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WO/2022/210671A1 |
The present invention provides a curable adhesive composition which contains (A) a binder resin that has a reactive functional group and (B) a crosslinking agent that is reactive with the component (A), while having a molecular weight of...
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WO/2022/210405A1 |
Provided is an adhesive containing an aliphatic polycarbonate resin that has an ether structure in the main chain thereof. The adhesive is biodegradable and can be used as a raw material for producing carbon dioxide. The aliphatic polyca...
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WO/2022/210673A1 |
Provided are: a curable adhesive composition including a first curing system, in which a cross-linking agent reacts with a binder resin having a reactive functional group and the reaction proceeds at a temperature of 120°C or less, and ...
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WO/2022/210375A1 |
(Problem) To provide: a method for manufacturing a baseless double-sided adhesive sheet configured such that the transferring of an adhesive layer onto a light release film when the light release film is peeled off is suppressed; and a b...
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WO/2022/205442A1 |
An artificial nail connecting structure and a use method therefor, and an artificial nail assembly. According to the present application, an artificial nail (4) can be reliably connected to a fingernail or a toenail, the fingernail or th...
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WO/2022/206467A1 |
The present invention provides an adhesive sheet. The adhesive sheet in the present invention comprises a substrate layer, and an adhesive layer provided on at least one surface of the substrate layer. The surface roughness of the adhesi...
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WO/2022/207575A1 |
2020-0076WO 55 / 55 Abstract The invention is directed to a sealing element comprising a filled polymeric layer comprising a polymer component comprising a polyvinylchloride resin and at least one ethylene vinyl acetate copolymer 5 and a...
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WO/2022/208815A1 |
An acrylic pressure-sensitive adhesive composition and a pressure-sensitive adhesive tape which are excellent in terms of adhesiveness, high-temperature holding property, load resistance, and impact resistance even in application to poor...
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WO/2022/210277A1 |
An objective of the present invention is to provide a radiation-curable adhesive sheet with which the progress of curing during storage can be suppressed, with which excellent thickness unevenness absorbability and stress relaxation prop...
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WO/2022/210820A1 |
Provided is an electromagnetic wave shield film which makes it possible to reduce transmission loss. The electromagnetic wave shield film according to the present invention is characterized by comprising a protection layer, a shield laye...
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WO/2022/209904A1 |
The present invention relates to a complex comprising: an adhesive body having a long shape, said adhesive body excelling in adhesive strength and having good electrical conductivity in the longitudinal direction of the complex and in 36...
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WO/2022/208813A1 |
The present invention provides a resin composition from which an adhesive layer having various excellent characteristics can be formed. In the case of forming a laminate including the adhesive layer, in order to provide an adhesive sheet...
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WO/2022/208376A1 |
The present disclosure relates to a multifunctional adhesive composition. Further, the present disclosure relates to a process for the preparation of the multifunctional adhesive composition. The multifunctional adhesive composition is u...
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WO/2022/210216A1 |
Provided is an adhesive tape processing method capable of easily separating a base material and an adhesive constituting an adhesive tape, at low cost. Also provided is an adhesive tape processing device for use with such an adhesive tap...
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WO/2022/210703A1 |
An adhesive composition which comprises one or more polymerizable monomers each having a carbon-carbon double bond, an elastomer, and a polymerization initiator. At least some of the polymerizable monomers is a highly polar monomer havin...
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WO/2022/209643A1 |
Provided is an anisotropic light-diffusing adhesive layer that achieves excellent viewing angle expansion. The anisotropic light-diffusing adhesive layer contains an adhesive and an acicular filler. The acicular filler is dispersed in th...
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WO/2022/208317A1 |
A transparent heat resistive adhesive tape with antistatic performance and a method of use thereof are provided. The adhesive tape includes at least a transparent backing film layer, an electrically conductive transparent layer disposed ...
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WO/2022/210672A1 |
Provided is an adhesive sheet including a curable adhesive layer, wherein the curable adhesive layer is one formed from a starting material composition comprising a binder resin (A) having a reactive functional group and a crosslinking a...
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WO/2022/209116A1 |
A thermoplastic resin composition for adhesion use, which is used for adhering two objects of the same type or different types to each other, the resin composition comprising a phenoxy resin and a thermoplastic elastomer and satisfying t...
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WO/2022/211081A1 |
The present invention addresses the problem of providing a multi-layer sheet comprising an adhesive agent layer that contains an acid modified polyolefin and a base material layer that contains a polyphenylene ether, wherein the peeling ...
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WO/2022/209830A1 |
An adhesive sheet (2) is obtained by forming, into a layered configuration, an adhesive composition that contains an acrylic base polymer and a polyfunctional (meth)acrylate having four or more (meth)acryloyl groups in one molecule as a ...
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WO/2022/209152A1 |
The present invention provides adhesive tape for processing a workpiece, the adhesive tape being usable even as a back grinding tape that can handle grinding or reduction of thickness of a semiconductor wafer, and also being usable even ...
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WO/2022/210055A1 |
The present invention pertains to an adhesive sheet having a band shape and provided with an adhesive layer, said adhesive sheet comprising a slanted part formed in a tapering shape such that the width thereof tapers toward one end of th...
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WO/2022/209119A1 |
[Problem] To suppress chipping caused by contact between chips, wherein the contact is due to the bending of the tape, when removing from a grinding table, with the use of a Bernoulli chuck, and then conveying to the next step an adhesiv...
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WO/2022/210454A1 |
The present invention pertains to: an actinic ray-crosslinkable adhesive agent composition containing (A) a block copolymer that is formed of an aromatic vinyl compound and a diene compound and that has a vinyl group in a side chain, (B)...
