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JP6188695B2 |
One embodiment relates to a method of classifying a defect on a substrate surface. The method includes scanning a primary electron beam over a target region of the substrate surface causing secondary electrons to be emitted therefrom, wh...
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JP6184490B2 |
Structural parameters of a specimen are determined by fitting models of the response of the specimen to measurements collected by different measurement techniques in a combined analysis. Models of the response of the specimen to at least...
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JP2017142126A |
To provide a thickness specifying method of a lower part of a reactor pressure vessel capable of accurately monitoring a thickness of the lower part of the reactor pressure vessel at a time of a severe accident.A thickness specifying met...
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JP2017138296A |
To solve the following problem: when a search for a radiation source of unknown generating position is performed in a three-dimensional space, the efficiency of the search is enhanced if a space to be scanned is prelimited with respect t...
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JP6177615B2 |
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JP6173659B2 |
To improve throughput by acquiring and length-measuring a minimum image including an edge part of a pattern to be measured on a sample, and while securing reproducibility of length measurement, shortening image acquisition time in an app...
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JP6171940B2 |
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JP6165207B2 |
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JP6167182B2 |
Provided is an apparatus and method for measuring a thickness of thin film using x-ray where a thickness of a thin film of nanometer_(nm) level can be accurately measured without destructing an target sample, through determination of thi...
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JP6165444B2 |
This charged-particle beam device changes conditions for combining an intensity ratio between upper and lower deflectors and rotation angles of the deflectors in multiple ways when obtaining images having different pixel sizes in the ver...
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JP2017121647A |
To provide a projection arrangement measuring method of a checkered steel plate capable of measuring arrangement of projections on the checkered steel plate without using an optical device; and to provide a measuring apparatus.When measu...
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JP6160170B2 |
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JP6151721B2 |
An analytical model simulates the propagation of radiation through a coated continuous web where layer thickness and refractive index, as variables, determine the speed and direction of transmitted radiation. The model predicts character...
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JP6147879B2 |
To provide a method for easily and robustly measuring an overlay in an area where an actual device circuit pattern is formed in manufacturing a semiconductor device.An overlay measuring method is a method for measuring an overlay of a se...
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JP6147602B2 |
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JP6147868B2 |
The present invention is: a pattern measurement device that, regardless of increased fineness, deviation, or the like of a pattern, accurately and stably performs measurement on the basis of edge identification or pattern or edge judgmen...
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JP6147852B2 |
Provided is a device capable of suppressing a drop in detection accuracy, and a manufacturing method of a structure. A detection device (1) is a device that irradiates a subject (S) with X-rays and detects the X-rays transmitting through...
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JP2017102039A |
To provide a pattern measurement program, method, and device in which the effect of noise is small, and with which it is possible to make appropriate measurement up to a high frequency component.The program includes the steps of: detecti...
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JP2017096625A |
To provide a pattern measurement device for quantitatively evaluating influence caused by existence of pattern deformation in a circuit, and a computer program.A pattern measurement device performs dimension measurement of a first interv...
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JP6133603B2 |
To provide a technique for automating classification about length measurement and shape observation that has been performed visually and for supporting determination by an operator.An inspection data processing device for a charged parti...
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JP6134366B2 |
An object of the present invention is to provide an image processing apparatus and a computer program which detects a defect such as a scum at high speed and with high precision. In order to accomplish the above-described object, the pre...
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JP6133725B2 |
Pattern critical dimension measurement equipment includes an electron source configured to generate a primary electron beam, a deflector configured to deflect the primary electron beam emitted from the electron source, a focusing lens co...
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JP6130234B2 |
A metallic reflection plate is disposed so as to face oppositely an antenna connected to a transmitter-receiver. A detection wave from the antenna is reflected by the reflection plate so as to enter an interior of a blast furnace through...
