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JP5117642B2 |
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JP5117746B2 |
The invention is directed to polyimide based adhesives having a coefficient of thermal expansion (“CTE”) equal to or below 50 ppm/° C. The adhesives of the present invention contain a polyimide base polymer present in the overall ad...
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JP5120378B2 |
A photosensitive adhesive composition comprising (A) an alkali-soluble polymer, (B) a thermosetting resin, (C) one or more radiation-polymerizable compounds and (D) a photoinitiator, wherein the 5% weight reduction temperature of the mix...
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JP2012255107A |
To provide a thermoplastic polyimide composition that can strike a balance between high thermal resistance and excellent film-forming properties.The thermoplastic polyimide composition comprises: a thermoplastic polyimide A having a glas...
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JP5110066B2 |
An object of the present invention is to provide a die-adhering adhesive film which can be laminated on a back of a wafer at a temperature lower than a softening temperature of a protecting tape for an ultra-thin wafer, or a dicing tape ...
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JP5100894B2 |
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JP5103928B2 |
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JP5103870B2 |
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JP5093229B2 |
The photosensitive adhesive composition of the invention comprises (A) an alkali-soluble resin, (B) an epoxy resin, (C) a radiation-polymerizable compound and (D) a photoinitiator, wherein the (D) photoinitiator contains at least (D1) a ...
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JP5092452B2 |
To provide an adhesive composition and an adhesive sheet capable of low-temperature adhesion, excellent in adhesion, heat-resistance, and migration-resistance under high temperature and high humidity conditions, and particularly useful f...
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JP5092719B2 |
To provide a method to prevent a decrease in yield due to polishing of a semiconductor wafer even when an inexpensive general adhesive film is used. The method of manufacturing the semiconductor device includes the steps of: providing a ...
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JP2012231022A |
To provide a method of manufacturing a semiconductor wafer with an adhesive layer that allows reduction in waste of adhesive and allows formation of the adhesive layer with a uniform film thickness on the semiconductor wafer.A method of ...
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JP5077840B2 |
A coverlay is provided to improve dimensional stability and heat resistance and to enhance the application to a flexible printed circuit board using lead-free welding method. A coverlay comprises a polyimide film which comprises 10-50 mo...
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JP5068914B2 |
A stretch releasing pressure sensitive adhesive tape includes a silicone pressure sensitive adhesive composition that exhibits a 180° peel strength on a glass substrate at 98% relative humidity of at least about 5.47 N/dm and a non-tack...
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JPWO2010128667A1 |
Even if the cured product is exposed to a high temperature environment of, for example, about 250 ° C, less decomposition gas is generated, and a cured product having high heat resistance and high durability and good flexibility and adh...
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JP5064033B2 |
Disclosed is an adhesive film having high dimensional stability which can be suitably used for two layer FPCs. Specifically, disclosed is an adhesive sheet composed of an insulating layer and an adhesive layer arranged on one side or bot...
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JPWO2010113759A1 |
According to one aspect of the present invention, the resin spacer film (10) is composed of an adhesive layer (12) made of a resin composition and a cover film (14) covering the surface of the adhesive layer (12). .. In such a resin spac...
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JP5046366B2 |
An adhesive composition comprising5 to 60 wt% of (A) a polyimidesilicone resin5 to 60 wt% of (B) an epoxy resin having a softening point of 80 °C or lower,0.001 to 20 wt% of (C) at least one epoxy resin curing catalyst selected from imi...
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JP2012188673A |
To provide an adhesive film for semiconductors attachable to a semiconductor wafer at a low temperature, and enabling production of semiconductor chips from a semiconductor wafer with high yield while sufficiently suppressing occurrence ...
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JP5040247B2 |
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JP5040252B2 |
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JP5035830B2 |
It is an object of the present invention to provide a polyimide-based hybrid material which is industrially and advantageously utilized because of having better gas permeability, electric characteristics, heat resistance, mechanical stre...
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JP5032900B2 |
To provide a substrate-containing adhesive sheet for a flexible printed wiring board, which is free from the occurrence of the fall of a powder of a resin composition, during the processing into a multilayer flexible printed wiring board...
