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JP7191954B2 |
A method including: obtaining a detected representation of radiation redirected by each of a plurality of structures from a substrate additionally having a device pattern thereon, wherein each structure has an intentional different physi...
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JP7191108B2 |
A measurement apparatus (10) and method for determining a substrate grid describing a deformation of a substrate (12) prior to exposure of the substrate (12) in a lithographic apparatus (LA) configured to fabricate one or more features o...
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JP2022185783A |
To improve accuracy in measuring alignment.An exposure device irradiates an original plate with exposure light and transfers a pattern of the original plate via a projection optical system onto a shot area of a substrate. The exposure de...
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JP2022552195A |
Embodiments of the present disclosure include methods for comparing die systems and alignment vectors. A die system includes a plurality of dies arranged in a desired pattern. An alignment vector, such as a die vector, can be determined ...
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JP2022185237A |
To provide a measuring apparatus and a measuring method capable of improving measurement reliability in long-term measurement.A measuring apparatus aligns a measurement coordinate system with a coordinate system of a sample by performing...
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JP2022183203A |
To make it possible to perform accurate overlay measurement of a device having diagonal (inclined, slanted) elements such as DRAM devices or the like, when a measurement target, a design method and its measurement method is provided with...
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JP2022178785A |
To provide a vibration suppression device which can deal with an actuator which utilizes magnetic force.A vibration suppression device (100) has: a base part (101) which is fastened to an object member (304); a damping member (102) provi...
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JP2022177714A |
To provide a method for manufacturing a semiconductor device which can suppress degradation of a positioning function.A method for manufacturing a semiconductor device includes steps of: forming an alignment mark 50 on an off substrate 2...
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JP7179742B2 |
Scatterometry overlay targets as well as target design and measurement methods are provided, which mitigate the effects of grating asymmetries in diffraction based overlay measurements. Targets comprise additional cells with sub-resolved...
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JP7179979B2 |
A method of measuring overlay uses a plurality of asymmetry measurements from locations (LOI) on a pair of sub-targets (1032, 1034) formed on a substrate (W). For each sub-target, the plurality of asymmetry measurements are fitted to at ...
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JP2022175842A |
To automatically and quickly adjust parameters related to image capture to obtain good alignment mark images.A mark detecting apparatus includes: imaging means 131 for generating an alignment mark image by imaging an alignment mark on an...
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JP2022175852A |
To provide a technique advantageous for determining a figure of a substrate.A method of determining a figure of a substrate includes: a process of determining representative data representatively exhibiting a figure of a first substrate ...
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JP7177846B2 |
An overlay metrology system may include a controller to generate optical tool error adjustments for a hybrid overlay target including optically-resolvable features and device-scale features by measuring a difference between an optical ov...
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JP7177847B2 |
A method of determining overlay (“OVL”) in a pattern in a semiconductor wafer manufacturing process comprises capturing images from a cell in a metrology target formed in at least two different layers in the wafer with parts of the t...
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JP7176597B2 |
To provide a method of detecting a position of a mark formed on an article.A position detection device is a position detection device for detecting a position of a mark formed on an article by measurement light from a light source and in...
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JP7175409B2 |
To perform exposure while suppressing meander of a long-sized substrate, in an exposure device having an RtoR (Roll to Roll carrier) transportation system.In an exposure device 10 having an RtoR transportation system for transporting lon...
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JP7175319B2 |
Disclosed are apparatus and methods for performing overlay metrology upon a target having at least two layers formed thereon. A target having a plurality of periodic structures for measuring overlay in at least two overlay directions is ...
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JP2022172907A |
To provide a technique useful for determining a correction value of a thrust ripple with high accuracy.A stage device has: a motor having a stator and a mover; a stage provided on the mover; a measurement unit that measures a position of...
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JP7172596B2 |
A mark detection apparatus is configured to detect a mark M formed in a mark area of an object (41) and has: a first optical system (52a) configured to emit a first measurement light to the mark area; a second optical system (53a) config...
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JP7173891B2 |
A measurement apparatus that measures a position of a mark (19) formed between a first surface and a second surface on a side opposite to the first surface of a substrate (3) is provided. The apparatus includes a stage (4) configured to ...
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JP2022547528A |
providing a metrology target with a first rotationally symmetrical working zone with one or more instances of a first pattern and a second rotationally symmetrical working zone with one or more instances of a second pattern; At least one...
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JP7169435B2 |
Disclosed is a metrology device (1600) configured to produce measurement illumination comprising a plurality of illumination beams, each of said illumination beams being spatially incoherent or pseudo-spatially incoherent and comprising ...
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JP2022166688A |
To provide a technique advantageous for aligning a substrate.A processing system includes a first device and a second device, and is configured to process a substrate. The first device includes a first measurement part configured to dete...
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JP7165195B2 |
Method of optimizing a metrology process are disclosed. In one arrangement, measurement data from a plurality of applications of the metrology process to a first target on a substrate are obtained. Each application of the metrology proce...
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JP7164289B2 |
Techniques herein include systems and methods for correcting pattern overlay errors by correcting or adjusting bowing of wafers. Location-specific tuning of stress on semiconductor substrates reduces overlay error. Location-specific tuni...
