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WO/2014/007353A1 |
A pressure-sensitive adhesive sheet which has a pressure-sensitive adhesive layer made of a pressure-sensitive adhesive composition that comprises a tacky resin (A) and a conductive material (B), wherein the van der Waals force component...
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WO/2014/005392A1 |
Provided in the present disclosure are a benzene ring-containing compound and a seal agent, the preparation method and use thereof. The compound has the following structure (I), wherein R1 and R2 are identical or different, and R1 and R2...
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WO/2014/003173A1 |
[Problem] To provide an active energy ray curing-type adhesive agent composition which is reliable and exhibits excellent gap filling properties. Moreover, when the composition is adhered to an article such as the surface protection laye...
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WO/2014/004297A1 |
Benzoylthiourea or benzoylthiourethane derivatives as cure accelerators for curable compositions are provided.
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WO/2013/191339A1 |
Provided is an adhesive composition, comprising: a copolymer in which a monomer containing 5 to 50 parts by weight of a polar functional group with respect to 100 parts by weight of a (meta) acrylic acid ester-based monomer is polymerize...
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WO/2013/187508A1 |
Provided are: a polymerizable composition for manufacturing a polymer with a small volume contraction rate during polymerization, low permittivity, and little coloration due to heat; a polymer obtained by polymerizing the composition (in...
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WO/2013/183680A1 |
An active energy ray curable adhesive composition comprising a radical polymerizable compound (A) having an SP value of 29.0 (kJ/m3)1/2 to 32.0 (kJ/m3)1/2, a radical polymerizable compound (B) having an SP value of 18.0 (kJ/m3)1/2 or mor...
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WO/2013/183682A1 |
An active energy ray curable adhesive composition comprises radical polymerizable compounds (A), (B) and (C), as curable components, the composition being characterized by containing, when the total amount of the composition is 100 weigh...
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WO/2013/181133A1 |
The present invention comprises adhesive articles, adhesive compositions, and release liners. The release liners include silicone-based release formulations that can provide average and static release forces desirable for converting and ...
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WO/2013/181030A1 |
The disclosure describes a curable composition comprising a) a solute (meth)acryloyl oligomer having a plurality of pendent, ethylenically unsaturated, free-radically polymerizable functional groups and nucleophilic, hydrophilic groups, ...
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WO/2013/180374A1 |
The present invention relates to an organic light-emitting apparatus and an adhesive film for an organic light-emitting apparatus filler comprising an acrylic binder polymerized through a suspension polymerization method, and the organic...
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WO/2013/180524A1 |
The present application relates to an adhesive composition. The adhesive composition of the present application may enable an adhesive having excellent durability, reliability, stress relief, and reworkability to be formed. Further, if t...
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WO/2013/180492A1 |
The present invention relates to a conductive film. The conductive film according to the present invention may be applied to a conductive laminate, to a touch panel, or to a touch screen in order to provide excellent durability. The adhe...
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WO/2013/173976A1 |
A liquid photo-curable adhesive composition comprising: (a) 5 to 30 wt% of urethane acrylate, (b) 30 to 80 wt% of plasticizer, (c) 0.02 to 5 wt% of photo initiator, (d) 0 to 30 wt % of acrylate monomers and/or oligomer, is described.
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WO/2013/177382A1 |
The present invention relates to a process for producing free-flowing, agglomeration resistant amorphous poly-alpha--olefin based adhesive pellets. The process includes (a) extruding the adhesive through an orifice of a die plate immerse...
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WO/2013/174431A1 |
The present invention provides for curable compositions composed of one or more cyanoacrylate monomers, and one or more (co)polymers. The compositions of the present invention may exhibit pressure sensitive adhesion properties at 23 °C....
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WO/2013/174430A1 |
The present invention relates generally to an article comprising a curable film on a release substrate and/or carrier substrate. More particularly, the curable film comprises at least one specific cyanoacrylate monomer and at least one f...
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WO/2013/176436A1 |
The present invention relates to a photocurable and optically transparent adhesive bonding composition which contains aliphatic urethane acrylate, a polythiol-based chain transfer agent, a monofunctional ethylene-based monomer, a photopo...
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WO/2013/176457A1 |
The present application relates to an optical member, an adhesive composition and to a liquid crystal display device. The optical member of the present application has a thin adhesive layer less than 20 ㎛ and exhibits superior durabili...
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WO/2013/173977A1 |
Process for binding substrates with a liquid optically clear photo-curable adhesive A process for binding a top substrate to a base substrate is disclosed, in which (a) a liquid optically clear photo-curable adhesive is applied onto the ...
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WO/2013/174776A1 |
The present invention relates generally to an article comprising a curable film on a release substrate and/or carrier substrate. More particularly, the curable film comprises at least one specific cyanoacrylate monomer and at least one f...
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WO/2013/174731A1 |
The invention relates to compositions producible using (A) 90 parts by weight of water, (B) 0.1 to 10 parts by weight of amino-functional silanes and/or partial hydrolysates thereof and (C) 0.005 to 0.5 parts by weight of carboxylic acid...
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WO/2013/176364A1 |
The present invention relates to an adhesive composition comprising: an alkyl acrylic acid ester monomer having an alkyl carbon number of 2 to 14; an acrylic acid ester monomer containing a hydroxyl group; and a copolymer obtained by cop...
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WO/2013/175950A1 |
A mixed composition contains, in prescribed amounts: (A) a (meth)acrylic resin composition containing (A1) a (meth)acrylic acid ester polymer, (α1) (meth)acrylic acid ester monomers, and (D) polyfunctional monomers having multiple polym...
