| Document |
Document Title |
|
JP5293182B2 |
A thermosetting polyimide resin composition which, when used in an adhesive layer of a metal-clad laminate, is able to be manufactured by only the solvent removal without requiring an imidation step reaching 300°C or higher and is therm...
|
|
JP5292793B2 |
To provide an adhesive sheet for a semiconductor, which is free of a scratch and contamination, so that alignment mark recognition of a semiconductor device never ends in failure. The adhesive sheet for the semiconductor contains (a) org...
|
|
JP5293496B2 |
To provide an adhesive composition for bonding an electronic part such as a semiconductor element to a lead frame or an insulation supporting substrate and durable to the thermal history of the high-temperature soldering upon mounting an...
|
|
JP5287247B2 |
A polyamide-imide resin obtained by a process comprising the step of reacting an aromatic diisocyanate with a diimide dicarboxylic acid containing 40 mol% or more of a compound represented by the following general formula (1) and 20 mol%...
|
|
JP5281568B2 |
Heat-resistant polyimide copolymers having the following four components: pyromellitic dianhydride (PMDA), 1,4-diaminodiphenyl ether (DADE), biphenyltetracarboxylic dianhydride (BPDA), and 2,4-diaminotoluene (DAT) are provided. In an emb...
|
|
JP5279825B2 |
A microchip plate made such that polymer substrates made, in particular, of a cycloolefin polymer (COP) or a cycloolefin copolymer (COC) can be appropriately bonded to each other and a process for producing the microchip plate are provid...
|
|
JP5278785B2 |
There is provided a thermosetting polyimide resin composition which enables production of a cured product exhibiting excellent dimensional stability and which exhibits excellent meltability at low temperature in a semicured state (in the...
|
|
JP5276152B2 |
To provide a resin composition excellent in strength, low thermal expansion and heat resistance, having sufficient high frequency characteristics and further enabling to sustain the high frequency characteristics with time; and various p...
|
|
JP5270865B2 |
To provide a polyimide resin with high transparency useful as a circuit material, excellent in warpage-proof property, soluble in an organic solvent of a low boiling point and capable of being imidized at a low temperature, and a polyami...
|
|
JP2013147638A |
To provide a thermosetting resin composition curable at about 170°C while having excellent heat resistance.A thermosetting resin composition includes (A) a cyanate ester compound, (B) a curing catalyst containing palladium (Pd), (C) a p...
|
|
JP5251508B2 |
A laminate of the present invention is a laminate having a metal foil on one side or both sides of a heat resistant film in which the metal foil is laminated on the heat resistant film via a cured layer of a terminal-modified oligomer ob...
|
|
JP5233032B2 |
The present invention provides a semiconductor chip protection film which comprises a substrate film and a protection layer which is provided at one side of the substrate film, wherein the protection layer comprises (A) 100 mass of at le...
|
|
JP5224121B2 |
|
|
JP5225853B2 |
The die bonding resin paste of the invention comprises a polyurethaneimide resin represented by the following general formula (I), a thermosetting resin, a filler and a printing solvent. [wherein R1 represents a divalent organic group co...
|
|
JP5217408B2 |
To provide an adhesive composition that can obtain both cold working properties and heat resistance (high temperature adhesion) and is excellent in moisture-resistant reliability. The adhesive composition for adhering a semiconductor ele...
|
|
JP5209155B2 |
A resin composition including from about 1 to about 100 weight percent of a thermoplastic oxazolidone ring-containing compound having a molecular weight of at least 5000, which is the reaction product of:a) from about 20 to about 43 weig...
|
|
JP2013110422A |
To provide an adhesive for electronic components which minimizes generation of voids and is less likely to crawl up to the top face of a semiconductor chip, and to provide a manufacturing method of a semiconductor chip package using the ...
|
|
JP5201181B2 |
Disclosed are an adhesive composition containing a resin having piperazine skeletons, a circuit connecting structure, a semiconductor device, and an adhesion improvement agent for glass.
|
|
JP2013100451A |
To provide a thermal delamination type sheet excellent in durability at high temperatures.This thermal delamination type sheet has a thermal curing rate of 80% or more. Moreover the thermal delamination type sheet includes a polyimide re...
|
|
JP2013100512A |
To provide a supramolecular polymer having units which are linked to each other by hydrogen bonds.The units are monomers or prepolymers comprising at least one group selected from specific groups containing nitrogen and a second group se...
|
|
JPWO2011089922A1 |
Aromatic diamine (A) represented by the general formula (1-1), silicone diamine (B) represented by the general formula (2), and aliphatic diamine (C) represented by the general formula (3). A polyimide resin composition containing a poly...
|
|
JP2013098443A |
To provide an excellent semiconductor adhesive sheet which is capable of picking up a semiconductor element with an adhesive agent layer without fail even if there is heat storage of a collet.A semiconductor adhesive sheet is configured ...
