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JP2008056868A |
To provide a thermosetting filmy adhesive composition which is excellent in adhesion and thermal resistance, can form a sealing composition capable of being packed into fine clearances and does not form a cured product running off the ed...
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JP2008050421A |
To provide an adhesive having excellent preservation stability of an adhesive solution, and preservation stability of an adhesive sheet formed into a sheet in a semicured state, and further excellent adhesive strength at high temperature...
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JP2008045036A |
To provide an adhesive composition and an adhesive sheet, enabling adhesion at low temperatures, excellent in adhisivity and heat resistance, and useful in circuit boards in particular.A polyamide resin 80C or higher in glass transition ...
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JP4051716B2 |
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JP4048550B2 |
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JP2008031343A |
To provide a resin composition for adhesion excellent in bond strength, especially in bond strength to metals.The resin composition comprises (A) a polyvinyl butyral resin which has a solution viscosity of 30 mPa s or less at 20C when th...
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JP2008024851A |
To provide a new biodegradable composition excellent in hydrolyzable property, and a molded article and use of the same.This biodegradable composition is characterized by containing (A) a block or graft copolymer having a constituting un...
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JPWO2005090509A1 |
Provided is a film-like adhesive which does not have adhesiveness and tackiness at room temperature and can be handled as a film, melts by heating, adheres to an adherend, and exhibits adhesiveness by light irradiation. (A) Urethane (met...
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JP4038838B2 |
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JP2008001760A |
To provide an adhesive resin composition improving bondability between a layer constituted from a cycloolefin resin and a layer constituted from another thermoplastic resin.The adhesive resin composition is one for bonding a layer consti...
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JP4023920B2 |
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JP2007321083A |
To provide an adhesive which is excellent in curability and also in adhesive force at a high temperature and high humidity and solder heat resistance, and is suitably applicable to a flexible printed wiring board. The adhesive contains a...
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JP4022294B2 |
To obtain a transfer image having a high washing resistance by forming a recorded image having a high water resistance by an ink jet type and thermally transferring the image to a material to be transferred. In the thermal transfer sheet...
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JP4019524B2 |
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JP4017532B2 |
To provide an excellent contact bonding post card paper sheet for inkjet recording in which basic adhesive characteristics as a contact bonding post card paper sheet are satisfied, and dispersion condition of an adhesive for the contact ...
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JP4013244B2 |
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JP4013091B2 |
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JP2007533817A |
Method for making lignocellulosic composites by adhering lignocellulosic substrates together. A first variant of the method involves using an adhesive composition that comprises a reaction product of (i) first ingredient selected from a ...
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JP2007302860A |
To provide a resin composition having good adhesiveness and curable by heat or light; and to provide an adhesive, an adhesive sheet or an adhesive tape using the resin composition. The resin composition contains at least (A) a copolymer ...
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JP2007254719A |
To provide a base material for thermal adhesion having excellent properties in both flame retardance and adhesion, which is excellent in flexibility and shape-forming property to a mold, which has excellent adhesion and capable of being ...
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JP2007527933A |
The invention relates to adhesion promoters for plastisols based on polyaminoamides, characterized in that the adhesion promoter comprises not only a polyaminoamide but also at least 10% by weight, and at most 60% by weight, based on the...
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JP2007227950A |
To provide a lead frame with an adhesive film for semiconductor which can adhere at a low temperature, in a semiconductor device. The adhesive film for semiconductor has a three-layer structure consisting of a support film with a glass t...
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JP2007523969A |
The present invention relates to epoxy adhesive resins containing a curative comprising a polyamine, a polyamide, dicyandiamide and an imidazole. The adhesives are useful in structural applications for assembling parts for automobiles, a...
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JP2007204598A |
To provide a resin composition having excellent adhesion to various kinds of substrates, heat resistance and flame retardance, and providing a cured product having both of flexibility and high modulus of elasticity, and useful as a mater...
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JP3951548B2 |
To provide a new TAB tape with superior adhesive property, warpage, and wire bonding property, and to provide a semiconductor device using it. The adhesive sheet for a semiconductor device having a laminated body consisting of at least o...
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JP3951418B2 |
To provide a tape with adhesive for a semiconductor device having superior high adhesiveness and high insulation, and a substrate for connecting a semiconductor using the tape, and a semiconductor device. This tape with an adhesive for t...
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JP3945481B2 |
An IC card which comprises an IC substrate, a hot-melt resin layer, and a skin material and in which these three layers are tenaciously bonded to each other and are less apt to peel off. The IC card is capable of deep embossing. Problem ...
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JP3945642B2 |
To provide a cover lay which exhibits high temperature resistance and does not contain halogen components. In the cover lay, adhesive agent formulation is applied on a polyimide film and dried, and the formulation is composed of a nitrog...
