| Document |
Document Title |
|
JP2011144260A |
To provide an adhesive containing a polyimide resin composition and having light color, flexibility and heat-resistance and to provide an adhesive tape produced by using the adhesive.There are provided: the adhesive produced by ultraviol...
|
|
JP4734867B2 |
|
|
JP4734800B2 |
|
|
JP4732644B2 |
A skin-compatible, hot-melt processible, pressure sensitive adhesive is disclosed. A thermo-reversible cross-linking is achieved, permitting advantages in processibility and the reduction of waste.
|
|
JP4728474B2 |
|
|
JP2011137149A |
To provide a transparent film-like adhesive of excellent heat resistance (including cold resistance) and transparency, with an excellent bonding force.This transparent film-like adhesive contains, as a main component, a polyimide resin c...
|
|
JP4725704B2 |
|
|
JP4709339B2 |
To obtain an electrical-insulating heat-conductive adhesive capable of effectively dissipating heat generated from parts of semiconductor elements, power sources, light sources and the like which are used in electric appliances, a bondin...
|
|
JP4704082B2 |
|
|
JP2011517324T |
Resist covering and in order to more specifically attain the good adhesiveness to the copper substrate of optical image formation type resist covering, it is securing not damaging a very thin copper substrate, The hetero cyclic compound ...
|
|
JP4691555B2 |
A material for use in flexible printed wiring board having high reliability and allowing for processing fine wiring includes a compound represented by the following general formula (I): wherein one of X and Y represents O and the other r...
|
|
JP2011516658A |
This invention is an adhesive film comprising (a) a top layer that is substantially UV curable and that has a glass transition temperature of 50°C or less; and (b) a bottom layer that is substantially not UV-curable. Additional embodime...
|
|
JP2011516658T |
The present invention is the top layer which is UV hardenability and has the glass transition temperature of 50 ℃ or less on (a) real target, and an adhesives film which contains in (b) real target the bottom of the heap which is not U...
|
|
JP4689854B2 |
|
|
JP4686798B2 |
To obtain a film excellent in cutting properties and generating neither burrs nor scraps when cut off by forming as an adhesive layer a layer comprising a polyamideimide resin having copolymerized therewith a dimer acid and having a loga...
|
|
JP4686799B2 |
|
|
JP4678138B2 |
|
|
JPWO2009072492A1 |
A photosensitive adhesive that has adhesiveness to an adherend after being patterned by exposure and development and is capable of alkaline development, and exposes and exposes the photosensitive adhesive 1 provided on the circuit surfac...
|
|
JP2011074110A |
To provide an adhesive composition, an adhesive film and an adhesive tape excellent in adhesiveness at ambient temperature, heat resistant adhesiveness, adhesiveness at ambient temperature after left at high temperature, and heat resista...
|
|
JP4670165B2 |
|
|
JP4671083B2 |
|
|
JP4670980B2 |
|
|
JP4666703B2 |
|
|
JP4658735B2 |
To provide an adhesive composition capable of being formed into a cured product having a low elastic modulus and excellent adhesion and heat resistance, and to provide an adhesive film given by using the composition. This adhesive compos...
|
|
JP2011042730A |
To provide an adhesive composition that is sufficiently good in any of low-temperature adhesiveness, fluidity when heated, and reliability after heat curing, and a film-shaped adhesive, an adhesive sheet, and a semiconductor device using...
|
|
JP2011043805A |
To provide a new composition whose complication of handling caused by an odor of a solvent, that is workability is improved and in which a maleimide polymer is uniformly dissolved in the composition containing the maleimide polymer.In th...
|
|
JP4640560B2 |
Disclosed is a solution of a hot melt adhesive which comprises an organic solvent and a fully imidized polyamideimidesiloxane. The polyamideimidesiloxane is the reaction product of dianhydride monomer with diamine monomer. About 0.5 to a...
|
|
JP4644415B2 |
To provide a non-silicone-based releasing agent composition providing a release sheet having good release property to an uncured polyimide-based adhesive layer, a release sheet for polyimide-based adhesive and an adhesive laminate. The r...
|
|
JP4639752B2 |
|
|
JP4627258B2 |
|
|
JP4625458B2 |
Disclosed in an adhesive film which enables to obtain a flexible metal clad laminate which is suppressed in dimensional change when produced by heat roll lamination. Such an adhesive film comprises a heat-resistant layer containing a hig...
|
|
JP2011018767A |
To provide a tape for assembling a semiconductor product capable of suppressing even the risk of adhesive deposit, while suppressing the risk of deteriorating adhesiveness between a semiconductor chip and a die pad surface and the adhesi...
|
|
JP4617848B2 |
|
|
JP4620834B2 |
|
|
JP4612292B2 |
|
|
JP4604682B2 |
To provide a polyurethane imide resin and an adhesive composition containing thereof which are excellent in the adhesive strength and are suitable for an adhesive for use in circuit-connecting or semiconductor-mounting. The polyurethane ...
|
|
JP4608168B2 |
Diethyloctandiol dicarbamate and diethyloctandiol diallophanate positional isomers are new.
|
|
JP2010539293A |
Provided are adhesive compositions comprising a mixture of a maleimide terminated polyimide resin, a thermoplastic resin compatible with the maleimide terminated polyimide resin, a liquid rubber, and a thermally activated free radical cu...
|
|
JP4600704B2 |
|
|
JP4590732B2 |
|
|
JP2010267579A |
To provide a conductive adhesive forming highly reliable junction of a semiconductor device, and having excellent adhesiveness, electrical conductivity, thermal conductivity, and relaxing thermal stress, and to provide a method of manufa...
|
|
JP2010265376A |
To provide a laminated product that exhibits good vacuum formability, has good elasticity, sealability and the like due to lamination with a rubber or an elastomer, and exhibits good adhesive properties and adhesion durability to a flexi...
|
|
JP2010265338A |
To provide an adhesive composition giving an adhesive cured layer having high adhesion force to various substrates and useful for stably manufacturing semiconductor devices of high reliability, and to provide an adhesive sheet and a dici...
|
|
JP4586966B2 |
To provide an adhesive composition excellent in adhesivity and heat resistance and capable of yielding a low-modulus cured product, and to provide an adhesive film using the composition. The adhesive composition essentially comprises (A)...
|
|
JP4584028B2 |
To provide an adhesive film for bonding semiconductor dies which generates a smaller amount of outgas than in the case of using silver paste in soldering process at 260°C, and exerts strong adhesive power. The adhesive film is formed by...
|
|
JP2010254808A |
To provide a heat-resistant adhesive composition for temporarily fixing a wafer which is suitable for the application in which a silicon wafer is temporarily fixed to a holding material, has achieved excellent adhesiveness between the ho...
|
|
JP4577895B2 |
To provide an adhesive composition excellent in bonding property, and giving a cured material having a low elastic modulus and excellent in heat resistance, and an adhesive film equipped with the adhesive layer. This adhesive composition...
|
|
JP2010238852A |
To provide a tape for manufacturing a semiconductor, which has excellent balance between low-temperature adhesion and solubility into an alkaline solvent, and to provide a method for manufacturing a semiconductor device.The tape 1 for ma...
|
|
JP2010229274A |
To provide a resin composition having low thermal expansion, high heat resistance, low-temperature melting property and flexibility in a film state, and to provide an adhesive for electronic parts.The resin composition contains at least ...
|
|
JP4562821B2 |
|
