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JP5454056B2 |
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JP5444986B2 |
To provide an adhesive composition for a semiconductor, the composition showing excellent dispersibility of inorganic particles and enabling an alignment mark on a circuit board or a semiconductor chip coated with the composition to be r...
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JP5447205B2 |
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JP5445455B2 |
The adhesive composition of the invention comprises (A) a thermoplastic resin with a Tg of no higher than 100°C and (B) a thermosetting component, wherein the (B) thermosetting component includes (B1) a compound with an allyl group and ...
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JP2014043511A |
To provide a polyimide film which can reduce the dimensional change in the film width direction (TD) and reduce the dimensional change during high-temperature processing while keeping a thermal expansion coefficient approximate to metal,...
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JP5439842B2 |
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JP5437802B2 |
Provided are adhesive compositions comprising a mixture of a maleimide terminated polyimide resin, a thermoplastic resin compatible with the maleimide terminated polyimide resin, a thermally activated free radical curing agent, and elect...
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JP5439818B2 |
To provide an adhesive composition highly satisfying low-temperature adhesiveness and reflow resistance. The adhesive composition includes a thermoplastic resin (A) and a thermosetting component (B), wherein the thermosetting component (...
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JP5439841B2 |
To provide an adhesive composition that highly satisfies low temperature processability (low temperature adhesiveness) and reflow resistance, and is sufficiently cured by a thermal history received in an assembling process after die bond...
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JP5439863B2 |
To provide an adhesive for semiconductor sealing capable of sufficiently suppressing the generation of voids accompanying high temperature heating and showing sufficiently high imbedding property, and capable of manufacturing a semicondu...
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JP5434240B2 |
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JP5427865B2 |
A novel organic insulating film, which is continuously manufactured and has specific properties over the entire width an adhesive film, a flexible metal plated stacked board, a multiplayer flexible metal-plated stacked board, a coverlay ...
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JP5422878B2 |
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JP5411103B2 |
A semiconductor assembly comprising a semiconductor chip on a substrate is adhered to the substrate using a dual cure B-stageable adhesive comprising two chemical compositions, (i) a first composition comprising a curable monomeric or po...
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JP5409373B2 |
Curable compositions, such as benzoxazine-based ones together with core shell rubbers, are useful in applications within the aerospace industry, such as for example as heat curable composition for use as a matrix resin or an adhesive, an...
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JP5405273B2 |
To provide a polyimide resin composition that has high soldering heat resistance and high dimensional stability after curing while having low-temperature adhesion performance. A polyimide resin has a constituent unit represented by gener...
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JP2014502296A |
Described herein is the synthesis of adhesive from simple adhesive coacervates and their uses thereof. The adhesives are composed of (a) a polyanion in the absence of a polycation, wherein the polyanion comprises at least one crosslinkin...
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JP5398087B2 |
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JP5397378B2 |
A photosensitive adhesive composition that can form an adhesive layer on an adherend and allows an adhesive pattern to be formed by exposure treatment with radiation and developing treatment with a developing solution, the photosensitive...
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JP5397526B2 |
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JP5393791B2 |
The present invention relates to a process of making composite structures comprising applying an adhesive composition comprising a protein component, an azetidinium functionalized polymer component and a viscosity modifying component to ...
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JP5386159B2 |
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JP5367971B2 |
The present invention provides N,N'-dimethyl secondary diamine polymers including methylamine-terminated poly-(N-methylazetidine) and methylamine-terminated poly-(N-methylazacycloheptane). Amine compositions and amine-epoxy compositions ...
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JP5365762B1 |
It is a thermoplastic polyimide resin containing a repeating structural unit represented by the following formula (1) and a repeating structural unit represented by the following formula (2), and the repeating structural unit of the form...
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JP5362315B2 |
To provide a semiconductor sealing film-like adhesive having sufficient insulating reliability between wires and sufficient conductivity between a semiconductor chip and a substrate while suppressing the occurrence of void when connectin...
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JP2013245245A |
To provide a pressure-sensitive adhesive for reinforcing a copper-clad laminate or a flexible wiring board, which has no occurrence of flotation from an adherend during a heat-treatment, has a slight rise in adhesive force by the heat-tr...
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JP2013245243A |
To provide a pressure-sensitive adhesive that is a pressure-sensitive adhesive for bonding a support film to a glass plate, can maintain sufficient adhesion even exposed to a high-temperature environment when a following ITO sputtering t...
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JP2013245244A |
To provide a pressure-sensitive adhesive that is a pressure-sensitive adhesive for pasting a support film to reinforce a glass substrate, can maintain adhesion even in formation of an image display element to be exposed to a high-tempera...
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JP5354215B2 |
To provide an adhesive composition excellent in adhesiveness to both inorganic materials and organic materials, and heat resistance and solvent resistance; and to provide an adhesive cured material and a laminate obtained therefrom, and ...
