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WO/2016/126128A1 |
The present application relates to an encapsulation film, an organic electronic device comprising same, and a method for manufacturing the organic electronic device, and provides an encapsulation film that enables the formation of a stru...
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WO/2016/121706A1 |
Provided is a resin composition that has a low shrinkage ratio when cured and provides a cured film having a reduced occurrence of outgas during a bonding process or after curing, and having excellent flexibility in addition to having ex...
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WO/2016/121815A1 |
A composition for forming easy-to-detach thin resin films, characterized by comprising a urethane (meth)acrylate compound and either a first polymerizable composition comprising a free-radical polymerization initiator and an ethylenic mo...
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WO/2016/121806A1 |
This paste adhesive composition includes metal particles (A) and a compound (B) polymerized by heating, and when the metal particles (A) are caused to undergo sintering and form a particle connection structure by heat treatment, and the ...
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WO/2016/123011A1 |
The invention provides anaerobic curable compositions comprising a (meth)acrylate component, at least a portion which comprises a (meth)acrylate-functionalized bio-renewable oleaginous polyurethane polymer, and methods of their productio...
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WO/2016/120710A1 |
The present invention provides an adhesive resin layer, an adhesive resin film, a laminate, and a laminate manufacturing method, the adhesive resin layer maintaining transparency and enabling the prevention of the occurrence of bubbles, ...
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WO/2016/117045A1 |
Disclosed are: a pressure-sensitive adhesive sheet which includes a pressure-sensitive adhesive layer, wherein the pressure-sensitive adhesive layer is a layer formed by curing a solvent-free curable resin composition by irradiation with...
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WO/2016/117605A1 |
Provided is an adhesive that is applied using an inkjet device, wherein the adhesive can make it difficult for voids to form in an adhesive layer and, after bonding, can increase adhesiveness, moisture-resistant adhesion reliability, and...
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WO/2016/117526A1 |
A method for producing an image display device having a protective plate adhered to a liquid crystal display unit equipped with a liquid crystal display cell, a polarizing plate, and a sealed body or a housing, the method involving: (A) ...
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WO/2016/117554A1 |
This thermosetting adhesive composition contains as a component (A) a vinyl compound in which a terminal end of a bifunctional polyphenylene ether oligomer is converted to a vinyl group, as a component (B) a maleimide resin, and as a com...
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WO/2016/117606A1 |
Provided is an adhesive that is applied using an inkjet device, wherein the adhesive can make it difficult for voids to form in an adhesive layer and, after bonding, can reduce outgassing upon exposure to high temperatures and can increa...
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WO/2016/111283A1 |
Provided is a dicing tape with which it is possible to minimize chip scattering and chipping during a dicing step, with which pickup can easily be performed, and with which adhesive residues are unlikely to remain even for small and thin...
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WO/2016/109625A1 |
A coated wire includes a steel alloy coated with a coating comprising one or more amino alkoxy-modified silsesquioxane compounds selected from the group consisting of an amino alkoxy-modified silsesquioxane, an amino/mercaptan co- alkoxy...
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WO/2016/109173A1 |
A pressure-sensitive adhesive is provided that is a dried product of a latex composition, which is formed from an emulsion composition. The latex composition and the emulsion composition are also provided. The emulsion composition has dr...
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WO/2016/109245A1 |
The present invention provides a compressible micron-sized polymer particle and use thereof, a curable composition and preparation method thereof, a pressure-sensitive adhesive, and an adhesive tape. The compressible micron-sized polymer...
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WO/2016/104218A1 |
[Problem] To provide a novel photosensitive resin composition. [Solution] A photosensitive resin composition which contains: a polymer that has a repeating structural unit represented by formula (1), while having a (meth)acryloyl group a...
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WO/2016/104977A1 |
Provided are an adhesive bonding composition for optical use and a multistage curing method, the composition comprising a methacrylate-based monomer and an acrylate-based monomer, wherein a weight ratio of the methacrylate-based monomer ...
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WO/2016/104978A1 |
Provided are an adhesive composition for optical use comprising 10-60 weight % of a monofunctional (meta)acrylate-based oligomer, an image display device, and a method for producing an image display device.
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WO/2016/104473A1 |
The present invention provides a modified liquid diene rubber that can be used in a curable resin composition, wherein said resin composition containing said modified liquid diene rubber exhibits a much faster curing speed compared to pr...
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WO/2016/104566A1 |
The present invention is an adhesive composition which contains a (meth)acrylic resin (A) and an ethylenically unsaturated compound (B) containing one ethylenically unsaturated group. This adhesive composition contains, as the ethylenica...
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WO/2016/097077A1 |
The present invention relates to a ferroelectric adhesive composition comprising from 2 to 50 % of an adhesive matrix, from 5 to 85 % of a ferroelectric component, wherein all weight percentages are based on weight of the total weight of...
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WO/2016/098533A1 |
A cyanic acid ester compound which has a structure represented by general formula (1). (In the formula, n represents an integer of 1 or more.)
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WO/2016/097269A1 |
A reaction resin composition having a resin component which contains a radically polymerizable compound and having an initiator system which contains an α-halocarboxylic acid ester and a catalyst system that comprises a nitrogen-contain...
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WO/2016/092971A1 |
The present invention addresses the problem of providing an ultraviolet ray-curable adhesive agent composition which can be made into an ultraviolet ray-curable adhesive sheet having excellent followability to terraced surfaces and excel...
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WO/2016/088697A1 |
Provided is a novel pressure-sensitive adhesive sheet laminate capable of minimizing contamination by foreign matter in the interface between an adhesive layer and a mold release layer and/or migrative transfer of a mold release agent to...
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WO/2016/088859A1 |
A semiconductor device in which the connection parts of a semiconductor chip and a wiring circuit board are electrically connected to each other, and a semiconductor adhesive used for sealing the connection parts of a semiconductor devic...
