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WO/1995/033086A1 |
The invention concerns an electrolytic method for continuously and uniformly metallizing or etching metal surfaces, plus a device suitable for carrying out the method. The invention is particularly suitable for the treatment of circuit b...
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WO/1995/032322A1 |
An apparatus for treating a strip such as a steel sheet. A first object is to provide an electrode switching device of a simple construction. A second object is to uniform the flow of the treating liquid around the electrodes. A third ob...
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WO/1995/031590A1 |
The vertical printed circuit boards (LP) are taken on at least side-by-side horizontal paths (TW1 to TW4) through processing baths (BB1 to BB3) arranged in successive and adjacent processing cells (BZ10 to BZ13, BZ20 to BZ23, BZ30 to BZ3...
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WO/1995/031589A1 |
Flat workpieces (W) are conveyed in the vertical position on a horizontal transport path through at least one processing cell (BZ) that contains a processing bath. Vertical slots (S) for the passage of the workpieces (W) are provided in ...
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WO/1995/029352A1 |
A gasket (10; 50) comprises at least one metal sheet (12; 52) which extends generally parallel to sealing surfaces (11a, 13a) of the gasket. The metal sheet has deposited metal (20; 54) thereon forming a functional projection, e.g. to li...
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WO/1995/027813A1 |
The invention concerns a palladium colloid solution which, in addition to a palladium compound, a protective colloid for stabilising the colloid and a reducing agent, additionally contains precious metals from the group including rhodium...
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WO1995025908A1 |
Let h equal the height of a ridge (2b) of bearing alloy layer (2) constituting a sliding bearing (1), y the thickness of an intermediate layer (3), and t the thickness of an overlaying layer (4) at an apex portion of the ridge. The heigh...
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WO/1995/020692A1 |
The current density used in a process for the electrolytic treatment of articles is of crucial importance to the cost effectiveness of that process. Normally, only low or medium current densities are used, since the speed with which spen...
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WO/1995/018849A1 |
Methods for cracking hydrocarbons in reactor systems having improved resistances to carburization and coking. The reactor system comprises a steel portion having provided thereon a Group VIB metal protective layer to isolate the steel po...
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WO/1995/017534A1 |
A screen material is described which is formed by cladding, by means of electroplating, a structure composed of strands (4) or fibres; the structure may consist of a knit, woven or nonwoven material or alternatively of strands (4) or fib...
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WO/1995/014121A1 |
The invention is a metal tube such as a heat exchanger tube which has been treated by in situ electrodeposition to repair one or more degraded sections. The repaired metal tube section has an electroformed structural layer which has an u...
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WO/1995/014122A1 |
A process for repairing degraded sections of metal tubes, such as heat exchanger tubes, by in situ electroforming utilizes a probe containing an electrode (25). The probe is movable through the tube (13) to the site of degradation and is...
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WO/1995/014314A1 |
An interconnection contact structure assembly including an electronic component (102) having a surface and a conductive contact terminal (103) carried by the electronic component (102) and accessible at the surface. The contact structure...
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WO/1995/013408A1 |
A device is proposed for the electrolytic separation of metals in a metal recovery cell with a rotating cathode system. The latter comprises a supporting cylinder (11) with at least one slit (21) and at least one contact chamber (25) beh...
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WO/1995/009939A1 |
The device for the selective treatment of the surface of workpieces by flooding the workpieces with a treatment liquid comprises a bath (1), interchangeable holders (10) in the bath for the workpieces, at least one pipe (15-21) leading i...
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WO/1994/026958A1 |
The present invention is directed to an improved composition and process for preparing a non-conductive substrate for electroplating. The composition comprises 0.1 to 20 % by weight carbon (e.g. graphite or carbon black) having a mean pa...
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WO/1994/026435A1 |
In a method of continuously coating a conductive substrate such as brass wire (10) to produce a desired cross-sectional size of coated material, the wire is drawn through a first die to produce an oversize wire, electroplate in a bath (3...
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WO/1994/024340A1 |
In order to provide the running surfaces of the cylinders of internal-combustion engines with a reinforcing coating, e.g. a nickel dispersion layer including silicon carbide, using a through-flow process, the invention proposes a device ...
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WO/1994/021097A2 |
Drum or smooth side-treated metal foil can be used either as an intermediate product for use in the manufacture of laminate or as a part of the finished laminate to be used in the manufacture of multi-layer printed circuit boards (PCB) p...
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WO/1994/012688A1 |
A sliding element has a bearing metallic layer (2) made of aluminium or an aluminium alloy which bears on its side facing the sliding surface a galvanically produced tin layer (4) bonded to the bearing metallic layer (2) by a very thin a...
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WO/1994/011183A1 |
A method of making a perforated tubular member by supporting a thin stainless tube (10) on a mandrel; machine engraving funnel-shaped holes (12) through the tube (10) and removing the machine-engraved tube from the mandrel. An alternate ...
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WO/1994/010360A1 |
In a device for electrolytically coating one side of metal strips (2), the metal strips to be coated are guided around a rotary cathodic current roller (1), which they contact, and a partially cylindrical, insoluble anode (3) is arranged...
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WO/1994/010361A1 |
A method and apparatus are disclosed for producing copper wire by electrolytically engrossing a copper starting wire (13). The invention utilizes an electrolytic tank (10) employing a pair or pairs of shafts (14) positioned externally of...
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WO/1994/005827A2 |
A dry contact electroplating structure is disclosed. The structure includes a base member for immersion within an electroplating solution. The base member has a central aperture defined by an aperture perimeter formed within the base mem...
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WO/1994/003654A1 |
A process and electrolyte for forming mound-free coatings of zinc-iron alloy on metal, e.g. steel, sheet and strip comprises passing the article to be plated through an electrolyte bath containing chlorides of iron and zinc and from abou...
