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WO/2000/029647A2 |
Disclosed is a method for producing stratified composite materials that exhibit optimum properties during their entire service life. The stratified composite material has a carrier layer, a bearing metal layer, an intermediate layer and ...
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WO/2000/026443A2 |
The present invention deposits a conductive material from an electrolyte solution to a predetermined area of a wafer. The steps that are used when making this application include applying the conductive material to the predetermined area...
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WO/2000/025961A1 |
A component (10) for use in manufacturing articles, such as printed circuit boards, comprising a laminate constructed of a sheet of copper foil (20) that, in a finished circuit board, constitutes a functional element, and a sheet of carb...
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WO/2000/026444A1 |
The invention is directed to the use of copper as via and interconnect structures for an integrated circuit. The process in accordance with a preferred embodiment produces an interconnect layer of continuous copper with superior adhesion...
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WO/2000/022193A2 |
A layer of a metal is electroplated onto an electrically conducting substrate having a generally smooth surface with a small recess therein, having a transverse dimension not greater than about 350 micrometers, typically from about 5 mic...
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WO/2000/019936A1 |
The invention relates to a method for producing prosthetic moulded parts for dental use with the aid of galvanic metal deposition, whereby said deposition occurs at least partially by means of a pulse current. Preferably, the deposition ...
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WO/2000/020663A1 |
A substrate plating device which can form a plating layer on a sheet surface and store the substrate without being exposed to the atmosphere until the next process. A substrate plating device which can continuously introduce, one by one,...
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WO1999064647A9 |
Simultaneous non-contact plating and planarizing of copper interconnections (181) in semiconductor wafer manufacturing is performed by providing relative motion between a bipolar electrode (510, 570) and a metallized surface of a semicon...
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WO/2000/014308A1 |
A substrate plating device capable of using an insoluble anode and replenishing metal ions automatically; a substrate plating device capable of making uniform a primary current distribution between a cathode and an anode and downsizing t...
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WO/2000/014306A1 |
A method for plating a substrate for the copper damascene wiring which comprises plating with copper a surface of a substrate having fine slots and holes for wiring formed thereon, to thereby fill the slots and holes with a plated copper...
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WO/2000/014307A1 |
A method of manufacturing a pellistor comprises providing a porous catalyst layer (11) on a heater by electrodepositing material from a mixture containing the catalyst and a structure-directing agent in an amount sufficient to form an ho...
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WO/2000/010797A1 |
A light diffuser is fabricated by first producing a metal shim submaster (30) or other high temperature resistant diffuser having a surface relief structure on one surface. A glass substrate material (56) is heated to a suitable temperat...
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WO/2000/011245A2 |
According to the invention, rod-shaped objects (10) (bars having different lengths and diameters) are partially treated electrochemically (electroplating, etching) in a dip facility in a device. Stationary tubular electrodes (30) are loc...
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WO/2000/011679A2 |
It is difficult to transmit large processing current on the surfaces of printed circuit boards (L) using clamp-type contact organs ( 6, 7). In order to solve said problem, contact elements (15, 16) having one or more contact surfaces (26...
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WO/2000/010200A1 |
A method for plating through a simple manufacturing process a semiconductor wafer (W) so as to efficiently fill a fine recess (42) for interconnection made in the wafer (W) with a plating metal (43) having little voids and immune to cont...
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WO/2000/007753A1 |
In twin roll casting of steel strip, molten steel is introduced into the nip between parallel casting rolls (16) to create casting pool (30) supported on casting surfaces (16A) of the rolls and the rolls are rotated to deliver solidified...
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WO/2000/007229A1 |
The invention presents methods and systems for plating conductive patterns which at least result in a high uniformity and avoid parasitical plating effects. A plating system is disclosed for plating conductive patterns formed at a first ...
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WO/2000/005775A1 |
The invention concerns a bipolar collector for a solid polymer electrolyte fuel cell whereof the electronic conduction is provided by uniformly distributed metal cylinders (C), and whereof the tips penetrate into the electrodes. The mini...
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WO/2000/005436A1 |
Circumferential cell device for electrodeposition on metal strips, comprising a drum (1) for driving the strip (20) to be coated, a recess (30) which is substantially semi-cylindrical, coaxial and concentric with the said drum, and on wh...
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WO/2000/005747A2 |
A metallized structure (20) for use in a microelectronic circuit is set forth. The metallized structure comprises a dielectric layer, and a low-Me concentration, copper-Me alloy layer (40) disposed exterior to the ultra-thin film bonding...
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WO/2000/003067A1 |
An improved anode, (114) cup (16) and conductor assembly (122) for a reactor vessel (100) includes an anode assembly (117) supported within a cup (16) which holds a supply of process fluid. The cup (16) is supported around its perimeter ...
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WO/2000/003071A1 |
An apparatus for electroplating a workpiece wherein the apparatus includes a workpiece holding structure (260) having a workpiece support (120) with at least one surface being engaged to a front side of the workpiece and at least one ele...
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WO/2000/000673A1 |
Method for producing a nickel foam having a specific rate of between 200 and 400 g/m?3¿, at least comprising the steps of: providing a base foam having a conductive surface; nickel being electroplated in an electroplating bath, succes...
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WO/2000/001208A1 |
Products and assemblies are provided for socketably receiving elongate interconnection elements, such as spring contact elements, extending from electronic components, such as semiconductor devices. Socket substrates are provided with ca...
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WO/2000/000672A2 |
The invention relates to a galvanic bath, to a method for precipitating chromium onto objects using said galvanic bath, and to the use of this method for producing structured hard chromium layers on machine parts. The galvanic bath conta...