|
|
JP2013075254A |
To provide a method for manufacturing an adhesive applied polyimide film capable of taking up the adhesive applied polyimide film without generating wrinkles, not requiring the stretching process in the TD direction immediately before la...
|
|
JP2013075972A |
To provide a polyester-polycarbodiimide copolymer having both excellent hydrolysis resistance and bending processibility, and to provide the copolymer-containing resin composition useful for an adhesive, coating material or coating.The p...
|
|
JP5186706B2 |
A photosensitive adhesive composition comprising: (A) a polyimide having a carboxyl group as a side chain, whereof the acid value is 80 to 180 mg/KOH; (B) a photo-polymerizable compound; and (C) a photopolymerization initiator.
|
|
JP2013067728A |
To provide a pressure-sensitive adhesive that has adhesion at normal temperature, can be adhered to an adherend with a light pressure, and has high heat resistance.A pressure-sensitive adhesive composition includes: a polyimidesiloxane t...
|
|
JP2013068797A |
To provide a photosensitive adhesive composition being excellent in developability, photosensitive characteristics such as adhesion to silicon, glass substrate or the like, and bond strength and being excellent in credibility of a cured ...
|
|
JP5183076B2 |
To provide an adhesive composition providing a cured product having excellent properties for filling a substrate having a fine circuit, laminate properties at low temperature, low modulus, adhesiveness and heat resistance; and to provide...
|
|
JP5180684B2 |
|
|
JP5180685B2 |
|
|
JP2013511412A |
The present disclosure is directed to a thin film transistor composition. The thin film transistor composition has a semiconductor material and a substrate. The substrate is composed of a polyimide and a sub-micron filler. The polyimide ...
|
|
JP5176076B2 |
A photosensitive adhesive composition that comprises (A) a resin with a carboxyl and/or hydroxyl group, (B) a thermosetting resin, (C) a radiation-polymerizable compound and (D) a photoinitiator, wherein the 3% weight reduction temperatu...
|
|
JP5166364B2 |
To provide a polyimide resin composition having a low temperature thermocompression bonding property and excellent in heat resistance and dimension stability.The polyimide resin composition includes a polyimide having a repeat structure ...
|
|
JP5163789B2 |
The present invention provides a circuit connecting material for electrically connecting a first circuit member having a first circuit electrode formed on a major surface of a first circuit substrate, and a second circuit member having a...
|
|
JP2013047355A |
To provide a new adhesive retainable of adhesiveness even under high temperature environment, and use thereof.This adhesive includes a condensation-based resin having a structural unit obtained by condensation-polymerizing polymerizable ...
|
|
JP5157255B2 |
To provide a photosensitive adhesive composition having the pattern formability by an alkali developer and satisfactory re-adhesivity after exposure as well, and to provide an adhesive film, an adhesive sheet and an adhesive pattern each...
|
|
JP5158397B2 |
|
|
JP2013507486A |
The present disclosure relates generally to filled polyimides that can be formed into films, fibers and other articles. The filled polyimide is useful in coverlay applications and has advantageous dielectric, mechanical and optical prope...
|
|
JP2013043925A |
To provide an adhesive resin composition free from the deterioration in adhesive force between a wiring layer and an adhesive layer even if repeatedly put under high temperature environment.The adhesive resin composition contains (A) a s...
|
|
JP2013040339A |
To provide an adhesive film having adhesiveness at low temperature and formable of a pattern by an alkali developing solution.The adhesive film 1 contains a resin having an imide backbone in a main chain, obtained by reacting tetracarbox...
|
|
JP5148760B2 |
Disclosed is an adhesive resin composition containing 100 parts by weight of component (a) which is a polyimide siloxane containing the structural units represented by general formula (1) and (2) (in the formula, Ar represents a tetraval...
|
|
JP5148758B2 |
|
|
JP2013032532A |
To provide a method for producing an adhesive film in dramatically high productivity compared with that of a conventional method.The method for producing an adhesive film includes laminating an adhesive layer containing thermoplastic pol...
|
|
JP5141366B2 |
|
|
JP5140996B2 |
To provide an adhesive composition which allows a fairly rapid curing at a low temperature and stably yields properties such as bonding strength and connection resistance and a circuit connection material, a connection structure of circu...
|
|
JP5134747B2 |
|
|
JP5130939B2 |
|
|
JP5133243B2 |
|
|
JP2013014703A |
To provide a sliding member capable of maintaining close adhesiveness under a usage environment, and a method for producing the sliding member.There is provided the sliding member 1 in which a metal base material 10 and a resin sliding l...
|
|
JP2013010895A |
To provide an insulating adhesive film that has low linear expansion, is excellent in wiring-embedding properties, and has high peeling strength.The insulating adhesive film comprises: a layer to be plated, which consists of a resin comp...
|
