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WO/1999/031299A1 |
Wafer contact electrode assemblies (24) useful for supporting a wafer surface to be electroplated are disclosed herein. These fingers (235) provide electrical contact necessary for providing electric power between the wafer (55) and a co...
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WO/1999/029933A1 |
Defects in metal strips in a continuous electroplating process caused by surface anomalies in the conductor roll are reduced and/or eliminated by spraying a large volume water on the electroplated surface before it contacts the conductor...
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WO/1999/025902A1 |
An anode includes an anode cup (202), a membrane (208) and ion source material (206), the anode cup (202) and membrane (208) forming an enclosure in which the ion source material (206) is located. The anode cup (202) includes a base sect...
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WO/1999/025903A1 |
An apparatus (30) for depositing an electrical conductive layer on the surface of a wafer (38) includes a virtual anode (10) located between the actual anode (62) and the wafer (38). The virtual anode (10) modifies the electric current f...
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WO1999014401A9 |
A cathode current control system employing a current thief (95) for use in electroplating a wafer (55) is set forth. The current thief (95) comprises a plurality of conductive segments (130) disposed to substantially surround a periphera...
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WO/1999/025004A1 |
A fabrication tool integrates one or more electrodeposition stations (14') with a CMP apparatus (16'). The tool may transport substrates from the electroplating stations to the CMP apparatus without an intervening cleaning step. In addit...
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WO/1999/024647A1 |
A process is provided for producing an abrasive coating on a substrate (14) surface by applying a bond coat (15) by low pressure plasma spraying and anchoring to the bond coat (15) abrasive particles (17) by electroplating and embedding ...
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WO/1999/019542A1 |
Continuous electrolytic tin plating is accomplished in a bath containing 90-160 g/L sulfuric acid, 40-70 g/L tin ion and a grain refiner, at a speed of 900-1600 feet per minute and a current density as much as 1500 amperes per square foo...
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WO/1999/019544A1 |
A plating system (10) and method are provided for electroplating silicon wafers with copper using an insoluble anode (13) wherein the electrolyte is agitated or preferably circulated through an electroplating tank (11) of the system and ...
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WO/1999/019543A1 |
A method for producing highly efficiently a high-precision very small metal ball such as a Cu ball having an outer diameter of not greater than 1 mm, comprising the steps of cutting a metal wire having a diameter not greater than 0.3 mm ...
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WO/1999/016689A1 |
A semiconductor processing apparatus is set forth. The processing apparatus includes an input section (12) having an opening (32) through which a carrier (16) supporting a plurality of semiconductor wafers (W) is inserted. The semiconduc...
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WO/1999/017344A1 |
An apparatus (10) for use in processing a workpiece (W) to fabricate a microelectronic component is set forth. The apparatus comprises a process container (14) having a process fluid (38) therein for processing the workpiece and a workpi...
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WO/1999/017355A1 |
A semiconductor processing workpiece support and process which includes a detection subsystem that detects whether a wafer or other workpiece is present. The preferred arrangement uses an optical beam emitter and an optical beam detector...
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WO/1999/016935A2 |
A simplified process and apparatus for electrodepositing a bond-enhancing copper treatment layer on a surface of copper foil, preferably wherein a single treatment layer is uniformly applied on raw copper foil using a current density of ...
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WO/1999/016936A1 |
A system for electroplating a semiconductor wafer which comprises a first electrode in electrical contact with the semiconductor wafer (55) and a second electrode. The first electrode and semiconductor wafer (55) form a cathode. The seco...
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WO/1999/015714A2 |
An electrolytic process for metal-coating the surface of a workpiece of an electrically conductive material, which process comprises: i) providing an electrolytic cell with a cathode comprising the surface of the workpiece and an anode; ...
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WO/1999/014404A1 |
Deposition of metal in a preferred shape, including coatings (206) on parts (204), or stand-alone materials (300), and subsequent heat treatment (106) to provide improved mechanical properties. In particular, the method gives products wi...
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WO/1999/010566A2 |
A processing chamber for depositing and/or removing material onto/from a semiconductor wafer when the wafer is subjected to an electrolyte and in an electric field. A hollow sleeve is utilized to form a containment chamber for holding th...
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WO/1999/000536A2 |
A method of preparing a porous film comprises electrodepositing material from a mixture onto a substrate, the mixture comprising: (I) a source of metal, inorganic oxide, non-oxide semiconductor/conductor or organic polymer; (II) a solven...
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WO/1998/059095A1 |
An electrolytic process for producing copper foil having a low profile surface exhibiting a high peel strength when bonded to a polymeric substrate, which process comprises: (a) preparing an electrolyte comprising a copper sulfate-sulfur...
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WO/1998/050954A1 |
High density packaging of semiconductor devices on an interconnection substrate is achieved by stacking bare semiconductor devices (402, 404, 406, 408) atop one another so that an edge portion of a semiconductor device extends beyond the...
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WO/1998/049374A2 |
The invention relates to a device for electrolytic treatment of printed circuit boards (3). According to the invention, the printed circuit boards can be continuously guided through the inventive device in a plane of conveyance, in an es...
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WO/1998/048081A2 |
The invention relates to a method for electroplating metallic and non-metallic endless products with metals or alloys by means of a continuous process using aprotic electrolytes free of water and oxygen. Said method is characterized in t...
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WO/1998/048083A2 |
A device (1) for carrying out continuous electrolytic precipitation processes has a cathodic live cylinder (3) whose top surface is electroconductive over its whole useful width. An anode A is arranged concentrically to and spaced apart ...
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WO/1998/046811A1 |
A method for making conductive particles that efficiently permit a plated layer of uniform thickness to be formed over each of all particles without aggregating the particles in a plating liquid. The conductive particle making apparatus ...
