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JP2023136106A |
To provide a measuring apparatus that can satisfy both improvement of alignment accuracy and downsizing.A measuring apparatus 50 according to the present invention comprises: an illumination optical system which guides light from a light...
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JP2023540684A |
Aspects of the present disclosure provide an inspection system that can include an imaging module and processing circuitry. The imaging module can image the wafer with the first light beam and the second light beam. The first light beam ...
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JP2023540683A |
Aspects of the present disclosure also provide imaging systems. For example, in an imaging system, a first light source may generate a first beam of light having a first wavelength, and a second light source may generate a second beam of...
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JP2023540186A |
A broadband radiation source device comprising a fiber assembly comprising a plurality of optical fibers, each optical fiber being filled with a gaseous medium, wherein a subset of the optical fibers is in contact with the plurality of o...
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JP2023131022A |
To appropriately perform alignment when a facet surface is formed on an epitaxial layer.A method for manufacturing a semiconductor device includes the steps of: preparing an SiC substrate that has a recessed alignment mark on its upper s...
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JP2023130748A |
To appropriately perform exposure according to the shape of a substrate even if the substrate has no alignment mark formed thereon.An exposure apparatus according to the present invention includes: a stage that supports a substrate to be...
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JP7345488B2 |
A substrate 10 with an alignment mark comprises a substrate 12, and an alignment mark 14 formed on a first main surface 12a of the substrate 12. The alignment mark 14 has a plurality of linear recessed sections 16. The recessed sections ...
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JP7345572B2 |
A method for measurement of misregistration in the manufacture of semiconductor device wafers, the method including measuring misregistration between layers of a semiconductor device wafer at a first instance and providing a first misreg...
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JP7345542B2 |
Process control methods, metrology targets and production systems are provided for reducing or eliminating process overlay errors. Metrology targets have pair(s) of periodic structures with different segmentations, e.g., no segmentation ...
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JP2023129405A |
To provide a method for measuring a photomask for semiconductor lithography.The method includes: recording an aerial image of at least one region of the photomask; defining at least one region of interest (1); ascertaining structure edge...
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JP2023125840A |
To provide a measurement device advantageous for measuring a position of a target.A measurement device for measuring a position of a target includes: a lightening system for lighting the target with light containing light of a first wave...
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JP2023124596A |
To provide a detection method capable of inhibiting a deterioration of mark detection accuracy.A detection method detects a mark by utilizing a detection device having a detection part. The detection method includes: a first movement ste...
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JP2023124595A |
To provide a detection method capable of inhibiting a deterioration of mark detection accuracy.A detection method detects a mark by utilizing a detection device having a first detection part and a second detection part. The detection met...
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JP7339826B2 |
A method of determining a mark position, includes determining, based on a position of a mark image on an image acquired by using a scope that captures an image of a mark, a temporary position of the mark image, determining a correction a...
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JP7336343B2 |
To provide a technique advantageous for determining whether a step distribution acquired before can be applied.An exposure apparatus exposing each of a plurality of regions on a substrate having a common pattern contains a measurement un...
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JP7334324B2 |
A method of determining a mark measurement sequence for an object comprising a plurality of marks, the method including: receiving location data for the plurality of marks that are to be measured; obtaining a boundary model of a position...
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JP7331238B2 |
An apparatus for measuring a height of a substrate for processing in a lithographic apparatus is disclosed. The apparatus comprises a first sensor for sensing a height of the substrate over a first area. The apparatus also comprises a se...
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JP7330778B2 |
To provide a stage device capable of further reducing an error in a position measurement of a stage.A stage device is to be installed in a substrate treatment apparatus configured to perform a treatment to a substrate, and includes: a st...
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JP7330777B2 |
To provide a stage device capable of further reducing an error of a mark position detection.A stage device is to be installed in a substrate treatment apparatus configured to perform a treatment to a substrate, and includes: a stage conf...
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JP7330299B2 |
In one embodiment, a method for creating a forecasting model for a multiple-imaging unit DLT is disclosed. A stage of the DLT is positioned so that a set of alignment marks provided on a substrate are placed under a set of the DLT's eyes...
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JP7330279B2 |
Disclosed is a method of manufacturing a reflector. The method comprises polishing at least the uppermost surface of the uppermost substantially flat substrate of a plurality of substantially flat substrates, deforming each substantially...
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JP7330273B2 |
A method of aligning a plate containing a substrate is disclosed wherein multiple cameras with distinct fields of view are aligned with mark cells that are within the field of view of each of the multiple cameras.
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JP2023114874A |
To provide a positioning device which is mounted on a manual positioning type processing device, and can convert the processing device into an automatic positioning type processing device at low cost.A positioning device 30, which has a ...
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JP2023535625A |
The present invention is displaceable along at least one axis parallel to the chuck surface (195, 265) of the specimen stage (100) and at least one axis (250) perpendicular to the chuck surface (195, 265). A method (1700, 1800) for deter...
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JP7328806B2 |
The present invention provides a measurement apparatus that measures a position of an object which includes a first mark and a second mark, comprising: an image capturing unit configured to capture the first mark and the second mark in a...