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WO/2016/080069A1 |
Provided is an inkjet photo- and heat-curable adhesive capable of increasing the thickness precision of an adhesive layer in which the adhesive is cured and also capable of making it more difficult for voids to occur in the adhesive laye...
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WO/2016/080084A1 |
The present invention relates to: a photocurable resin composition with which laminating between a display and a touch panel or between a display and a front panel or between a touch panel and a front panel can be performed using a photo...
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WO/2016/076209A1 |
This two-pack curable composition contains a compound having a (meth) acrylic group, an acrylamide compound, water, expanding capsules which start expanding when the temperature reaches 70-95°C, hydroperoxide, and a metal complex, the r...
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WO/2016/066918A1 |
The invention relates to a multifunctional acrylic product having a number-average functionality f of acrylate groups greater than 2.1, which is the product of reaction by esterification and by etherification, via Michael addition reacti...
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WO/2016/063405A1 |
An adhesive for cementing together one display element constituent member having a step on the surface on the to-be-cemented side and another display element constituent member, wherein the adhesive is obtained by causing an adhesive com...
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WO/2016/063919A1 |
The present invention provides a triacrylate compound represented by formula (1). In the formula, R each independently represent a hydrogen atom, an alkyl group having a carbon number of 1 to 6, or a halogen atom, R1 and R2 each independ...
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WO/2016/063978A1 |
Provided is a photocurable composition containing: (A) a crosslinkable silicon group-containing organic polymer; (B) a photobase generator; (C1) a silicon compound having an Si-F bond, and/or (C2) one or more fluorine-based compound(s) s...
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WO/2016/059952A1 |
[Problem] To provide a one-pack type room-temperature-curable 2-cyanoacrylate composition having magnetism. [Solution] A 2-cyanoacrylate composition having magnetism, which is characterized by containing (a) a 2-cyanoacrylic acid ester a...
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WO/2016/056269A1 |
Provided is an adhesive tape for protecting a semiconductor wafer surface having bumps, said adhesive tape having an ultraviolet curable adhesive layer on a substrate film, wherein the adhesive layer comprises a (meth)acrylic polymer hav...
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WO/2016/055856A1 |
Anaerobic curable compositions, such as adhesives and sealants, are provided, which include compounds shown in structure (I) where X is optional, but when present, X is halogen, alkyl, alkenyl, cycloalkyl, hydroxyalkyl, hydroxyalkenyl, a...
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WO/2016/052952A1 |
The present invention relates to a polarizing plate and a display apparatus comprising the same, the polarizing plate comprising: a polarizer; an adhesive layer formed on at least one surface of the polarizer; and a protection film forme...
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WO/2016/051914A1 |
The purpose of the present invention is to provide a photocurable resin composition which has excellent thick film curability and provides a cured product having high concealability, while having excellent storage stability. The present ...
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WO/2016/047308A1 |
This active energy ray-curable adhesive composition contains water, a polymerizable compound, a polymerization initiator represented by general formula (I), and polymer particles. In general formula (I), each of V1, V2, V3 and V4 indepen...
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WO/2016/047361A1 |
The present invention relates to: an active energy ray-curable adhesive composition which contains a compound having a hydrophilic group and an ethylenically unsaturated group and a compound represented by general formula (I); an adhesiv...
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WO/2016/047387A1 |
A radically polymerizable adhesive agent composition according to the present invention comprises a radically polymerizable compound, a thermal radical polymerization initiator, a cationically polymerizable compound and a photoacid gener...
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WO/2016/047268A1 |
This active energy ray-curable adhesive composition contains: a compound represented by general formula (I); a polyfunctional urethane (meth)acrylate having two or more (meth)acryloyl groups in each molecule; and a compound other than a ...
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WO/2016/043521A1 |
Provided is an adhesive composition comprising a (meth)acrylic acid ester-based monomer and a light-curing acrylic-based polymer resin of a low dielectric monomer, wherein the low dielectric monomer comprises a hydroxyl group-containing ...
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WO/2016/043518A1 |
Provided is an adhesive composition for a touch screen panel, the adhesive composition comprising a (meth)acrylic acid ester-based monomer and a light-curing acrylic-based polymer resin of a cross-linkable monomer, wherein the cross-link...
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WO/2016/039277A1 |
Provided is a composition which has excellent heat resistance and low outgas properties. A composition which contains components (A)-(D) described below and has a mass ratio (A)/(C) of from 3/1 to 8/1. (A) a polyfunctional (meth)acrylate...
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WO/2016/039324A1 |
Provided is a resin composition (G) which contains: a polyurethane resin (E) that is obtained by reacting a hydrogenated polybutadiene polyol compound (A) with a polyisocyanate compound (B), a (meth)acrylate compound (C) having at least ...
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WO/2016/039289A1 |
Provided is a composition which has high curability in a deep portion and high thermal yellowing resistance. A composition which contains the following (A)-(E). (A) a (meth)acrylate having a hydrogenated conjugated diene structure, (B) a...
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WO/2016/038514A1 |
The present invention relates to a fast and elastic adhesive. Said adhesive comprises two components, one including a monomer having an alkoxyalkyl ester group, a thickener, a thixotropic agent and a stabilizing agent. In the other compo...
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WO/2016/036682A1 |
The present invention is a method of curing an adhesive composition positioned at least partially under a light-absorbing layer. The method includes providing an adhesive composition, positioning the light-absorbing layer over a surface ...
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WO/2016/035821A1 |
A resin composition for temporary fixation for forming a temporary fixation material used in a method for working a semiconductor wafer, wherein: the resin composition contains (A) a thermoplastic resin, (B) a thermosetting resin, (C) a ...
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