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JP5699388B2 |
To provide an adhesive composition which enables a crosslinking polymerization reaction of a thermosetting polyimide to proceed without essentially requiring high-temperature conditions and also enables the crosslinking polymerization re...
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JP5691228B2 |
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JP2015509113A |
The present invention relates to an adhesive resin composition for manufacturing a circuit board and its use. The adhesive resin composition according to the present invention contains a cyanate ester resin, a fluororesin powder disperse...
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JP5688213B2 |
The present disclosure is generally directed to electrically conductive adhesives. More particularly, the disclosure is directed to electrically conductive adhesives comprising an organic polymer resin and an electrically conductive poly...
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JP5679237B2 |
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JP5676801B2 |
A method for improving the cohesive strength at elevated temperature of a die attach adhesive formulation of a liquid curable resin, initiator, and filler, comprises adding to the adhesive formulation an aromatic bismaleimide resin powde...
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JP5675367B2 |
A composition for fixing wound items comprising A) 0 to 90 wt % of at least one alpha, beta-unsaturated polyester and/or polyester imide resin based on at least one unsaturated mono-, di- or tricarboxylic acids and/or mono-, di- or trica...
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JPWO2013008667A1 |
Provided is a curable resin composition capable of obtaining a cured product which is liquid at room temperature, has excellent heat resistance, and has a low coefficient of thermal expansion. The curable resin composition according to t...
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JP2015034986A |
To provide a film-like positive type photosensitive adhesive composition that can exhibit adequate flowability in the connection of semiconductor chips with each other or the connection of a semiconductor chip with a supporting member fo...
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JP5672701B2 |
Provided is a polyamide resin that simultaneously satisfies requirements for heat resistance, insulation reliability, and solvent solubility, and that is ideal for heat-resistant adhesives for printed wiring board applications. Also prov...
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JP5672649B2 |
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JP2015028106A |
To provide a polyimide precursor varnish for obtaining a polyimide resin having both excellent insulation characteristics and heat resistance and also having flexibility.A polyimide precursor varnish of the invention comprises a polyimid...
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JP5663826B2 |
To provide a photosensitive adhesive composition having re-adherability after exposure, and improved in pattern formability with an alkali developer, heat resistance after re-adhesion and pasting ability at low temperature when formed in...
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JP5664455B2 |
To provide an adhesive composition, which can secure curability capable of responding to a lower temperature of heat history received in an assembling step after die bonding while satisfying thin film generating properties, processabilit...
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JP5658457B2 |
The present invention relates to a catalyst, which is an organic component with electron withdrawing substituents and to compositions with such catalyst and at least one benzoxazine component, and the use of such compositions in adhesive...
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JP5659946B2 |
To provide: an adhesive for sealing a semiconductor with which generation of voids is sufficiently controlled even in high temperature connection, and flux activity of a flux agent is obtained effectively; a production method therefor; a...
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JP5655885B2 |
To provide an adhesive composition formable of a film adhesive or the like, having both of process characteristics such as suitability to filling into an adherend and low-temperature laminating property, and characteristics which contrib...
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JP5655446B2 |
To provide a thermosetting resin composition from which a cured material excellent in dimensional stability is obtained and also an insulating layer excellent in low-temperature meltability is obtained, and to provide an interlayer adhes...
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JP5655400B2 |
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JP5655451B2 |
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JP5654718B2 |
A method for improving the cohesive strength at elevated temperature of a die attach adhesive formulation of a liquid curable resin, initiator, and filler, comprises adding to the adhesive formulation an aromatic bismaleimide resin powde...
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JP5648677B2 |
The invention aims to provide a resin primer which can stick an insulator layer to a conductor foil whereof the surface is not much roughened with sufficient adhesive force, a conductor foil with resin, a laminated sheet and a method of ...
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JP5648617B2 |
The invention provides a thermal conductive adhesive composition with high thermal conductivity and excellent heat dissipation characteristic, good adhesiveness and excellent reliability after a moisture resistance test, a bonding sheet ...
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JP5648514B2 |
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JP2014231536A |
To provide a thermosetting resin composition and adhesive using the same that has a high insulation property, a low thermal expansion property and a high glass transition temperature (Tg), that does not exhibit appearance abnormality suc...
