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WO/2001/024239A1 |
The acid copper sulfate solutions used for electroplating copper circuitry in trenches and vias in IC dielectric material in the Damascene process are replaced with a type of plating system based on the use of highly complexing anions (e...
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WO/2001/023645A1 |
An electrodeposition method for the production of multilayer structures comprising substrates provided with layers of thin metal films of Co and Au by means of applying a current between two electrodes having a potential therebetween, im...
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WO/2001/019606A1 |
This invention relates to a treated copper foil, comprising: a copper foil with a layer of zinc oxide adhered to the base surface of at least one side of said copper foil, said layer of zinc oxide having a thickness of about 3 Å to abou...
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WO/2001/020647A2 |
This invention relates to a method for fabricating high performance chip interconnects and packages by providing methods for depositing a conductive material in cavities of a substrate in a more efficient and time saving manner. This is ...
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WO/2001/018859A1 |
A method and apparatus for fabricating an electroplating mask for the formation of a miniature magnetic pole tip structure. The method incorporates a silylation process to silylate photoresist after creating a photoresist cavity or trenc...
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WO/2001/016403A1 |
The invention relates to a novel galvanizing solution for the galvanic deposition of copper. Hydroxylamine sulfate or hydroxylamine hydrochloride are utilized as addition reagents and added to the galvanizing solution during the galvanic...
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WO/2001/016404A1 |
The invention relates to a process for providing objects, especially objects having nonuniform shapes, with a metal plating. More specifically it relates to electrolytically plating objects, wherein the objects comprise areas where plati...
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WO/2001/014135A1 |
Electrolytic copper foil with carrier foil, which can easily form in a printed circuit board through holes (PTH) by a laser method, interstitial via holes (IVH) and blind via holes (BVH), and which is obtained by forming an organic surfa...
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WO/2001/014618A2 |
An apparatus and method for electroplating a material layer onto a wafer is disclosed. The apparatus comprises a wafer support for maintaining a wafer within an electrolyte solution during electroplating. A probe, proximate the wafer sup...
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WO/2001/012882A1 |
The invention relates to an arrangement enabling a liquid (2) to flow evenly around a surface of a sample (3). Said arrangement has a flow chamber (1) through which a liquid (2) flows via inlet and outlet pipes (7, 8). The sample (3) can...
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WO/2001/013416A1 |
The present invention provides a method and apparatus for plating a conductive material to a substrate and also modifying the physical properties of a conductive film (18b, 18c) while the substrate is being plated. The present invention ...
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WO/2001/011098A2 |
Method and system for controllable deposit of copper onto an exposed surface of a workpiece, such as a semiconductor surface. A seed thickness of copper is optionally deposited onto the exposed surface, preferably using oxygen-free liqui...
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WO/2001/011114A1 |
The invention relates to a method for producing improved cold rolled strip which is capable of being deep drawn or ironed and which has a carbon content of less than 0.5 wt. %. The invention also relates to a cold rolled strip that can b...
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WO/2001/009410A1 |
A process for cleaning an electrically conducting surface (3) by arranging for the surface to form the cathode of an electrolytic cell in which the anode (1) is maintained at a DC voltage in excess of 30V and an electrical arc discharge ...
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WO/2001/007687A1 |
A plating method capable of performing planarization with a quality higher than conventional, comprising dipping an object (10) to be processed and an electrode plate (20) in an aqueous solution containing ions of a target metal, deposit...
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WO/2001/007685A2 |
The invention concerns a method for continuous nickel-plating of an aluminium conductor (1) comprising a pre-treatment step P which consists in promoting the adherence of the nickel coating and an electrolytic nickel-plating step N. The ...
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WO/2001/004928A2 |
A plating apparatus (100) and methodology is disclosed that is particularly useful in improving the plating rate, improving the plating of via holes, improving the uniformity of the plating deposition across the surface of the wafer (102...
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WO/2001/004386A1 |
The invention relates to a hard-chrome plated layer, especially for a piston ring. The inventive hard-chrome plated layer is substantially produced on the basis of an electrolyte that contains hexavalent chrome. The layer is interspersed...
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WO/2001/004385A1 |
The invention relates to a device and method for the partial electrochemical treatment of bars (10) in dipping bath installations. Said device and method aims to solve the problem that the bars (10) which are held in various positions by...
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WO/2001/004387A1 |
A lift and rotate assembly (200), for use in a workpiece processing station (400), which includes a body (210) having a slim profile and pins (250) located on opposite sides for mounting the assembly onto a tool frame (100). The lift and...
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WO/2001/002121A1 |
A joining structure for metal members, which joins a first metal member and a second metal member together by soldering, wherein at least one of the first and second metal members are SnZn-alloy-plated, and an SnAg alloy is used as a sol...
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WO/2000/077278A1 |
A method and apparatus for electroplating material, such as copper, into substrate formations is disclosed that substantially suppresses the electroplating of the material on the field of the substrate along the substrate surface plane. ...
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WO/2000/075402A1 |
A plating tool cell anode for venting unwanted gases from a fluid plating solution. In a first embodiment, the solution is introduced into a chamber, defined by the plating tool cell (10), by fluid inlet (12) and contacts the anode (50)....
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WO/2000/071921A2 |
This invention incorporates a new process and structure for manufacturing castellation via in plastic chip carrier. It allows the creation of uniform side wall contacts in the shape of half-cylinders, devoid of any burrs and power dust p...
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WO1999040615A9 |
A method for filling recessed micro-structures (505) at a surface of a microelectronic workpiece (500), such as a semiconductor wafer, with metallization is set forth. In accordance with the method, a metal layer is deposited into the mi...