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WO/2022/208605A1 |
In order to provide an adhesive tape which hardly deforms while satisfying required characteristics expected of adhesive tape, such as adhesive force and holding power, is capable of suppressing stickiness of side surfaces, and is capabl...
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WO/2022/207317A1 |
A dry adhesive article comprising: (i) a substrate comprising a primary surface and (ii) a layer of nanofibers disposed on the primary surface of the substrate in a random orientation, the layer comprising a polyacrylate block copolymer;...
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WO/2022/207460A1 |
The present invention relates to the use of an adhesive strip, the adhesive strip comprising an outer foamed adhesive compound layer having a dielectric constant (according to test A) of at most 2.1 and a density (according to test B) of...
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WO/2022/210638A1 |
An objective of the present invention is to provide a pressure-sensitive adhesive tape that has excellent adhesiveness to a non-smooth surface such as paper and can be easily peeled off without damaging the adherend. The present inventio...
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WO/2022/208814A1 |
The purpose of the present invention is to provide: a rubber-based pressure-sensitive adhesive composition having excellent adhesive force, high-temperature holding properties, and removability in application to various adherends includi...
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WO/2022/210702A1 |
A protective film 10 according to the present invention is applied to a resin substrate 21 when heating and bending the resin substrate 21, and includes a base material layer and an adhesive layer located between the base material layer ...
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WO/2022/210406A1 |
Provided is an adhesive containing an aliphatic polycarbonate resin that has an ether structure in the main chain thereof, the glass transition temperature (Tg) of the aliphatic polycarbonate resin being 5°C or less. The adhesive is bio...
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WO/2022/202321A1 |
The present invention provides a peelable surface protection sheet that can maintain adhesiveness required for protection even when used in a situation in which the surface protection sheet is attached to an object to be protected, and t...
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WO/2022/201656A1 |
A base material film which is provided with a first resin layer that contains a polyester resin, wherein: the polyester resin has an alicyclic structure, while having a melting heat quantity of 2 J/g or more as determined by differential...
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WO/2022/202479A1 |
The present invention provides an electrically debondable adhesive sheet that includes a conductive substrate having a support body, an intermediate layer, and a conduction layer in the stated order, with an electrically debondable first...
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WO/2022/201789A1 |
[Problem] To provide a semiconductor processing adhesive tape capable of suppressing the cracking of chips when peeling off the adhesive tape. [Solution] A semiconductor processing adhesive tape having a base material and an adhesive l...
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WO/2022/201857A1 |
Provided is a surface protective sheet which can maintain the adhesiveness required for protection and can be peeled without causing the breakage or deformation of an adherend during peeling, even when used in such a manner that an objec...
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WO/2022/204124A1 |
An uncured or partially cured, flexible fusion bonded epoxy ("FBE") film for application to a metal substrate, such as an oil and gas pipeline pipe and pipeline pipe weld areas includes an epoxy resin, a curing agent, accelerator, filler...
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WO/2022/202778A1 |
A purpose of the present invention is to provide an adhesive tape capable of exerting excellent adhesive force on a rough surface. Another purpose of the present invention is to provide: a method for immobilizing an electronic device com...
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WO/2022/201613A1 |
An adhesive sheet 1 is for bonding two rigid sheets together. At least one of the two rigid sheets has a contoured surface on a side to be bonded to the other rigid sheet. The adhesive sheet is provided with: a composite adhesive layer 1...
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WO/2022/201767A1 |
Provided is a workpiece handling sheet 1 comprising: a substrate 12; and a resin layer 11 which is laminated on one surface of the substrate 12 and which can hold small workpieces, wherein the resin layer 11 contains 10 mass% or more of ...
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WO/2022/201766A1 |
Provided is a workpiece handling sheet 1 comprising: a substrate 11; and an boundary surface ablation layer 12 which is laminated on one surface of the substrate 11 and which can hold small workpieces and perform boundary surface ablatio...
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WO/2022/202414A1 |
The purpose of the present invention is to provide: a protective tape that has exceptional heat resistance, and that can reliably generate a gas and easily be detached from an adherend such as a semiconductor device even when light has b...
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WO/2022/202502A1 |
An adhesive sheet for jig fixation (1) to be used in a composite sheet for protective film formation equipped with a protective film-forming film, wherein the adhesive sheet for jig fixation is configured by laminating a first adhesive a...
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WO/2022/202028A1 |
The provided optical laminate includes an optical base material and an adhesive layer disposed on the surface of the optical base material. The adhesive layer contains an adhesive composition containing a silane coupling agent. The silan...
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WO/2022/202774A1 |
A purpose of the present invention is to provide an adhesive tape which can maintain high adhesive strength at high temperatures while being easily releasable. Another purpose of the present invention is to provide: a method for fixing a...
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WO/2022/202153A1 |
Provided is an adhesive composition which is suitable for temporarily bonding a bumped semiconductor substrate to a supporting substrate and which gives an adhesion layer that can inhibit or reduce bump deformation caused by an external ...
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WO/2022/201765A1 |
Provided is a workpiece handling sheet 1 comprising: a substrate 12; and an boundary surface ablation layer 11 which is laminated on one surface of the substrate 12 and which can hold small workpieces and perform boundary surface ablatio...
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WO/2022/202271A1 |
A dicing die attach film which comprises a dicing film and a die attach film that is superposed on the dicing film, wherein: a surface of the die attach film has an arithmetic mean roughness Ra1 of 0.05 μm to 2.50 μm, the surface being...
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WO/2022/201788A1 |
[Problem] To provide a semiconductor processing adhesive tape capable of suppressing the cracking of chips when peeling off the adhesive tape. [Solution] A semiconductor processing adhesive tape having a base material and an adhesive l...
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