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WO/2013/126377A1 |
There is provided an adhesive composition comprising: a) at least one acrylic functional monomer; b) a first toughening agent; c) a second toughening agent; d) an adhesion promoter; and e) a high aspect ratio filler selected from at leas...
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WO/2013/124210A1 |
The invention relates to a new adhesive composition and films produced therefrom for producing composite bodies, in particular for adhesively bonding plastic to glass components, to a method for producing corresponding composite bodies, ...
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WO/2013/122144A1 |
[Problem] The purpose of the present invention is to provide a photocurable sheet-type adhesive composition for optical use, which can be used to adhere together a cover glass and a touch panel or a touch panel and a display module, for ...
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WO/2013/115250A1 |
The purpose of the present invention is to provide a photocurable translucent composition for an adhesive sheet which will not corrode the electroconductive layer of a translucent electroconductive film even when bonded directly onto the...
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WO/2013/112315A1 |
Cyanoacrylate-containing compositions that include, in addition to the cyanoacrylate component, an anhydride and a maleimide-, itaconimide-, or nadimide-containing compound, are provided. Cured products of the inventive cyanoacrylate com...
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WO/2013/111036A1 |
Two part cyanoacrylate/free radical curable adhesive systems, are provided.
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WO/2013/105163A1 |
The present invention pertains to an ultraviolet curable adhesive characterized by: being used to bond an optical substrate and an optical substrate having a light-blocking section to a surface; and containing an organic compound (A) tha...
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WO/2013/105455A1 |
[Problem] The main purpose of the present invention is to provide an adhesive sheet which prevents scattering of chips during dicing and enables easy pick-up, while being not susceptible to leaving adhesive residue behind. [Solution] An ...
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WO/2013/105162A1 |
The present invention pertains to: an ultraviolet-curable adhesive that is used for bonding an optical substrate and an optical substrate having a light-blocking section on the surface thereof to one another, and is characterized by cont...
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WO/2013/103116A1 |
The purpose of the present invention is to provide a wafer-processing tape that does not result in displacement at the interface between the adhesive layer and the sticky agent layer due to expansion, that has uniform expansion propertie...
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WO/2013/101693A1 |
The present invention provides an adhesive tape composition and an adhesive tape prepared from same. Based on the total weight of the adhesive tape composition, the adhesive tape composition comprises: 25-75 wt.% of an acrylate monomer; ...
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WO/2013/099985A1 |
Provided is a polymerizable composition for providing a thin image-display device that does not exhibit display problems due to deformation of an image-display unit, allows high-brightness, high-contrast image display, and tolerates heat...
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WO/2013/101827A1 |
This disclosure relates to viscoelastic damping materials and constructions which may demonstrate low temperature performance and adhesion and which may be used in making vibration damping composites. Viscoelastic damping materials and c...
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WO/2013/093652A1 |
A pressure-sensitive adhesive material including a visco-elastic layer and an elastic layer is provided. In some embodiments, a reusable pressure-sensitive adhesive material exhibiting high adhesive strength after repeated cycles of adhe...
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WO/2013/092573A1 |
A radiation curable adhesive comprising (i) (meth)acrylic monomer(s) and/or oligomer(s), wherein said (meth)acrylic monomers or oligomers comprise 5 to 50 wt % of esters of (meth)acrylic acid with polyetherpolyols having the formula HO-(...
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WO/2013/089061A1 |
Provided are: an electrically conductive adhesive agent which can achieve good conduction in a substrate that has been treated with an organic solderability preservative; and a method for connecting an electronic component. An electrical...
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WO/2013/088889A1 |
Provided is a production method for a transparent double-sided adhesive sheet having little variation in the storage modulus therefor caused by temperature variation, and also having few residual monomers. The production method for the t...
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WO/2013/089062A1 |
Provided are: an adhesive agent which can achieve good electric conduction in a substrate that has been treated with an organic solderability preservative; and a method for connecting an electronic component. An adhesive agent comprising...
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WO/2013/084953A1 |
The present invention makes it possible to manufacture a light-transmitting hard-substrate laminate with high production efficiency while reducing the risk of fractures. In this method for manufacturing a light-transmitting hard-substrat...
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WO/2013/083406A1 |
A process for the adhesive bonding of plastics pipes with or without a fitting by use of a (meth)acrylate adhesive and also corresponding pipe connections are described.
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WO/2013/083567A1 |
The invention relates to a curable composition containing a vinyl ester polymerisable resin, together with a sulfonated poly-aromatic thermoplastic polymer and an N-vinyl lactame. The composition is characterised in that it also comprise...
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WO/2013/084750A1 |
Provided are: a thermally conductive pressure-sensitive adhesive agent composition and a thermally conductive pressure-sensitive adhesive sheet-shaped molding which combine high thermal conductivity and sufficient flexibility and the sur...
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WO/2013/084503A1 |
The present invention relates to an ultraviolet curable resin composition for optical substrate bonding, which is characterized by comprising a sulfur-containing compound (A) having at least two intramolecular groups represented by formu...
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WO/2013/084753A1 |
[Problem] To make it possible to achieve a longer usable time while maintaining the physical properties of the hardened material in a two component hardening resin composition that uses a compound with one or more (meth)acrylic groups in...
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WO/2013/083564A1 |
The invention relates to a curable composition containing a vinyl ester resin, which, once it has been cured, can be used to obtain materials that offer an excellent balance between toughness, resistance at high temperatures and moisture...
