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WO/2022/210638A1 |
An objective of the present invention is to provide a pressure-sensitive adhesive tape that has excellent adhesiveness to a non-smooth surface such as paper and can be easily peeled off without damaging the adherend. The present inventio...
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WO/2022/208814A1 |
The purpose of the present invention is to provide: a rubber-based pressure-sensitive adhesive composition having excellent adhesive force, high-temperature holding properties, and removability in application to various adherends includi...
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WO/2022/210702A1 |
A protective film 10 according to the present invention is applied to a resin substrate 21 when heating and bending the resin substrate 21, and includes a base material layer and an adhesive layer located between the base material layer ...
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WO/2022/210406A1 |
Provided is an adhesive containing an aliphatic polycarbonate resin that has an ether structure in the main chain thereof, the glass transition temperature (Tg) of the aliphatic polycarbonate resin being 5°C or less. The adhesive is bio...
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WO/2022/202321A1 |
The present invention provides a peelable surface protection sheet that can maintain adhesiveness required for protection even when used in a situation in which the surface protection sheet is attached to an object to be protected, and t...
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WO/2022/201656A1 |
A base material film which is provided with a first resin layer that contains a polyester resin, wherein: the polyester resin has an alicyclic structure, while having a melting heat quantity of 2 J/g or more as determined by differential...
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WO/2022/202479A1 |
The present invention provides an electrically debondable adhesive sheet that includes a conductive substrate having a support body, an intermediate layer, and a conduction layer in the stated order, with an electrically debondable first...
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WO/2022/201789A1 |
[Problem] To provide a semiconductor processing adhesive tape capable of suppressing the cracking of chips when peeling off the adhesive tape. [Solution] A semiconductor processing adhesive tape having a base material and an adhesive l...
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WO/2022/201857A1 |
Provided is a surface protective sheet which can maintain the adhesiveness required for protection and can be peeled without causing the breakage or deformation of an adherend during peeling, even when used in such a manner that an objec...
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WO/2022/204124A1 |
An uncured or partially cured, flexible fusion bonded epoxy ("FBE") film for application to a metal substrate, such as an oil and gas pipeline pipe and pipeline pipe weld areas includes an epoxy resin, a curing agent, accelerator, filler...
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WO/2022/202778A1 |
A purpose of the present invention is to provide an adhesive tape capable of exerting excellent adhesive force on a rough surface. Another purpose of the present invention is to provide: a method for immobilizing an electronic device com...
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WO/2022/201613A1 |
An adhesive sheet 1 is for bonding two rigid sheets together. At least one of the two rigid sheets has a contoured surface on a side to be bonded to the other rigid sheet. The adhesive sheet is provided with: a composite adhesive layer 1...
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WO/2022/201767A1 |
Provided is a workpiece handling sheet 1 comprising: a substrate 12; and a resin layer 11 which is laminated on one surface of the substrate 12 and which can hold small workpieces, wherein the resin layer 11 contains 10 mass% or more of ...
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WO/2022/201766A1 |
Provided is a workpiece handling sheet 1 comprising: a substrate 11; and an boundary surface ablation layer 12 which is laminated on one surface of the substrate 11 and which can hold small workpieces and perform boundary surface ablatio...
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WO/2022/202414A1 |
The purpose of the present invention is to provide: a protective tape that has exceptional heat resistance, and that can reliably generate a gas and easily be detached from an adherend such as a semiconductor device even when light has b...
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WO/2022/202502A1 |
An adhesive sheet for jig fixation (1) to be used in a composite sheet for protective film formation equipped with a protective film-forming film, wherein the adhesive sheet for jig fixation is configured by laminating a first adhesive a...
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WO/2022/202028A1 |
The provided optical laminate includes an optical base material and an adhesive layer disposed on the surface of the optical base material. The adhesive layer contains an adhesive composition containing a silane coupling agent. The silan...
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WO/2022/202774A1 |
A purpose of the present invention is to provide an adhesive tape which can maintain high adhesive strength at high temperatures while being easily releasable. Another purpose of the present invention is to provide: a method for fixing a...
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WO/2022/202153A1 |
Provided is an adhesive composition which is suitable for temporarily bonding a bumped semiconductor substrate to a supporting substrate and which gives an adhesion layer that can inhibit or reduce bump deformation caused by an external ...
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WO/2022/201765A1 |
Provided is a workpiece handling sheet 1 comprising: a substrate 12; and an boundary surface ablation layer 11 which is laminated on one surface of the substrate 12 and which can hold small workpieces and perform boundary surface ablatio...
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WO/2022/202271A1 |
A dicing die attach film which comprises a dicing film and a die attach film that is superposed on the dicing film, wherein: a surface of the die attach film has an arithmetic mean roughness Ra1 of 0.05 μm to 2.50 μm, the surface being...
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WO/2022/201788A1 |
[Problem] To provide a semiconductor processing adhesive tape capable of suppressing the cracking of chips when peeling off the adhesive tape. [Solution] A semiconductor processing adhesive tape having a base material and an adhesive l...
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WO/2022/201790A1 |
[Problem] To provide a pressure-sensitive (PS) adhesive tape for semiconductor processing capable of suppressing cracking of a chip when peeling the PS adhesive tape. [Solution] A PS adhesive tape for semiconductor processing that has ...
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WO/2022/202383A1 |
The present invention pertains to a release sheet having a base material and a release layer formed on the base material. The release layer is formed from a release agent composition containing a silicone-modified acrylic resin (A), a me...
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WO/2022/202160A1 |
A temperature-sensitive adhesive according to the present invention contains an ultraviolet curable side-chain crystalline polymer which is a reaction product of side-chain crystalline polymer and a compound having an ultraviolet curable...