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WO/1993/020264A1 |
In order, in lamellar material or lamellar parts for plain bearings, to form a bonding layer of pure silver between a single-layer or multi-layer substrate material or part and an electrolytically deposited sliding-layer alloy, the inven...
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WO/1993/017154A1 |
A process for producing a sliding bearing which is provided with a lead alloy overlay and excellent in fatigue resistance, said process comprising the steps of forming on a bearing metal layer a substrate layer formed of either lead or a...
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WO/1993/017153A1 |
The invention concerns a process for metallizing non-conducting surfaces, characterized by the following steps: a) caustic cleaning, where appropriate, b) conditionning using a chelate former and/or a cationic surface-active substance, c...
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WO/1993/011282A1 |
In a device for the electrolytic deposition of metal on the metal strips (1) forming the cathode, which are taken through a gap in an electrolyte (3) between two flat or rod-like parallel anodes (2), the proposal is for edge masks (4) to...
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WO/1993/003204A1 |
The invention concerns an aqueous acid bath for the galvanic deposition of bright, ductile and smooth copper coats, the bath being suitable for the production of decorative coats of articles as well as for reinforcing conductor tracks in...
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WO/1993/003206A1 |
The installation comprises at least one tank (2) filled with electrolyte, a plurality of rolls, having their lower portions immersed in the electrolyte, at least one submerged anode (40), means for controlling the feed of the metal strip...
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WO/1993/000456A1 |
Novel aqueous accelerating solutions and methods for their use in connection with direct electroplating of dielectric basis materials are disclosed and claimed. The accelerating solutions are mildly basic aqueous solutions including dilu...
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WO/1992/021794A2 |
The electrode is placed in a housing which defines a chamber (78) and has one wall consisting of a membrane (77) allowing ions to pass therethrough. The housing has an opening (100) for feeding an electrolyte to the chamber and another (...
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WO/1992/020840A1 |
A process for selectively plating separate surfaces of a component. The process includes electroplating a first material onto a first surface, applying a masking agent to the component, tumbling a plurality of components to remove the ma...
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WO/1992/019794A1 |
A process for electroplating a conductive metal layer to the surface of a nonconductive material comprising pretreating the material with a carbon black dispersion followed by a graphite dispersion before the electroplating step.
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WO/1992/019779A1 |
Disclosed is an oxidative process for recovering rhodium catalyst values from ''tars'' formed during the preparation of acetic anhydride by the rhodium catalyzed carbonylation of a mixture of methyl iodide and methyl acetate and/or dimet...
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WO/1992/019091A1 |
Described is a process for the metallization of non-conductors, and the use of monomeric or polymeric nitrogen-containing quaternary salts or chelating agents in the process.
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WO/1992/017627A1 |
Disclosed is a process for selective metal deposition comprising of the steps of: a) formation of an initial surface on a substrate (32), said initial surface being comprised of at least two layers of which the uppermost is inert, b) exp...
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WO/1992/014942A1 |
Bearings are described having overlay coatings. The overlay coating comprises a soft metallic matrix having incorporated therein from 0.05 to 2 wt% of a hard, non-metallic material, said material exhibiting a Vickers hardness (Hv) of fro...
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WO/1992/013981A2 |
A new family of palladium based metallization catalyst compositions is disclosed. These catalysts are used in a process for the selective deposition of a metal on a substrate when a metallization mask (i.e. a plating resist) is used over...
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WO/1992/013118A1 |
An apparatus for use in a radial cell-type electrodeposition cell having a radial cathodic conductor roll (18) with a central conductor band for improving the transfer of electric current between the to-be-plated strip and the conductor ...
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WO/1992/012278A1 |
A method to electrochemically deposit semiconductors and for the electrochemical formation of epitaxial thin-film, single-crystalline compound semiconductors comprising alternating electrodeposition of atomic layers of selected pairs of ...
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WO/1992/003599A1 |
The present invention provides a method for producing high density electronic circuit boards (10) comprising the steps of depositing a layer of a first metal (26) upon a layer of foil (20) to produce a composite (29) then attaching the c...
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WO/1992/000405A1 |
The present invention relates to a technique for improving the tarnish and oxidation resistance of copper and copper based alloy materials. A chromium-zinc coating is electrolytically applied to copper or copper based alloy surface using...
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WO/1991/019835A1 |
The device disclosed has a carrier (2) which conveys the strip (1) in the longitudinal direction. Facing the carrier are electrolyte-outlet ports (3) through which electrolyte, fed by a pump (4), is sprayed on to the strip (1), which is ...
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WO/1991/019024A1 |
This invention relates to electrodeposited copper foil having an elongation measured at 180 �C in excess of about 5.5 %, an ultimate tensile strength measured at 23 �C in excess of about 60,000 psi, and a matte-side Rtm in the range ...
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WO/1991/011545A1 |
Highly wear-resistant sliding bearings with good sliding properties are difficult to manufacture by electrochemical deposition of the sliding alloy, because the corresponding electrolyte solutions are unstable. Conventional sliding alloy...
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WO/1991/007526A1 |
A method for the direct electroplating of a non-conducting substrate and plated substrates so produced are disclosed wherein the non-conducting substrate is first treated with a non-acidic aqueous salt solution containing a micro-fine co...
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WO/1991/004358A1 |
Copper conductive foil (20) for use in preparing printed circuit boards is electrodeposited from an electrolyte solution (18) containing copper ions, sulphate ions, animal glue and thiourea. The thiourea operates to decrease the roughnes...
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WO/1991/003920A2 |
In a process for producing plated-through single- or multi-layered printed circuit boards comprising a polymer base or ceramic which is coated, possibly on both sides, with at least one photoresist layer which temporarily exposes the ele...
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