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JP5460479B2 |
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JP5458327B2 |
To provide a battery inspection device capable of inspecting displacement of an electrode plate even in a stack type battery with high capacity.A battery inspection device inspects mutual displacement between electrode plates of a batter...
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JP5459175B2 |
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JP2014055802A |
To provide a film thickness measurement device that can prevent interference when a measuring head moves without limiting measuring range on a product board of the measuring head.In an interference avoiding mode of head position adjustme...
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JP5454025B2 |
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JP5451577B2 |
To provide a device and method for detecting a concentric pattern capable of automatically detecting the abnormality and defect of the concentric pattern in an SEM.A device for detecting a concentric pattern includes: an image taking uni...
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JP5452270B2 |
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JP5453091B2 |
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JP2014052312A |
To provide a film thickness measuring device capable of eliminating effect of Al contained in a substrate of a product substrate, and accurately obtaining a thickness of an Al film.A substrate A1 detection means irradiates a substrate (1...
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JP2014052291A |
To provide a gain calibration sample which enables accurate height adjustment of a measuring head.A gain calibration sample (60) has a height adjustment part (61) and a gain adjustment part (62). The height adjustment part (61) is a part...
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JP5449886B2 |
To solve the problem wherein, when imaging ranges corresponding to an imaging point overlap, the quality of an image imaged on an evaluation point is deteriorated.Existence of overlapping between imaging ranges in a charged particle beam...
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JP2014048182A |
To provide a film thickness measuring device capable of improving measurement accuracy of a film thickness and shortening measurement time of the film thickness.A measuring head (23) irradiates a film of a product substrate (10) with a p...
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JP2014049573A |
To provide an evaluation method for a semiconductor device and an evaluation device for the semiconductor device which can improve evaluation accuracy of the semiconductor device.An evaluation method for a semiconductor device related to...
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JP2014048275A |
To provide an off-set quantity calibration sample which makes it possible to calibrate the positions of two kinds of measuring apparatuses and save time and effort of calibration operation.An off-set quantity calibration sample (70) incl...
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JP2014044108A |
To estimate surface roughness of a measurement object by rapid and simple processing.A copper foil having an anchor is used as a measurement object 100, the measurement object 100 is irradiated with X rays, and the state of the surface r...
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JP2014044162A |
To improve stability of accuracy in thickness measurement.In a radiation measuring method for measuring a basis weight by detecting, with a radiation meter, radiation radiated from a radiation source and transmitted through a sample and ...
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JP5441730B2 |
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JP5438276B2 |
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JP5438741B2 |
Referring to design data for a sample, a measurement region is defined at a portion in the design data which has no step in an edge of a pattern. In addition, an edge as a characteristic portion is detected from the design data, and an e...
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JP5439375B2 |
Disclosed is a standard specimen, used with an electron microscope to correct the magnification with high precision. A standard member used for correction corrects a scanning electron microscope that measures a pattern within an observat...
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JP5439575B2 |
A method and device for observing a specimen, in which a convergent electron beam is irradiated and scanned from a desired direction, on a surface of a calibration substrate on which a pattern with a known shape is formed, and a beam SEM...
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JP2014041058A |
To measure dimensions of a pattern with high accuracy even when the surface of a measurement object substrate is electrically charged.A scanning electron microscope irradiates the surface of a substrate with electrons while scanning the ...
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JP2014041057A |
To provide a pinging axial direction scan type thickness reduction inspection device of a heat insulator piping using radioactive isotope which is an authentication apparatus with display for specifying and detecting a thickness reduced ...
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JP5433522B2 |
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JP5429908B2 |
To provide a stage positioning method for scanning irradiation apparatuses improving irradiation accuracy of particle beams or energy line and facilitating the positioning.The stage positioning method for scanning irradiation apparatuses...
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JP5429864B2 |
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JP5424239B2 |
Disclosed is a method and device for accurately analyzing the layer structure of a multilayer body using an X-ray reflectance method. The method for analyzing the layer structure of a multilayer body using an X-ray reflectance method is ...
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JP5426497B2 |
A pattern measurement apparatus and a pattern measurement method are capable of easily distinguishing a line pattern and a space pattern from one another, without being affected by the luminance of the pattern. The pattern measurement ap...
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JP5429788B2 |
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JP5423705B2 |
A radiation inspection apparatus may include a radiation source that irradiates linear radiation, which is parallel to an inspection direction set on an inspection target, to the inspection target, a line type detector that detects the r...
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JP5422411B2 |
The present invention is intended to provide a contour extraction method and a contour extraction device with an objective of either suppression of unnecessary contouring processings or selective contouring of necessary portions. To atta...
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JP5422725B2 |
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JP5411866B2 |
A pattern measurement apparatus includes: an irradiation unit for irradiating a sample with an electron beam; an electron detection unit for detecting the amount of electrons generated from the sample on which a pattern is formed; an ima...
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JP5417358B2 |
It is an object of the present invention to provide an image processing device for allowing an actual-image-closer pattern to be formed based on the design data, or its simulation image. In order to accomplish the above-described object,...
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JP2014025709A |
To improve accuracy stability in thickness measurement by previously obtaining atmospheric sensitivity corresponding to a measuring object and compensating a change in a measurement signal originated from an atmospheric change with the s...
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JP2014025813A |
To provide an X-ray plate thickness measurement method and an X-ray plate thickness measurement instrument which measure plate thickness by using a laminography method to generate image data for allowing fast and accurate measurement of ...
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JP2014025815A |
To provide a pattern measurement device capable of acquiring highly accurate information, in a height direction, of a pattern having three dimensional structure without having to perform a destructive inspection or the like.A pattern mea...
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JP5408432B2 |
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JP5408873B2 |
The object (3) is placed on a turntable (2), which may be rotated and moved up and down in the X-direction. The turntable may be placed between an X-ray source (10) and an X-ray receiver (7), which forms the primary measuring system. The...
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JP5408507B2 |
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JP5405937B2 |
A first electron biprism is disposed in a condenser optical system and an observation region of a specimen is irradiated simultaneously with two electron beams of different angles. The two electron beams that have simultaneously transmit...
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JP2014021061A |
To provide a reduced-thickness inspection device of piping with thermal insulation materials using a radioactive isotope as authentication equipment with display capable of finely specifying and detecting the reduced-thickness place of p...
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JP2014021099A |
To provide a thickness profile measurement device that corrects an error due to a path line variation and a path angle variation, and thereby can more accurately measure a thickness profile in a width direction of a sheet-like measured o...
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JP5398117B2 |
A method for inspection of a sample includes directing an excitation beam to impinge on an area of a planar sample that includes a feature having sidewalls perpendicular to a plane of the sample, the sidewalls having a thin film thereon....
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JP5400401B2 |
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JP5403193B1 |
A method of measuring a thickness of a Fe-Zn alloy phase included in the Fe-Zn alloy coating of the galvannealed steel sheet includes: an X-ray irradiation process of irradiating the galvannealed steel sheet with the incident X-rays; and...
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JP5399038B2 |
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JP5401605B2 |
The present invention is a template matching processing device capable of evaluating a similarity degree which supports even a case of intensive morphological change between a design image and a photographic image. In the template matchi...
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JP5400882B2 |
Provided are a semiconductor inspection device and a semiconductor inspection method such that in a specimen image in a single field of view obtained by an electron microscope, it is possible to suppress variations in the edge position m...
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JP5400474B2 |
To provide a reference member for calibrating a dimension of an electronic microscope device, the reference member suppressing deposition of contamination and having a microscopic reference dimension. The reference member for calibrating...
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