invention addresses the problem of providing a resin composition for obtaining a cured product that has excellent environmental suitability, high strength and good flame retardance, said resin composition suitably being used ...
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WO/2020/006710A1 |
Polyethylenimine coated polymeric beads comprising a polymer that comprises, based on the weight of the polymer, from 25% to 75%by weight of structural units of an acetoacetoxy or acetoacetamide functional monomer, and from 25% to 75%by ...
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WO/2020/009911A1 |
A black-color polymer composite film comprising a phthalocyanine compound dispersed in a polymer selected from the group consisting of polyimide, polyamide, polyoxadiazole, polybenzoxazole, polybenzobisoxazole, polythiazole, polybenzothi...
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WO/2020/004415A1 |
Provided is a method for manufacturing a glove, including (1) a step for dipping a glove molding die into a coagulant solution including calcium ions and causing the coagulant to adhere to the glove molding die, (2) a dispersing step for...
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WO/2020/000968A1 |
The present invention relates to the technical field of new materials and provides a dianhydride compound having a rigid alicyclic fluorine-containing structure, a preparation method therefor and an application thereof. The preparation m...
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WO/2020/004440A1 |
Provided are the following: a phosphazene compound-containing polyimide resin composition which exhibits excellent molding processing properties and high thermal stability and does not undergo bleeding out; and a molded body of same. The...
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WO/2019/245054A1 |
The present invention addresses the problem of inexpensively providing a polyimide resin composite material which has all of high unsusceptibility to deformations, e.g., warpage, high image clearness, and high transparency and is suitabl...
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WO/2019/246233A1 |
Disclosed is a polyimide film, where the polyimide has a weight average molecular weight of at least 100,000, and includes a repeat unit structure of Formula (V). In Formula (V): Ra is the same or different at each occurrence and represe...
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WO/2019/246235A1 |
Disclosed is a diamine having Formula (I). In Formula (I), Q is a group having a spiro atom; R7 and R8 are the same or different at each occurrence and are F, CN, alkyl, fluoroalkyl, hydrocarbon aryl, heteroaryl, alkoxy, fluoroalkoxy, ar...
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WO/2019/239865A1 |
Provided is a polymer blend film that can be easily peeled from a resin film which is a substrate, that has a high heat resistance and transparency, and that shows little warping. The polymer blend film contains 0.1 to 15 parts by mass o...
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WO/2019/240092A1 |
A thermosetting resin composition for a semiconductor sealing material contains a polyimide compound obtained by copolymerizing at least a compound having two or more N-substituted maleimide groups and a compound having two or more amino...
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WO/2019/241046A1 |
A polybenzimidazole (PBI) resin including a polybenzimidazole oligomer having at least two reactive end groups is provided. Also provided is a method of making a polybenzimidazole oligomer with at least two reactive end groups including ...
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WO/2019/235712A1 |
The present invention provides a siloxane compound having a novel structure, the compound not being reactive with a polyamic acid which is a polyimide precursor. In addition, provided is a polyimide precursor composition having improved ...
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WO/2019/231100A1 |
The present invention relates to a poly(amide-imide) resin film and, more particularly, to a poly(amide-imide) resin film comprising a poly(amide-imide) block copolymer of a specific structure and having a low yellow index, and a manufac...
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WO/2019/230943A1 |
Provided are: a resin composition that can achieve a printed wiring board having a low dielectric constant and a low dielectric loss tangent and having excellent alkali resistance and excellent desmear resistance; and a prepreg, a resin ...
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WO/2019/231875A1 |
Anaerobic paste compositions and uses are disclosed. The anaerobic paste compositions remain stable at room temperature for a prolong time without phase separating, making these compositions particularly well suited for long term storage...
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WO/2019/230942A1 |
Provided is a resin composition whereby a cured material having excellent copper foil adhesion and low dielectric characteristics can be formed. A resin composition including a thermoplastic polymer (A) including any one or more groups f...
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WO/2019/230944A1 |
A resin composition which contains: (A) a maleimide compound having no siloxane bond; (B) an unmodified cyanic acid ester compound; and at least one compound selected from the group consisting of (C1) elastomers having a styrene content ...
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WO/2019/230047A1 |
[Problem] The present invention addresses the problem of providing: a thermoplastic elastomer composition that contains a polar rubber having crosslinks, that optionally contains an olefin polymer, that has the components highly disperse...
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WO/2019/230945A1 |
A resin composition which contains (A) a maleimide compound, (B) a cyanic acid ester compound, (C) a polyphenylene ether compound which is represented by formula (1) and has a number average molecular weight of from 1,000 to 7,000 (inclu...
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WO/2019/225166A1 |
The purpose of the present invention is to provide an active ester compound which can be used in a curable resin composition having excellent heat resistance and dielectric characteristics. The purpose of the present invention is also to...
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WO/2019/225760A1 |
A moisture-proof material that includes a resin having tackiness of 0.5 kN/cm2 or more at 25°C, and viscosity of 100 Pa∙s or less in at least a portion of the range from 60-150°C.