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JP5636891B2 |
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JP5636962B2 |
Disclosed is a resin composition which can be cured into a product having a low dielectric tangent and excellent adhesion strength to a conductor. The resin composition comprises a specific cyanate ester resin, a curable polyvinyl benzy...
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JP5633583B2 |
This adhesive tape has a structure in which an adhesive layer and a radiation-curable pressure-sensitive adhesive layer are layered, said radiation-curable pressure-sensitive adhesive layer being capable of pattern formation by exposure ...
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JP5625431B2 |
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JP2014214213A |
To provide an insulating adhesive composition which is excellent in insulation properties, heat resistance, heat radiation characteristics, thermal conductivity, and voltage resistance even when prepared by packing an inorganic filler co...
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JP5617302B2 |
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JP5616277B2 |
The present invention provides thermosetting aqueous binder compositions of (i) one or more diprimary diamine, e.g. lysine, or poly(primary amine), e.g. polyethylenimine and tris(2-aminoethyl)amine, and (ii) one or more 5-carbon reducing...
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JP5613300B2 |
A polyimide film which, especially when superposed on a metal layer by the laminating method, has the function of diminishing the thermal distortion to be imposed on the material; an adhesive film and a flexible metal-clad laminate each ...
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JP5605259B2 |
Resin compositions which comprise the following components (A) to (E) are useful for interlayer insulation of a multilayer printed wiring board: (A) an epoxy resin having 2 or more epoxy group in one molecule and which exists in a liquid...
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JP2014194021A |
To provide formulations that are not brittle while retaining its high modulus and excellent resistance to thermal degradation.Imide-extended maleimide compounds are readily prepared by the condensation of appropriate anhydrides with appr...
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JP5602046B2 |
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JP5594144B2 |
Disclosed is a resin composition for printed wiring boards that comprises (A) a polyimide resin that has hexafluoroisopropanol groups and a siloxane structure and (B) a heat curable resin. The resin composition has excellent solvent resi...
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JP5592463B2 |
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JP5589742B2 |
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JP5586073B2 |
A rubber-metal bonded article with an adhesion promoter in the rubber selected from neoalkoxy zirconates and polyimides. Articles requiring compressed rubber exhibit improved retention of compressive strain after assembly of the article ...
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JP5578174B2 |
A film-like adhesive agent for sealing a semiconductor, which comprises (a) an epoxy resin and (b) a catalyst-type curing agent and does not contain any curing agent that can be converted into an active species by the action of the catal...
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JP5574704B2 |
A film and a flexible metal-clad laminate obtained with the film. The laminate is improved in post-moisture absorption solderability. The film comprises a heat-resistant polyimide film and, disposed on at least one side thereof, an adhes...
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JP5569037B2 |
To improve pattern forming properties and the adhesive properties of a photosensitive adhesive film, when the photosensitive adhesive film is exposed via a base material. A photosensitive adhesive sheet 10 includes a base material 1 and ...
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JP5569126B2 |
An adhesive composition comprising (A) a thermoplastic resin, (B) a heat-curable resin, (C) a latent curing agent, (D) an inorganic filler, and (E) organic microparticles.
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JP2014143308A |
To provide a resin composition for temporal fixing which can form a coating film for a support member having a low-adhesion surface, can fix a semiconductor wafer and the support member sufficiently, has a sufficient heat resistance, and...
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JP2014518989A |
Slide bearings and methods of producing slide bearings are disclosed. The slide bearing has a metal support, an adhesive layer and a sliding layer. The adhesive layer is applied directly to the metal support. The adhesive layer comprises...
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JP2014141603A |
To provide a highly thermostable adhesive agent composition having a low dielectric constant and a low dielectric dissipation factor, and further excellent in adhesiveness to metals, an adhesive sheet obtained by molding the adhesive age...
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JP2014139265A |
To provide a polylactic acid-based polyester resin having self emulsification function capable of forming aqueous emulsion without using an emulsifier or an organic solvent, and high in biomass degree, and to provide a water dispersion r...
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JP5562574B2 |
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JP5562360B2 |
The invention is based on the discovery that a remarkable improvement in the performance of maleimide thermosets can be achieved through the incorporation of imide-extended mono-, bis-, or polymaleimide compounds. These imide-extended ma...
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