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WO/2022/201687A1 |
A dicing die attach film which has a dicing film and a die attach film layered on this dicing film, wherein the die attach film contains an organic solvent which has a boiling point no less than 100°C and less than 150°C and a vapor pr...
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WO/2022/202659A1 |
Provided is a workpiece processing method in which a workpiece such as a wafer is processed in a state of a layered body obtained by fixing the workpiece to a support body via a temporary fixing material, wherein the workpiece such as a ...
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WO/2022/201858A1 |
Provided is a surface protective sheet in which, even when used in a state of being attached to an object to be protected in a process including a step for treating the object to be protected in a liquid, peeling from an end part as a re...
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WO/2022/202478A1 |
The present invention provides an electrically debondable adhesive sheet that includes a conductive substrate having a support body, an intermediate layer, and a conduction layer in the stated order, with an electrically debondable first...
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WO/2022/196752A1 |
The present invention relates to a semiconductor device manufacturing method including steps 1-3, said method using a double-sided adhesive sheet that has an adhesive layer (X1), a base material layer (Y), and an adhesive layer (X2) in t...
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WO/2022/195899A1 |
In order to provide a pressure-sensitive adhesive tape wherein the leaving of adhesive agent residue is suppressed, the present invention uses a pressure-sensitive adhesive tape having: a substrate 10 that has a base fabric 1 configured ...
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WO/2022/196327A1 |
Provided is a decorative material comprising an adhesive layer and a cholesteric liquid crystal layer in contact with this adhesive layer. The content in this cholesteric liquid crystal layer, per unit volume of the cholesteric liquid cr...
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WO/2022/196298A1 |
A heat-sealable resin composition including an ethylene-vinyl ester copolymer (A) and a tackifying resin (B), in which the content of a constituent unit derived from the vinyl ester included in the ethylene-vinyl ester copolymer (A) with...
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WO/2022/193572A1 |
Provided are a boron nitride heat dissipation film, a preparation method therefor, and an application thereof. Provided is the preparation method for the boron nitride heat dissipation film, comprising the following steps: mixing boron n...
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WO/2022/194716A1 |
The invention is directed to a method for adhesively bonding two substrates, comprising the steps: a) applying a liquid, radiation-curable primer composition onto the surface of a first substrate; b) curing the liquid, radiation-curable ...
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WO/2022/196987A1 |
The present invention relates to an adhesive composition comprising acrylic copolymer having refractive index of 1.55-1.70, and to an adhesive sheet, an optical member, and a display apparatus produced using the adhesive composition.
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WO/2022/196586A1 |
[Problem] To provide: an adhesive composition which has excellent heat resistance, excellent adhesive strength, low relative dielectric constant, low dielectric loss tangent and excellent dielectric characteristics; and a bonding sheet, ...
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WO/2022/196354A1 |
The present invention relates to: a thermally expandable adhesive composition which contains a thermosetting resin (A), thermally expandable particles (B) and an inorganic filler (C), wherein the inorganic filler (C) has an average parti...
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WO/2022/196355A1 |
The present invention pertains to a curable perfluoropolyether adhesive composition that contains: (A) 100 parts by mass of a straight-chain perfluoropolyether compound that has at least two alkenyl groups in one molecule, and that has, ...
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WO/2022/197168A1 |
The present invention relates to an adhesive for a stoma and an adhesive tape for a stoma comprising same. Specifically, the present invention relates to: an adhesive for a stoma, which can be attached to an affected part having a high a...
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WO/2022/196585A1 |
[Problem] To provide an adhesive composition with excellent heat resistance and adhesion strength, with low relative permittivity and dielectric loss tangent, and with excellent dielectric properties, and to provide an adhesive sheet, a ...
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WO/2022/191109A1 |
A bonding sheet according to the present invention contains a matrix resin, solder particles, and a flux agent. With respect to this bonding sheet, the solder particles are dispersed in the matrix resin, and the flux agent is unevenly di...
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WO/2022/191147A1 |
[Problem] To provide: a coating composition that can form a non-adhesive coating layer that demonstrates tight adhesion to various resin base materials, excellent surface hardness, tack resistance, flex resistance, scuff resistance, shri...
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WO/2022/191144A1 |
The present invention provides: a two-pack type curable coating agent which is capable of forming a surface protective layer that has excellent weather resistance, acid resistance, antifouling properties and elongation properties; and a ...
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WO/2022/189577A1 |
The present invention relates to a composition formed of a hot melt adhesive having a colour-forming compound admixed therein. The invention further relates to a substrate or multi-layer substrate construction having the composition appl...
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WO/2022/190808A1 |
Provided is an adhesive tape which has high flame retardancy and flexibility, has a favorable tape appearance, and has favorable workability during use. This adhesive tape comprises a substrate and an adhesive layer disposed on at least ...
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WO/2022/190927A1 |
Provided are: a laminated film having excellent adhesion to metal, a low environmental load, and excellent adhesiveness and ease of unwinding; and a film roll. This laminated film having a resin layer A and a substrate satisfies the foll...
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WO/2022/191212A1 |
This anticorrosion adhesive tape of the present invention is provided with an adhesive layer, does not generate rust in a cyclic corrosion test complying with a cycle D in JIS K5600-7-9, and has adhesion of 20N/25 mm or more after the cy...
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WO/2022/190860A1 |
The present invention addresses the problem of providing: a recyclable base paper for a release paper, excellent in filling properties and capable of forming a uniform release agent layer; and a release paper having a uniform release age...
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WO/2022/191143A1 |
The present invention provides: a two-pack type curable coating agent which is capable of forming a surface protective layer that has excellent weather resistance, acid resistance, antifouling properties and elongation properties; and a ...
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