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JP5353064B2 |
To provide a photo-sensitive adhesive composition superior in a pattern forming property by an alkaline developer and having sufficient re-adhesion after exposed, and to provide an adhesive film also superior in pattern forming property ...
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JP5355993B2 |
To provide an adhesive film for obtaining a flexible metal plated laminate sheet in which the occurrence of dimensional change is controlled when produced by a lamination method. In the adhesive film formed by forming an adhesive layer c...
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JP5344880B2 |
To improve heat conductivity as well as both adhesivity and flexibility in a resin composition containing a polyimide resin and an inorganic filler. There is provided an adhesive resin composition containing an inorganic filler and a pol...
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JP5338753B2 |
PURPOSE: An adhesive composition and a connection structure for a circuit member using the adhesive composition are provided to obtain excellent adhesive strength in a curing condition of short time and low temperature and to maintain st...
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JP5343450B2 |
To provide an adhesive film having enough lamination processability at low temperature, combining with high heat resistance and low stickiness, and an adhesive sheet using the adhesive film. The adhesive film 1 for fixing a semiconductor...
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JP2013227499A |
To provide a polyimide resin excellent in high transparency, heat resistance and a low coefficient of linear expansion.A polyimide resin to be used is obtained by imidation polymerization reaction of bicyclo[4.2.0]octane-3,4,7,8-tetracar...
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JP5337348B2 |
To provide a manufacturing method of an adhesive film wherein an adhesive layer is formed using a crystalline thermoplastic polyimide, whereby its optical transparency is improved. In the manufacturing method of the adhesive film having ...
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JP5332799B2 |
To provide a film-like adhesive for sealing a semiconductor that is fully superb in working efficiency when used for sealing a semiconductor apparatus, and can manufacture a semiconductor apparatus fully superb in connection reliability ...
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JP5332419B2 |
To provide a photosensitive adhesive composition which is excellent in patterning ability by the use of an alkali developing liquid, has satisfactory thermo-compression adhesiveness even after patterning, is excellent in heat resistance ...
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JP5333060B2 |
To provide a manufacturing method for a semiconductor device which makes an adhesive layer hardly peeled off from a support member, and allows the adhesive layer to fill recesses of irregularities formed on the surface of the support mem...
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JP5332183B2 |
To provide an adhesive composition allowing both of low-temperature adhesiveness and heat resistance to be sufficiently excellent. The adhesive composition comprises a modified amide-imide resin obtained by reacting an amide-imide resin ...
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JP2013224428A |
To provide a resin composition suppressing exudation when heated and pressurized, excellent in bonding strength and heat resistance; a resin film, a cover lay film, an interlayer adhesive, a metal-clad laminate and a multilayer printed c...
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JP5328006B2 |
The invention is based on the discovery that a remarkable improvement in the performance of maleimide thermosets can be achieved through the incorporation of imide-extended mono-, bis-, or polymaleimide compounds. These imide-extended ma...
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JP2013539493A |
Methods for preparing double-sided multi-layer adhesives, double-sided multi-layer adhesives and articles prepared with double-sided multi-layer adhesives are disclosed. The methods for preparing double-sided multi-layer adhesives includ...
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JP2013539424A |
A composite article comprises a plurality of lignocellulosic pieces and an adhesive system disposed on the plurality of lignocellulosic pieces for bonding the plurality of lignocellulosic pieces. The adhesive system comprises a binder co...
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JP5319117B2 |
A method for surfacing a polymeric composite article and/or for joining (for example, by bonding or by co-curing) the article and an adherend (for example, a second polymeric composite article) comprises(a) providing a cured or curable p...
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JP5318306B2 |
A heat-resistant composition containing solvent-soluble polyimide resin (A) and a phosphazene compound (B), wherein said phosphazene compound (B) includes at least either a cyclic phenoxyphosphazene compound (B1) expressed in the followi...
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JP2013209484A |
To provide an adhesive composition which lowers adhesive force by heating, electromagnetic wave irradiation, or the like, to provide a filmy adhesive using the same, and to provide a method for peeling an adherend therewith.There are pro...
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JP5311871B2 |
To provide an electroconductive adhesive composition that exhibits adhesive strength while in a hot condition, which has not been realized by the conventional paste-like adhesives. The electroconductive adhesive composition is produced b...
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JP2013191761A |
To provide an adhesive agent composition for a semiconductor device capable of providing an adhesive agent layer having a high ion capture property and a high elastic modulus at a high temperature.An adhesive agent composition for a semi...
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JP5297418B2 |
A process margin is improved and high connection reliability is obtained. Disclosed is an anisotropic conductive material including an adhesive composite and conductive particles dispersed in the adhesive composite, the adhesive composit...
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