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JP2012180442A |
To provide an adhesive film for a semiconductor, which is pasted to a semiconductor wafer at a low temperature and has a high modulus of elasticity when heated.In the adhesive film used for bonding a semiconductor element to an adherend,...
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JP5029093B2 |
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JP5023665B2 |
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JP5018779B2 |
The present invention provides a circuit connecting material for electrically connecting a first circuit member having a first circuit electrode formed on a major surface of a first circuit substrate, and a second circuit member having a...
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JP5010357B2 |
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JP5011641B2 |
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JP5008884B2 |
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JP4999318B2 |
To provide a resin composition suitable for interlayer insulation of a multi-layered flexible printed circuit board exhibiting excellent workability and adhesion before curing and exhibiting excellent heat resistance, adhesion and electr...
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JP5003855B2 |
The present invention relates to an adhesive composition that seals connection parts in a semiconductor device in which the connection part of a semiconductor chip and the connection part of a wiring circuit board are electrically connec...
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JP4998468B2 |
The adhesive composition of the invention comprises (a) a thermoplastic resin, (b) a radical polymerizing compound with one or more fluorene structures in the molecule, and (c) a radical polymerization initiator.
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JP5002089B2 |
To obtain an adhesive film having excellent low-temperature applicability and low hygroscopicity, etc., and further a high adhesive strength while hot and pressure cooker test(PCT) resistance, to provide a supporting member provided with...
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JP2012149179A |
To provide an optical acrylic pressure-sensitive adhesive composition and an optical acrylic pressure-sensitive adhesive tape that have high transparency and high adhesion.The optical acrylic pressure-sensitive adhesive composition inclu...
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JP2012516914A |
A maleimide terminated polyimide incorporated into a two-part acrylic structural adhesive system. The maleimide terminated polyimide of the various embodiments of the present invention provide improving thermal stability, strength, and t...
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JP4987733B2 |
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JP4976380B2 |
Disclosed is an adhesive for metal laminates which has excellent heat resistance and desmear property and enables to bond a polymer film substrate and a metal foil at a low temperature. Also disclosed is a metal laminate using such an ad...
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JP4972853B2 |
To provide a resin composition satisfactorily low in application and superior in adhesive properties, even when used for bonding large areas together, and to provide a high reliability semiconductor device which uses the resin compositio...
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JP4969095B2 |
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JP4968763B2 |
This invention provides the composition, preparation, and end-use of waterborne crosslinking technology based compositions prepared from water-based latexes. The invention provides a water-based latex comprising dispersed, waterborne ami...
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JP4959778B2 |
To provide a photo-curable resin composition capable of forming a pattern and also having a function as an adhesive that performs thermo compression bonding of substrates to each other and an adhesive using the same. The photo-curable re...
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JP4960298B2 |
Laminate comprises at least a substrate SI (a); at least a hot-melt adhesive (b) comprising at least a polyurethane polymer containing isocyanate groups and is solid at room temperature and at least an aldimine; and at least a substrate ...
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JP4952585B2 |
An adhesive composition that is capable of achieving a superior combination of process characteristics such as adherend fill properties (embedability) and low-temperature lamination properties, and semiconductor device reliability such a...
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JPWO2010070947A1 |
The present invention contains a polyurethaneimide resin represented by the following general formula (I), a thermosetting resin, a filler, and a printing solvent, and the blending amount of the thermosetting resin is 100% by mass of the...
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JP4935406B2 |
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JP2012094876A |
To provide die attach adhesives containing metal salts of quinolinol derivatives as adhesion promoters and conductivity promoters.Die attach compositions exhibit improved adhesion and conductivity by the addition of a metal salt of an 8-...
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JP2012094586A |
To provide a semiconductor device capable of preferably eliminating an unfilled part when heating and crimping a supporting member with wiring and a semiconductor chip with wiring by a die-bonding film, and having an excellent moisture r...
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JP4929634B2 |
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JP4929623B2 |
To provide a thermosetting resin composition, useful for an insulating material for use in flexible circuit boards, capable of readily forming a conductor layer superior in adhesive strength by plating. This thermosetting resin compositi...
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