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JP2023113652A |
To provide a method for determining a sampling scheme.The method includes: obtaining a first fingerprint model relating to a first spatial distribution of a performance parameter over a first portion of a semiconductor substrate, and a s...
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JP7325961B2 |
A patterning device comprising a reflective marker, wherein the marker comprises: a plurality of reflective regions configured to preferentially reflect radiation having a given wavelength; and a plurality of absorbing regions configured...
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JP7326292B2 |
A sensor is disclosed, wherein a transducer generates acoustic waves, which are received by a lens assembly. The lens assembly transmits and directs at least a part of the acoustic waves to a target. The lens assembly then receives at le...
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JP2023111932A |
To provide a method and apparatus for metrology using a target, in which throughput, flexibility and/or accuracy can be improved.A diffraction measurement target has at least a first sub-target and at least a second sub-target. The first...
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JP7324051B2 |
The present invention provides a lithography apparatus for performing a process of transferring a pattern of an original to each of shot regions two-dimensionally arrayed on a substrate, including a stage that moves while holding one of ...
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JP7323267B2 |
The invention provides a mask pair, a double-sided exposure apparatus and a mask exchange method. The purpose of the present invention is to make it possible to easily calibrate masks after replacement even when a substrate is retained a...
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JP2023109004A |
To provide a technique which is advantageous for reduction of the number of marks arranged on a substrate and reduction of a size of the marks.A mark position determination method is a method for determining a position of a mark includin...
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JP2023108580A |
To improve yield of semiconductor devices.An exposure apparatus of an embodiment exposes a substrate. The exposure apparatus includes a stage, a storage device and a control device. The stage is constituted so as to be capable of holding...
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JP2023533566A |
A semiconductor structure, wherein in a photoresist layer having a thickness greater than 1.2um, a number of first patterns arranged along a first direction and a number of second patterns arranged along a second direction. and wherein t...
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JP2023106908A |
To improve throughput in joint exposure.An exposure method in which a pattern of a master plate is exposed onto a first shot region of a substrate, and the pattern of the master plate is exposed onto a second shot region overlapping with...
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JP2023533300A |
Kind Code: A1 The present invention relates to a stage system including a pre-exposure section and a method of using the pre-exposure section to align an optical system. The pre-exposure portion includes a radiation-receiving area on the...
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JP2023533027A |
A variable setpoint and/or other factors may limit iterative learning control for a motion component of the device. The present disclosure describes a processor configured to control movements of components of a device with at least one ...
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JP7317579B2 |
The alignment apparatus performs alignment of an object in a first direction along a surface of the object, based on a position of a predetermined target formed on the surface, and includes a holding unit that holds the object to be move...
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JP2023104683A |
To provide a technique advantageous for achieving improvement of overlay accuracy and high throughput using a plurality of detection systems for detecting mutually different marks.A detection device for detecting a plurality of marks pro...
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JP7315718B2 |
A metrology tool, an aplanatic singlet lens, and a method of designing an aplanatic singlet lens are provided. The metrology tool is for determining a characteristic of a structure on a substrate. The metrology tool comprises an optical ...
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JP2023531530A |
An image of a portion of a semiconductor chip having one or more structures in a first process layer and one or more structures in a second process layer is acquired. Using machine learning, a first region is defined on the image that at...
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JP2023530864A |
Systems, apparatus and methods are provided for determining alignment of a substrate. An exemplary method may include emitting a multi-wavelength radiation beam comprising a first wavelength and a second wavelength toward a region of a s...
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JP7310617B2 |
Provided is an alignment mark detection apparatus capable of detecting even a work mark with a small luminance difference with respect to background and an alignment mark detection method thereof. According to the present invention, the ...
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JP2023095988A |
There is provided a method for determining correction to a semiconductor manufacturing process, the method comprising: obtaining (504) first sparse data measured (502) using a sparse sampling layout; obtaining (512) dense data measured (...
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JP2023528761A |
A patterning device pre-alignment sensor system is disclosed. The system comprises at least one illumination source configured to provide an incident beam along a normal direction towards the patterning device. The system further compris...
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JP2023528753A |
The present invention provides a method for calculating a corrected substrate height map of a first substrate using height level sensors. The method is sampling the first substrate with a height level sensor while the first substrate mov...
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JP2023095037A |
To provide a substrate processor advantageous in a point of combining shortening of a measurement time and reduction of an influence on exposure performance.A substrate processor (100) for processing a substrate, comprises: a plurality o...
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JP2023094329A |
To provide a technique advantageous for suppressing vibration after positioning a detecting system for detecting a specimen.There is provided a detector for detecting a specimen, the detector comprises: a detecting system for detecting t...
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JP2023528357A |
A method and associated apparatus are disclosed for performing position measurements for an alignment mark comprising a first periodic structure having a direction of periodicity along at least a first direction. The method comprises obt...
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JP2023528464A |
The present invention relates to a metrology target including a first target structure set having one or more first target structures formed within at least one of a first working zone or a second working zone of a specimen . The metrolo...
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