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WO/1998/045504A1 |
An electroplating method that includes: a) contacting a first substrate (2) with a first electroplating article (4), which includes a support and a conformable mask disposed in a pattern on the support; b) electroplating a first metal fr...
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WO/1998/044171A1 |
The invention relates to a device for foaming foamed shaped parts in a form tool which can be opened and closed. Said tool is provided with a non-stick coating. The invention also relates to a method for the production of a form tool wit...
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WO/1998/040539A1 |
An electroplating apparatus and method reduces oxidation of thermodynamically unstable and oxidizable ionic species in an electroplating solution to deposit complex magnetic alloy onto substrates. The electroplating apparatus comprises a...
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WO/1998/040537A1 |
A graded metal hardware component for an electrochemical cell is shown for mechanically supporting electrochemical cell structures and defining fluid cavities and fluid passages in a cell employing a solid polymer electrolyte membrane. T...
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WO/1998/039796A1 |
A semiconductor workpiece processing tool (10) includes a processing module (20) having particular applicability to an electroplating process for semiconductor wafers. The processing module (20) has plural processing bowls assemblies (60...
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WO/1998/038355A2 |
The invention relates to a method for coating a metal strip with metal, especially for coating a steel strip with zinc or a zinc-nickel compound by means of at least one current-carrying galvanic cell containing an electrolyte, through w...
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WO/1998/038354A2 |
The invention relates to a method for coating a metal strip with metal, especially for coating a steel strip with zinc or a zinc-nickel compound by means of at least one current-carrying galvanic cell containing an electrolyte, through w...
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WO/1998/037262A1 |
A conductor roll which can eliminate the burning troubles of a brush and a lead wire resulting from an inferior contact between a collector ring (C ring) and a roll shaft, mounting/dismounting and fitting operations of the C ring at the ...
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WO/1998/033951A1 |
The formulation primes materials used in the processing of substrates. The formulation comprises one or more filming amines which are mixed with and neutralized by an appropriate acid or combination of acids. Water is used as the solvent...
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WO/1998/032901A1 |
The upper part of a sheet-like rectangular product (A) is held and suspended by a jig (2). An engaging claw (6) which engages with an engaging protrusion (4) formed on the top part of the jig (2) is moved horizontally along a cathode bar...
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WO/1998/027585A1 |
A process is described for the fabrication of submicron interconnect structures for integrated circuit chips. Void-free and seamless conductors are obtained by electroplating Cu from baths that contain additives and are conventionally us...
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WO/1998/026433A1 |
An overcurrent protective circuit element comprising a PTC conductive composition (1) and at least two electrodes (2) being in contact with the composition (1), wherein the electrodes (2) are composed of nickel foil. The contacting surfa...
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WO/1998/016671A2 |
An improved apparatus (40) for electrodeposition of materials by centrifugal means (74). Improvements include provision of multiple return drains (72), multiple input nozzles, sloped cathode contacts (76), slotted solution control rings ...
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WO/1998/014642A1 |
An electrolysis apparatus comprising a pair of liquid squeezers provided at least on the entrance side or exit side of a treatment chamber of an electrolysis apparatus through which a strip is continuously passed, characterized in that t...
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WO/1998/014637A1 |
The invention concerns a method and devices for the electrolytic formation of a deposit on an assembly of selected electrodes of an electrolysis support. The method comprises the following steps: using a support with a plurality of elect...
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WO/1998/010475A1 |
Battery case material with which an internal contact resistance between the anode mix and the material is substantially reduced inside a battery case made of it, which has an excellent corrosion-resistance and facilitates the improvement...
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WO/1998/010121A1 |
In a method for anisotropic etching of a structure in an electrically conductive substance to be etched, use is made of an etchant which in concentrated solution is usable for isotropic etching of structures in the substance to be etched...
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WO/1998/007902A1 |
A method for the manufacturing of diamond wires for the use in cutting stone materials, of the type comprising at least a phase of diamond electrolytic deposit on a metal support acting as a cathode. This metal support, according to the ...
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WO/1998/007897A1 |
From the time that they are immersed into a marine environment, bronze propellers are prone to attack by marine organisms, such as barnacles, coral and algae, which attach themselves to the bronze metallic surface, creating lumps on the ...
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WO/1998/006884A1 |
The invention relates to a process and a system for electrochemical treatment of long stretched-out items, especially sticks, wherein an item maintained by one end in a clamp (3) is introduced, along an as eccentric an axis as possible, ...
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WO/1998/002911A1 |
The present invention provides for a semiconductor workpiece processing tool (10) and methods for handling semiconductor workpiece therein. The semiconductor workpiece processing tool (10) preferably includes an interface section (12) co...
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WO/1998/002912A1 |
A processing system (10) includes an interface apparatus (12) for handling workpiece cassettes (16) for holding a plurality of semiconductor workpieces (W). The interface apparatus (12) includes a workpiece turnstile (40, 41) which pivot...
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WO/1998/002263A1 |
The invention concerns an element of a continuous metal casting ingot mould with a copper or copper alloy cooled wall to be contacted with liquid metal and comprising on its external surface a metal coating, characterised in that the sai...
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WO/1997/049843A1 |
The invention discloses a method for the electrolytic coating with a metal layer of the casting surface of a cylinder for the continuous casting of thin metal strips between two cylinders or on a single cylinder. The said casting surface...
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WO/1997/046737A1 |
The invention relates to a laminated material for sliding members which is improved with respect to its resistance to abrasion, its hardness and its wear resistance. Said laminated material has a support structure and a sliding layer wit...
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