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JP6128009B2 |
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JP6129651B2 |
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JP6122796B2 |
In an X-ray thickness gauge 100 provided with an X-ray generator 1 which is provided with a cooling unit 1b to cool an X-ray tube 1a with cooling medium, and a power source unit 1c to supply a power source to be applied to the relevant X...
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JP6118505B2 |
In order that a displacement between patterns of different heights, formed on a sample in a plurality of different pattern-forming steps, can be measured at fixed throughput and with high accuracy, correspondence between parameters of le...
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JP2017067442A |
To provide a pattern measurement device that properly evaluates a pattern formed by a patterning method that forms a pattern nonexistent in a photomask.To achieve the above objective, the present invention proposes a pattern measurement ...
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JP2017067443A |
To provide a pattern measurement device that quantitatively evaluates a pattern formed by a DSA method with high accuracy.The present invention proposes a pattern measurement device for measuring a dimension between patterns formed in a ...
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JP6106573B2 |
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JP6111220B2 |
To provide a tire condition detection device which can reduce the electric power consumption when detecting the condition of a tire using an electric wave.Each of a plurality of wheels includes a tire sensor unit 13 which detects a dista...
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JP6108684B2 |
An improved method of high accuracy beam placement for local area navigation in the field of semiconductor chip manufacturing is described. Preferred embodiments of the present invention can be used to rapidly navigate to one single bit ...
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JP6101445B2 |
To provide a signal processor which sets proper smoothing conditions in spite of changes in the kind of a material and the shape of a pattern, etc., and a charged particle beam device.There are provided: a signal processor which performs...
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JP6096725B2 |
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JP6088523B2 |
An improved apparatus for determining the position of a drive rod within the interior of a drive rod housing includes a transmission antenna at one location on the housing and a receiving antenna at another location on the housing. An el...
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JP6088803B2 |
An image processor, a method for generating a pattern using self-organizing lithographic techniques, and a computer program are provided to achieve image processing suitable for addressing a sample generated by patterning using Directed ...
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JP6088337B2 |
A first differential image of a defect observation region including an observation target pattern is generated by a differential value between signals from electron detectors arranged in a direction of edges of the observation target pat...
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JP2017032365A |
To provide a pattern measurement method and measurement device that appropriately evaluate pattern deformation and the like generating due to a micro loading effect.A pattern measurement method and device measuring a dimension of a patte...
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JP6078356B2 |
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JP6073080B2 |
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JP6069367B2 |
The purpose of the present invention is to provide a method for pattern measurement and a charged particle radiation device, whereby patterns formed by DSA techniques can be measured and inspected with high accuracy. According to an aspe...
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JP2017020981A |
To provide a pattern measuring apparatus capable of high-precision measurement and pattern identification irrespective of the influence of charging.To attain the object, the present invention proposes a pattern measuring apparatus perfor...
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JP6061496B2 |
A pattern measuring apparatus that scans a sample with charged particles, forms a detected image by detecting secondary charged particles or backscattered charged particles generated from the sample, and measures a pattern imaged on the ...
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JP6063630B2 |
An object of the invention is to provide a pattern measuring device for generating appropriate reference pattern data while suppressing an increase in the manufacturing cost that would occur when manufacturing conditions are finely chang...
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JP6059893B2 |
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JP6058565B2 |
An inner image generating apparatus includes a first receiver configured to receive an inlet track information and a first passage time of a muon, a second receiver configured to receive an outlet track information and a second passage t...
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JP6051301B2 |
When a scanning electron microscope is used to measure a superposition error between upper-layer and lower-layer patterns, an SN of the lower-layer pattern may often be lower, so that when simple frame adding processing is used, the addi...
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JP2016217816A |
To provide a pattern measurement program, method and device in which the influences of noise are small, and with which it is possible to properly measure way up a high-frequency component.The program includes the steps of: detecting elec...
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JP2016210501A |
To exclude a defective product in which positional deviation of objects to be packaged occurs without being restricted by size of a packaging material, in a packaging machine for packaging the objects to be packaged in the opaque packagi...
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JP6044704B2 |
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