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WO/2019/225884A1 |
The present invention relates to a separator for a lithium-sulfur battery and a lithium-sulfur battery including same and, more specifically, to a separator for a lithium-sulfur battery, the separator including: a porous substrate; and a...
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WO/2019/221343A1 |
The present invention provides a polyimide film comprising: an aliphatic polyimide resin; an aromatic polyimide resin; and microspheres having pores, wherein the aliphatic polyimide resin comprises at least one of an acyclic aliphatic hy...
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WO/2019/220967A1 |
The present invention is a polyimide powder composition containing powdered thermoplastic polyimide resin (A) and silica particles (B) having a volume average particle size D50 of 90 nm or less.
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WO/2019/218027A1 |
The application relates to a core-shell particle having a) a cross-linked polyelectrolyte core, and b) a silica-based shell having covalently bound thereto one or more groups of formula –R–F, wherein R is an organic group and F is a ...
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WO/2019/220969A1 |
A resin molding that comprises a polyimide resin (A), said polyimide resin (A) containing a repeating structural unit represented by formula (1) and a repeating structural unit represented by formula (2), having a content ratio of the re...
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WO/2019/221402A1 |
The present invention relates to a liquid crystal alignment composition, a method of preparing a liquid crystal alignment film using same, and a liquid crystal alignment film and a liquid crystal display using same, and more particularly...
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WO/2019/220966A1 |
A polyimide resin composition obtained by mixing a polyimide resin (A) with glass fibers (B), the polyimide resin (A) comprising repeating constituent units represented by formula (1) and repeating constituent units represented by formul...
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WO/2019/221364A1 |
The present invention can provide a substrate for a flexible display device, the substrate having a positive CTE value without deterioration in heat resistance even at a temperature of 350℃ or higher, by providing a polyimide obtained ...
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WO/2019/220968A1 |
The present invention is a polyimide resin composition which contains: (A) a polyimide resin which contains a repeating constituent unit represented by formula (1) and a repeating constituent unit represented by formula (2), and which is...
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WO/2019/221572A1 |
The present invention relates to a polyamide-imide resin film and, more particularly, to: a polyamide-imide block copolymer comprising 10-50 wt% of fluorine atoms and having low moisture-causing dimensional change; and a polymer resin fi...
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WO/2019/221342A1 |
The present invention provides a polyimide film comprising a polyimide resin, 5 or more parts by weight of a bismaleimide resin on the basis of 100 parts by weight of the polyimide resin, and carbon black.
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WO/2019/210685A1 |
Disclosed is a polyaniline conductive thin film, made from the following raw materials in parts by weight: 3-4 parts of stearic acid, 120-140 parts of aniline, 3-5 parts of an initiator, 1-2 parts of dodecyl mercaptan, 1-2 parts of a dop...
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WO/2019/211972A1 |
This polyimide resin has constituent unit A derived from a tetracarboxylic acid dianhydride and constituent unit B derived from a diamine, wherein constituent unit A includes a constituent unit (A-1) derived from a compound represented b...
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WO/2019/208611A1 |
The purpose of this invention is to provide an optical film which combines excellent feeding out stability and excellent film appearance, when suitably used as an optical film in an image display device. The optical film contains at leas...
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WO/2019/208129A1 |
This thermosetting composition comprises a thermosetting compound and hexagonal boron nitride D. The thermosetting compound comprises a cyanate ester compound A and/or a maleimide compound B and a modified polyphenylene ether C having, o...
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WO/2019/208587A1 |
A resin composition which contains, as mentioned in the description of the present application, a polyimide precursor that contains a structural unit represented by general formula (1) and a structural unit represented by general formula...
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WO/2019/208610A1 |
The purpose of this invention is to provide an optical film having excellent visibility when suitably used as an optical film in an image display device. The optical film contains at least one substance selected from the group consisting...
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WO/2019/203037A1 |
A polymer blend composition according to the present invention is a polymer blend composition containing two or more types of polyimides, wherein: said polyimides each have a non-cyclic group having electron-withdrawing properties in a s...
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WO/2019/203178A1 |
A heat-conducting layer that contains at least one type of filler, has thermal diffusivity of 5.0 x 10-7m2s-1 or higher, and has volume resistivity of 1.0 x 1011 Ω∙cm or higher is used. The present invention also relates to a photosen...
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WO/2019/202853A1 |
In this invention, a liquid crystal alignment agent contains a polymer (P) having at least one species selected from the group consisting of partial structures represented respectively by formula (1) to formula (4). In formula (1), R1 re...
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WO/2019/199233A1 |
The present invention relates to an enzyme-containing polymer of 2-amino monosaccharide, preferably an enzyme- containing chitosan, comprising: a first repeating unit of the following Formula la: a second repeating unit of the following ...
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WO/2019/199032A1 |
The present invention relates to a thermosetting resin composition for a semiconductor package, a prepreg, and a metal-clad laminate and, more specifically, to a thermosetting resin composition for a semiconductor package, the thermosett...
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WO/2019/199033A1 |
The present invention relates to a thermosetting resin composite for a metal clad laminate and a metal clad laminate and, more specifically, to a thermosetting resin composite for a metal clad laminate having a predetermined thermal stre...
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