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WO/2013/170692A1 |
Disclosed is a photothermal dual-curing anisotropic conductive adhesive, comprising the following components by weight percentages: a photocurable active monomer 15.0-18.0%; a photocurable resin 4.5-12.5%; a thermally curable resin 20.0-...
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WO/2013/172284A1 |
To provide: a method for producing an optical component, wherein when an optical component is produced by bonding the constituent members of the optical component with a reaction curable resin composition therebetween, the composition ca...
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WO/2013/172633A1 |
The present invention relates to an adhesive article and a method for producing the same. The present application can effectively provide an adhesive article with both side surfaces having different physical properties, for example, an a...
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WO/2013/171528A1 |
Anaerobic curing formulations for sealing and/or blocking screws, nuts, bolts and screw or sealing caps are described. The sealing formulation comprises at least one acrylic resin and phenoxy-polyethoxy sulphate. The self-locking formula...
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WO/2013/173319A1 |
Acrylic adhesion promoters having an improved property such as cohesive failure are produced from a monocyclic anhydride of phosphonic acid containing multiple carboxylic acids that is subsequently reacted with a hydroxyalkyi methacrylat...
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WO/2013/161713A1 |
A circuit connection material for electrically connecting two circuit members facing each other, which contains a thermoplastic resin, radically polymerizable compounds, a radical polymerization initiator and inorganic fine particles. Th...
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WO/2013/162230A1 |
Disclosed are a substrate composition for a foam tape which has high foam stability and excellent peel strength, a foam tape using the same, and a preparation method thereof. According to the present invention, the substrate composition ...
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WO/2013/161812A1 |
The purpose of the present invention is to provide an ultraviolet light curing adhesive composition that is an optical, solvent-free adhesive composition for use in touch panels and the like, wherein a thick adhesive layer can be formed ...
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WO/2013/153803A1 |
A semiconductor device (10) which comprises a substrate (1), an adhesive layer (2) and a light emitting diode chip (3), and wherein the adhesive layer (2) is a cured product of a die attaching material that contains (A) at least one kind...
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WO/2013/154203A1 |
Provided is a circuit connection material for connecting a first circuit member that has a first circuit electrode formed on top of the main surface of a first substrate, and a second circuit member that has a second circuit electrode fo...
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WO/2013/154314A1 |
Disclosed is a semi-hardened pressure sensitive adhesive film to be used in the semi-hardened state and having excellent printing step absorption properties. The adhesive film according to the present invention contains a radial polymer ...
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WO/2013/151739A1 |
The present disclosure provides an crosslinkable composition comprising a (meth)acrylate copolymer component having pendant photobase functional groups and a crosslinking agent that has amine-reactive functional groups. On exposure to li...
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WO/2013/151680A1 |
A two-part acrylic adhesive composition comprising at least one organoborane-amine complex initiator and at least one multifunctional maleimide crosslinker.
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WO/2013/146015A1 |
Provided is a polymerizable composition which comprises: a first component selected from the group consisting of a compound generated by an ester exchange reaction between a hydrogenated polyolefin polyol and an acrylic acid ester, a com...
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WO/2013/147569A1 |
The present application relates to an adhesive tape, a polishing pad, a method for manufacturing the polishing pad, a polishing apparatus, and a method for manufacturing a glass substrate. An illustrative adhesive tape can be an adhesive...
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WO/2013/141314A1 |
The present invention pertains to a photocurable resin composition containing: a compound (A) having a photopolymerizable functional group; and an oil gelling agent (B). The present invention also pertains to an image display device havi...
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WO/2013/140472A1 |
The present invention relates to: an ultraviolet-ray-curable adhesive agent which can be used for adhering an optical base to an optical base having a light-shielding part on the surface thereof to each other, and is characterized by com...
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WO/2013/136945A1 |
The present invention solves the problem of the difficulty of imparting satisfactory adhesive properties. Provided is a curable resin composition that contains components (A) to (D). (A) 100 parts by mass of an oligomer which has a (meth...
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WO/2013/137621A1 |
The present invention relates to an adhesive composition, to an adhesive film, and to an organic electronic device. An exemplary embodiment of the adhesive composition can provide a sealing layer for the adhesive film, organic electronic...
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WO/2013/134000A1 |
Adhesive tape for bonding that can be detached without leaving residue and without damaging the surface of a substrate when stretched in a direction of a bond plane. An adhesive tape includes an elastomeric backing having opposing first ...
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WO/2013/132933A1 |
An adhesive raw material contains a monomer and/or polymer and 55 mass% or more thermally conductive particles. The thermally conductive particles contain first thermally conductive particles having a particle size based on the volume of...
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WO/2013/132932A1 |
A thermally conductive adhesive sheet is provided with an adhesive layer. The adhesive layer contains thermally conductive particles, the push-out adhesion strength for a stainless steel plate is 5 N/cm2 or higher, the elongation measure...
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WO/2013/133539A1 |
Provided is an adhesive composition for a polarizer, wherein the adhesive composition has enhanced adhesiveness by suppressing moisture-inhibited hardening. The adhesive composition for a polarizer of the present invention comprises: (A)...
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WO/2013/129096A1 |
Provided are an energy ray curable hydrophilic adhesive composition and an adhesive sheet suitable for producing, by three-dimensional molding, microstructures that are suitable for applications requiring hydrophilicity, such as microrea...
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WO/2013/129565A1 |
Provided is a polyene-polythiol resin composition with outstanding heat resistance. A resin composition containing: (A) a silsesquioxane derivative represented by formula [1] below, having a random structure, and having two or more car...
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WO/2013/126377A1 |
There is provided an adhesive composition comprising: a) at least one acrylic functional monomer; b) a first toughening agent; c) a second toughening agent; d) an adhesion promoter; and e) a high aspect ratio filler selected from at leas...
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