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JP2007176996A |
To provide a waterstop sealing material which excels in the interfacial adhesion between the waterstop sealing material constituted of a foam structure having closed cells and a target structural member for the water to be shut off, make...
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JP3932999B2 |
To provide a tape having a semiconductor-oriented bonding agent which excels in its punched quality and has high bonding quality, a board using the tape and for connecting semiconductor integrated circuits, and a semiconductor device. Th...
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JP2007508405A |
Interlining with a double dot for the coating and/or lamination of sheetlike structures, wherein upper dot and lower dot are based on an amine-terminated, crosslinkable copolyamide and the lower dot further comprises a crosslinker and an...
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JP2007508463A |
Interlining with a double dot for the coating and/or lamination of sheetlike structures, wherein upper dot is based on an amine-terminated, crosslinkable copolyamide and the lower dot is of an OH-terminated copolyester and further compri...
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JP3899760B2 |
To provide a polyamino acid composition excellent in moisture- absorbent and dissipating properties and moreover having swelling properties, which composition can impart a hand (touch) close to that of natural materials to a synthetic re...
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JP3892107B2 |
To obtain a hot-melt adhesive composition suitable for adhesion between the same kind of metals, different kinds of metals, a metal and any of various synthetic resins, the same or different kinds of various synthetic resins, any of vari...
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JP2007051272A |
To obtain a conductive adhesive that has high heat resistance and excellent adhesivity to metal.The conductive adhesive comprises an organic-inorganic hybrid resin or an ultrahigh molecular weight polyamide as a base. The organic-inorgan...
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JP2007045923A |
To provide a multilayer adhesion sheet wherein breaking at a connection part by breaking a resin is not observed and also moldability is excellent.The multilayer adhesion sheet is composed of a metal sheet on at least one surface of whic...
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JP2007503478A |
The invention relates to the use of an adhesive film for bonding a chip module in a card body. Said adhesive film comprises at least two adhesive layers (i) and (ii), which differ chemically from one another.
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JP3871268B2 |
The present invention provides a magnetic core whose outer surface has been coated without handling brittle ribbon to thereby impart insulating properties and shape retention properties to the magnetic core after annealing heat treatment...
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JP2007009075A |
To provide an adhesive composition for artificial marble exhibiting high peel strength to the artificial marble and excellent in rapid curability even at low temperatures.The adhesive composition for artificial marble comprises 100 pts.w...
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JP3860395B2 |
To provide an adhesion assistant effective for a multilayered composite capable of keeping the adhesion of layers over a long time in the contact with a reagent at high temp. and capable of being produced inexpensively and simply. A ther...
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JP2006524910A |
A structural unit having a frame, a connecting face that surrounds an opening and a cover that is attached to the connecting face to cover the opening. The frame and the cover are formed of materials with different coefficients of therma...
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JP2006295064A |
To provide an adhesive film for a semiconductor which has high adhesive properties to a lead frame which is subjected to a surface process such as an organic film coating, etc. , and can simply be peeled off from the lead frame and a sea...
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JP2006282973A |
To provide an adhesive film which exhibits good adhesiveness at a low temperature and good good wire bonding property in combination.The adhesive film is an adhesive film used for adhering a semiconductor device to a body to be adhered, ...
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JP3834592B2 |
To provide an adhesive film which, when a flat film on which a plurality of coated wires are mounted is heat-sealed, can arrange and hold the coated wires flatly without detriment to the necessary adhesiveness and flexibility. An adhesiv...
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JP2006274248A |
To provide a tape with an adhesive for semiconductor devices which prevents the breakage of a copper foil on bonding an inner lead and can improve the productivity of semiconductor devices.The tape with an adhesive for semiconductor devi...
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JP3824651B2 |
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JP3824512B2 |
To provide a method for producing a hot-melting sheet having air permeability and water repellency. A fiber sheet 3A is impregnated with an aqueous solution of a water repellent and then, an aqueous dispersion of hot-melting adhesive pow...
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JP3811120B2 |
To provide an adhesive tape for a semiconductor device which has superior wire-bonding properties. The adhesive tape for a semiconductor device is such that a thermosetting adhesive layer is formed at least on one face of an insulation f...
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JP3804260B2 |
To provide a tape with an adhesive for a semiconductor device, having superior high adhesiveness and high insulation, and a substrate for connecting a semiconductor using this tape, and a semiconductor device. This tape with an adhesive ...
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JP3795086B2 |
PCT No. PCT/EP97/02796 Sec. 371 Date Nov. 25, 1998 Sec. 102(e) Date Nov. 25, 1998 PCT Filed May 28, 1997 PCT Pub. No. WO97/45461 PCT Pub. Date Dec. 4, 1997Thermally curable mixtures of hydroxyalkylated polyamines and polycarboxylic acids...
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