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JP7163577B2 |
A back alignment mark on a surface of a semiconductor substrate is detected and a resist mask patterned into a circuit pattern corresponding to a surface element structure is formed on a back of the semiconductor substrate. Detection of ...
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JP2022544826A |
at least one high aspect ratio feature in the base stack of materials; an overlay mark in or on only the top of the base stack of materials; and an additional stack of materials adjacent to the base stack of materials, comprising at leas...
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JP2022161335A |
To provide a transfer technique advantageous for improving throughput.A substrate transfer device includes a transfer mechanism that transfers and places a substrate on a mounting table along a transfer path, a detector for detecting an ...
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JP2022149848A |
To provide a technology advantageous for highly precisely measuring positional information of a measurement object.A measurement device measuring positional information of a measurement object is provided. The measurement device includes...
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JP7148295B2 |
The present invention provides a control apparatus for performing synchronous control to synchronize driving of a second moving member so as to follow driving of a first moving member, including a feedforward control system that includes...
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JP7147738B2 |
A control method of a movable body includes: a step of detecting a part of a plurality of grating marks provided at a wafer (W) placed on a movable body (22) that is movable within an XY plane, while scanning a measurement beam, that is ...
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JP7143587B2 |
To provide a semiconductor manufacturing apparatus and a method of manufacturing a semiconductor device that can improve flatness of a semiconductor wafer fixed and held on a surface of a stage.There is provided a semiconductor manufactu...
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JP7144605B2 |
A detection system for an alignment sensor, and an alignment sensor and lithographic projection apparatus comprising such a detection system is disclosed. The detection system comprises at least one detection circuit; and a plurality of ...
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JP7143643B2 |
Provided is a positioning system comprising: a movement mechanism for moving an object; a visual sensor for executing in each image capture period a position identification process for identifying the position of the object on the basis ...
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JP7143445B2 |
Disclosed is a bandwidth calculation system for determining a desired wavelength bandwidth for a measurement beam in a mark detection system, the bandwidth calculation system comprising a processing unit configured to determine the desir...
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JP7143314B2 |
A method and a device for aligning two lenses, wherein the method is directed to aligning first and second optical partial systems of an optical system, which are arranged so as to be located opposite to one another. The method includes ...
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JP7143526B2 |
An apparatus for and method of determining the alignment of a substrate in which a multiple alignment marks are simultaneously illuminated with spatially coherent radiation and the light from the illuminated marks is collected in paralle...
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JP2022138502A |
To provide a registration mark which is hardly affected by processes and can be detected with accuracy.According to one embodiment, a registration mark comprises: a first step portion including a plurality of first steps which descend st...
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JP2022137850A |
To cause an exposure head to emit light to an appropriate position on a substrate by suppressing the yawing of a driving object when driving a stage in a main scanning direction with a drive mechanism, while suppressing cost increase.A s...
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JP2022137773A |
To provide a technique for realizing an alignment mark which satisfies measurement accuracy required for positioning a substrate.An alignment mark is provided in a silicon carbide substrate in which a <0001>c-axis is inclined only by a p...
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JP2022137849A |
To cause an exposure head to emit light to an appropriate position on a substrate mounted on a stage by ensuring straightness in driving the stage in a main scanning direction with a drive mechanism.A stage 2 is driven in a Y direction b...
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JP7140219B2 |
A control system controls a drive system of a substrate holder, based on correction information to compensate for measurement error of a measurement system including an encoder system that occurs due to movement of at least one of a plur...
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JP2022540589A |
A device for measuring fiducials in real time during lithographic printing consists of a light source providing an exposure beam, a light modulator modulating the exposure beam according to an exposure pattern, and several alignments pre...
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JP7137363B2 |
The present invention provides an exposure method of exposing a substrate while moving an original and the substrate in a scanning direction, the method including performing a step of specifying a position of a concave-convex portion pre...
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JP2022539425A |
A method is disclosed that includes measuring radiation reflected from a metrology target and resolving the measured radiation into components, such as Fourier components or spatial components. Additionally, a recipe selection method is ...
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JP2022131120A |
To accurately detect an exposure position even in a narrow area in an exposure device.An exposure device 10 includes a light-shielding part 40 provided with first slits SU1 and second slits SU2 aligned in a main scanning direction X, and...
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JP2022131602A |
To provide a detector advantageous for enhancing accuracy of pattern matching.A detector for detecting a position of a mark formed on a substrate includes: an imaging part configured to imaging the mark formed on the substrate to obtain ...
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JP2022129897A |
To prevent an abnormality in autofocus operation from affecting drawing in a drawing area.An autofocus mechanism 5 of a drawing device measures a separation distance between a reference position in a drawing head 31 and a substrate in a ...
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JP2022128227A |
To provide a technology advantageous for accurately obtaining an arrangement of a shot region on a substrate.A method for determining an arrangement of a plurality of regions on a substrate characterized by comprising: a first step of ob...
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JP2022125866A |
To provide a technique advantageous on the point of forming accuracy of a pattern onto a substrate in scanning exposure.An exposure apparatus that performs scanning exposure of a shot region of a substrate by scanning the substrate with ...
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