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WO/2013/077080A1 |
The purpose of the present invention is to provide: an ultraviolet curable resin composition which enables recovery of an optical base from an optical member, which is bonded using an ultraviolet curable resin, with less damage to the op...
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WO/2013/073364A1 |
[Problem] The present invention provides an acrylic resin composition which has low viscosity, which can be cured even by an LED irradiation device having low illuminance, and which provides a cured product that has adequate peel strengt...
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WO/2013/074265A1 |
The present invention provides fast fixturing two pa adhesive compositions which include a first part containing a (meth) acrylic component and a cure system for the epoxy resin component of the second part and a second part containing a...
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WO/2013/069907A1 |
The present invention relates to an adhesive composition for a protective film which is made using an acrylic resin able to minimise the occurrence of static electricity while exhibiting film soiling resistance and a low peeling force du...
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WO/2013/069281A1 |
The present invention relates to: an optical member which is obtained by bonding at least two base materials by means of a layer of a cured product of an ultraviolet-curable resin composition that contains (A) a (meth)acrylic polymer hav...
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WO/2013/064059A1 |
Provided is a medical adhesive with good biodegradable performance capable of cross-linking and copolymerizing, comprising a mono-α-cyanoacrylate and a bis-α-cyanoacrylic acid diol ester monomer molecule. The olefinic bonds in the mono...
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WO/2013/061938A1 |
A pressure-sensitive adhesive sheet provided with a pressure-sensitive adhesive layer (X) containing a pressure-sensitive adhesive obtained by using heat to semi-cure a pressure-sensitive adhesive composition containing the following: a ...
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WO/2013/061923A1 |
Provided are: a conductive adhesive which is capable of achieving excellent connection reliability by ensuring high adhesive power; and a solar cell module which is capable of achieving high power generation efficiency by connecting elec...
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WO/2013/061830A1 |
This mixed composition contains 100 parts by mass of a (meth)acrylate resin composition (A) containing (meth)acrylate acid ester polymers (A1) and (meth)acrylate acid ester monomers (α1), 90-1200 parts by mass of a thermally conductive ...
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WO/2013/058330A1 |
The purpose of the present invention is to provide an active-energy-ray-curable resin composition, an adhesive containing the resin composition, and a laminate film obtained using the adhesive, the active-energy-ray-curable resin composi...
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WO/2013/058570A2 |
Disclosed is a sealing film for electronic paper having a multilayered structure. The multilayered film for electronic paper comprising a layered structure according to the present invention comprises: (a) a sealing layer formed with a m...
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WO/2013/059762A1 |
One embodiment of the present invention provides a system for bonding a first substrate and a second substrate. During operation, the system starts by treating a first surface of the first substrate and a second surface of the second sub...
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WO/2013/057959A1 |
The present invention relates to a method for producing an optical member wherein an optical substrate having a light-blocking part on the surface is bonded to an optical substrate for bonding. The method for producing an optical member ...
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WO/2013/057957A1 |
[Problem] The present invention pertains to an ultraviolet ray cured resin composition characterized by containing a compound (A) having a structure indicated by general formula (1) (in the formula, n is an integer from 0 to 40, m is an ...
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WO/2013/051876A2 |
Disclosed is an aqueous adhesive composition, the adhesive properties of which are barely degraded due to aging. The aqueous adhesive composition according to the present invention has the technical features of comprising a monomer havin...
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WO/2013/047046A1 |
The present invention provides an adhesive, which has good adhesive strength during operation and high reliability in terms of heat resistance, moisture resistance, and the like, and with which during disassembly disassembly can be easil...
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WO/2013/047145A1 |
Provided is a thermally conductive pressure-sensitive adhesive composition which has insulating properties and thermal conductivity in a balanced manner and is obtained by carrying out a polymerization reaction of a (meth)acrylic acid es...
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WO/2013/049087A1 |
A curable adhesive composition is disclosed comprising: at least one free radically polymerizable oligomer component; optionally at least one diluent monomer; at least one perfluorinated ether monomer; and a photoinitiator. The curable l...
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WO/2013/047435A1 |
[Problem] To provide an adhesive composition which exhibits high adhesiveness to a poor adherend of a light-curing resin composition, such as glass, copper, aluminum, PET, or PC, and which also exhibits high adhesiveness even between dis...
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WO/2013/046648A1 |
The present invention provides an adhesive kit offering both excellent adhesion to the teeth and excellent latitude of time for manipulation after contact between the pre-treatment material and adhesive material. The present invention is...
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WO/2013/046686A1 |
The present invention provides an adhesive composition which has a cured product exhibiting high transparency and a high refractive index, and which has high adhesive strength and experiences little reduction in the adhesive strength, ev...
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WO/2013/042203A1 |
An adhesive composition for adhering a first circuit member, in which a first circuit electrode is formed on the main surface of a first circuit board, to a second circuit member, in which a second circuit electrode is formed on the main...
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WO/2013/042633A1 |
Provided is a circuitry connecting material whereby close adhesion with an interface with a silicon nitride film can be enhanced and excellent connection reliability can be exhibited during subjection to a high-temperature high-humidity ...
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WO/2013/042724A1 |
An adhesive composition for adhering together a first circuit member where a first circuit electrode is formed atop the primary surface of a first circuit board and a second circuit member where a second circuit electrode is formed atop ...
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WO/2013/039226A1 |
The purpose of the present invention is to provide an adhesive composition for temporary fixation which has high adhesive strength, offers excellent peeling performance when in water, can be applied even to members having optically opaqu...
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