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WO/2000/063465A1 |
This invention is to provide environmentally functional active carbon and its method of manufacturing having improved adsorption capability against disease-source bacteria and microbes with prominent anti-bacterial and sterilizing effect...
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WO/2000/061498A2 |
A reactor for electrochemically processing at least one surface of a microelectronic workpiece is set forth. The reactor comprises a reactor head including a workpiece support that has one or more electrical contacts positioned to make e...
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WO/2000/059727A1 |
A gravure printing roller comprises a body or shell (15) moulded from syntactic compositions comprising microbeads of a plastic, glass or ceramic material in an e.g. polyurethane matrix. The shell (15) is machined to the required size an...
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WO/2000/059682A1 |
The present invention provides a method and apparatus that plates/deposits a conductive material on a semiconductor substrate (2) and then polishes the same substrate (2). This is achieved by providing multiple chambers (100, 200) in a s...
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WO/2000/057743A2 |
A system for setting a gemstone in a hollow jewellery piece, comprises means for creating a metallic attachment region secured to a surface of the gemstone, and a bonding means for bonding the at least one metallic attachment region to a...
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WO/2000/056453A1 |
The invention relates to a method for producing a catalyst. A layer consisting of catalytically active metallic material is deposited on a flat substrate by means of electrodeposition, said substrate being immersed in an electrolyte cont...
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WO/2000/056452A1 |
The invention relates to a method for producing a catalyst. Catalytically active material is electrochemically deposited onto a substrate, whilst the substrate is immersed in an electrolyte containing the catalytically active material. A...
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WO/2000/056953A1 |
The present invention relates to a process for electrolytic coating of a substratum, especially a piston ring, with a ceramic chrome layer, the substratum being arranged at an electrode connected to voltage and chromium ions for coating ...
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WO/2000/055888A1 |
The invention relates to a device for treating substrates, especially semiconductor wafers, with at least one processing container that is provided with an opening which can be closed from the exterior during the treatment with the subst...
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WO2000020662A9 |
Methods for depositing a metal into a micro-recessed structure in the surface of a microelectronic workpiece are disclosed. The methods are suitable for use in connection with additive free as well as additive containing electroplating s...
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WO/2000/049206A1 |
A continuous band plating device capable of providing a glossy and beautiful plated surface, wherein an anode is not provided in a continuous band (80) rising section at the final-stage cell (13) of a plating tank (10), nor is provided a...
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WO/2000/045625A2 |
The invention relates to a method for the direct electroplating of through holes in two-layer printed circuit boards and multilayer printed boards, consisting of the following steps: a) creation of holes in the copper-coated boards; b) o...
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WO/2000/044042A1 |
The invention relates to a method for galvanically forming conductor structures of high-purity copper on surfaces of semiconductor substrates (wafers) (1) during the production of integrated circuits, said semiconductor substrates being ...
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WO/2000/041518A2 |
The present invention provides plating solutions, particularly copper plating solutions, designed to provide uniform coatings on substrates and to provide substantially defect free filling of small features formed on substrates with none...
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WO/2000/040784A2 |
In an examplary embodiment, the method comprises the steps of providing a metallic article having an external surface with an oxide thereon; removing at least part of the oxide from the external surface of the article; and placing a coat...
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WO/2000/040779A1 |
The invention is directed to an electroplating apparatus for selectively depositing tin/lead solder bumps at a high deposition rate. The apparatus comprises a reactor bowl (35) containing an electroplating solution having free ions of ti...
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WO/2000/038218A2 |
A device and method for treating substrates, especially semiconductor wafers, used to expel gas bubbles that are enclosed in a substrate. The inventive device comprises a process container with a container wall and a substrate holder tha...
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WO/2000/037716A1 |
A plating apparatus (4) for forming a plating film with a uniform thickness on a semiconductor wafer, comprising a plating bath (15) filled with a plating solution, a first O-ring (17) provided in the upper part of the plating bath (15) ...
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WO/2000/036177A1 |
A coated steel wire (10) with a bright looking, preferably colored surface has a steel core (12) and this steel core (12) is covered with an intermediate coating layer (14) which give the brightness to the steel wire. The steel wire is f...
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WO/2000/032835A2 |
The present invention provides an electro-chemical deposition system that is designed with a flexible architecture that is expandable to accommodate future designs and gap fill requirements and provides satisfactory throughput to meet th...
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WO/2000/033625A1 |
A process for forming a conductive layer on a substrate, comprising the steps of depositing ink on the substrate by means of lithographic printing to form a seeding layer, and depositing a first electrically conducting layer on the seedi...
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WO/2000/032848A2 |
The present invention provides a bladder assembly (130) for use in an electroplating cell (100). The bladder assembly (130) comprises a mounting plate (132), a bladder (136), and an annular manifold (146). One or more inlets (142) are fo...
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WO/2000/032849A1 |
This invention comprises a driven conveyor for transporting work pieces into one or more flood plating cells for electroplating a metal onto the planar surfaces and surfaces of the through holes of the work piece. An electrolyte solution...
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WO/2000/032850A1 |
A plating machine comprising a plating unit and a control unit which are installed in separate rooms so that works which are the dirty polluting ones of maintenance are conducted in the room where the control unit is installed as much as...
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WO/2000/030188A1 |
The invention relates to a battery sheath made of a cold-rolled sheet which has been submitted to a forming process, as well as to a method for producing battery sheaths. According to said method, a coating composed of Ni, Co, Fe, Sn, In...
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