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WO/1999/067448A1 |
A freely detachable anode (7) for continuously applying electroplating to a blank plating sheet such as a steel strip, capable of avoiding the occurrence of local non-conduction portions by a plurality of recess portions formed in the an...
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WO/1999/066106A2 |
A method and apparatus for electroplating at least a part of the surface area of an article (10) with a metal coating is described, the method including the steps of: placing the article (10) in a vessel (30), the vessel being provided w...
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WO/1999/061183A2 |
The invention relates to a coated metal powder which is especially suitable for metallic workpieces which can be produced by powder metallurgy and which has at least one essentially pure, even and non-porous metallic coating, said coatin...
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WO/1999/060189A2 |
The invention relates to a method for metal coating of substrates with polymer surfaces in the production of printed boards, more particularly, printed boards with micro-orifices and fine structures, by applying an electrically conductiv...
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WO1999052336B1 |
A method of providing conductive tracks (14) on a printed circuit (10) by electro-plating conductive tracks (14) which have been produced by printing them onto a substrate (12), comprising coating a substrate (16) carrying the printed tr...
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WO/1999/057448A1 |
A multi-layer engine bearing (26) includes a steel backing (36) having a liner (38) of bearing metal of either copper-lead or aluminum alloys formed on the backing (36) and a thin layer (44) of either copper or nickel plated on the liner...
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WO/1999/057342A1 |
A method and a device for plating a substrate capable of filling a material with a small electrical resistance such as copper or copper alloy into fine recesses such as fine wiring grooves solidly, uniformly and with flat surfaces; speci...
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WO/1999/055937A1 |
The invention concerns a device (20) for electrodeposition of a metal coating on a large dimension rotational part (10) acting as cathode, and whereof the surface to be coated comprises at least an outer surface portion (14) of said rota...
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WO/1999/054527A2 |
The invention provides an apparatus and a method for achieving reliable, consistent metal electroplating or electrochemical deposition onto semiconductor substrates. More particularly, the invention provides uniform and void-free deposit...
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WO/1999/054920A2 |
The invention generally provides an apparatus and a method for electro-chemically depositing a uniform metal layer onto a substrate. More specifically, the invention provides an electro-chemical deposition cell for face-up processing of ...
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WO/1999/053123A1 |
A metal tube armored linear body, which does not damage a linear body or the like enclosed by a metal tube and enables repairing of defects in the metal tube; a metal tube which armors a linear body; and a method and an apparatus for man...
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WO/1999/047731A1 |
This invention employs a novel approach to the copper metallization of a workpiece, such as a semiconductor workpiece. In accordance with the invention, an alkaline electrolytic copper bath (35) is used to electroplate copper onto a seed...
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WO/1999/046430A1 |
Outside parts of cooktops and ovens, such as tops or fronts are traditionally manufactured in enamelled steel. There is a need to manufacture such parts in stainless steel. This has hitherto required special tools and special pressing op...
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WO1999025904A9 |
Apparatus for treating the surface of a substrate, the apparatus comprising a clamshell (32) mounted on a rotatable spindle (40). The clamshell comprises a cone (34), a cup (36) and a flange (48). The flange (48) has apertures (50) which...
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WO/1999/045176A2 |
Treated electrolytic copper foil wherein the shiny side of the raw foil is modified and smoothed by an electrodeposited copper gilding layer, a copper-clad laminate produced with such foil, and an electrical circuit produced from such a ...
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WO/1999/045170A1 |
A substrate plating device permitting a continuous series of plating and post-plating processing in the same facility which is provided therein with a contaminated zone and a clean zone divided by a partition and each capable of independ...
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WO/1999/043860A1 |
A surface-treated steel wire for reinforcing structures for articles of manufacture made of vulcanized elastomeric material, in which the said wire is coated with a layer of metal alloy, wherein the said alloy is a zinc/manganese binary ...
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WO/1999/041434A2 |
An apparatus for plating a conductive film directly on a substrate with a barrier layer on top includes anode rod (1) placed in tube (109), and anode rings (2, and 3) placed between cylindrical walls (107, 105), (103, 101) respectively. ...
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WO1999025905A9 |
An apparatus for electroplating a wafer surface includes a cup (34J) having a central aperture defined by an inner perimeter (A25), a compliant seal (F25) adjacent the inner perimeter, contacts (D25) adjacent the compliant seal and a con...
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WO/1999/040241A2 |
The electroplating process of the present invention is a cyclical operation having at least three essentially independent steps in each cycle of operation with the independent steps carried out in sequence and consisting of stirring, sed...
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WO/1999/037831A1 |
A method for tin-coating the internal surface of a copper tube followed by consecutive degradations until its end dimension is achieved. In this way, a cohesive tin layer is achieved, with excellent adherence and controllable thickness, ...
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WO/1999/036595A1 |
An article which possesses a first color when viewed from a first angle (12) to its surface and a second color when viewed at a second angle (16) to its surface, is prepared by a process including electrodepositing on a substrate (2) a m...
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WO/1999/035309A1 |
A plating jig of a wafer capable of completely sealing an individual power feed pin from a plating solution by a simple construction, comprising a plurality of power feed pins and a plurality of clamp mechanisms (13) each being provided ...
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WO/1999/031300A2 |
A water deposition bath is used for homogeneous electrolytic deposition of copper coatings, more particularly, on printed boards. Said bath contains at least one copper ion source, at least one compound enhancing the electric conductivit...
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WO/1999/031302A1 |
A process for manufacturing a printed circuit that replaces tin and/or tin-lead electroplating with tin-nickel based electroplating. The process includes printing a desired circuitry pattern onto a resist-coated copper-clad substrate. A ...
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