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JP7405316B1 |
In the present disclosure, there is provided a reflection structure having a frequency selective reflection plate that reflects electromagnetic waves in a specific frequency band in a direction different from a direction of specular refl...
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JP2023181373A |
To provide a pattern formation device advantageous in view of alignment accuracy.A pattern formation device includes: a first measurement part including a detection part configured to use an alignment optical system and obtain an image o...
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JP2023181239A |
To prevent occurrence of a recognition defect of an alignment mark due to scattering of infrared radiation while avoiding complication of a mask design.A semiconductor device includes: a semiconductor substrate including an element forma...
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JP2023553078A |
A broadband light source device configured to generate broadband output radiation upon receiving pump radiation includes one or more main parts and at least one main part that is variable with respect to the one or more main parts. A hol...
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JP2023180035A |
To provide a technology advantageous for measuring a surface position in a height direction of a substrate, and, a relative position of a mark provided on the substrate to a mark provided on an original plate.A projection exposure appara...
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JP2023179277A |
To provide a positioning device that reduces the effect due to a reactive force generated by movement of a movable part, without increasing a weight of the movable part.A positioning device comprises: a first movable part that moves in a...
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JP2023178870A |
To provide technology advantageous in a point of man-hours regarding adjustment of parameters when a copied job is reused.A management method for managing an exposure job in an exposure device for exposing a substrate comprises: receivin...
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JP2023178172A |
To provide a technique advantageous in accurately conducting a focus-leveling control at scanning exposure.A scanning exposure device includes: a measurement part configured to measure a surface height distribution of a substrate; and a ...
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JP2023176185A |
To provide an alignment apparatus that can improve aligning accuracy between an original plate and a substrate.An alignment apparatus according to the present invention comprises: a first measurement part which detects first measuring li...
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JP2023551776A |
Disclose metrology methods. The method includes measuring at least one ambient observable parameter related to an ambient signal contribution to a metrology signal, including a contribution to the metrology signal that is not attributabl...
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JP2023551163A |
A multi-column metrology tool can include two or more measurement columns distributed along the column direction, where the two or more measurement columns simultaneously probe two or more measurement areas on the sample containing the m...
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JP2023173758A |
To provide a lithography device advantageous in a production cost and a through-put with regard to correction processing for a placement error of a plurality of substrates.An exposure device includes: a holding part configured to hold a ...
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JP7390104B2 |
For the purposes of measuring structures of a microlithographic mask, a method for capturing absolute positions of structures on the mask and a method for determining structure-dependent and/or illumination-dependent contributions to the...
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JP2023170174A |
To provide a technique advantageous for suppressing detection accuracy from deteriorating, due to a periodic structure included in an imaging device.A detector includes: an imaging device having an imaging surface including a first perio...
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JP7389885B2 |
The present invention aims to solve the problem that a substrate is stopped in a state where a substrate mark is detached from a field of view of a camera, in a double sided exposure apparatus that requires calibration of a substrate whi...
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JP2023169487A |
To provide a detection method which suppresses lowering of accuracy of mark detection and delay of the mark detection.A detection method for detecting a plurality of marks using a detector having a first detection part and a second detec...
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JP2023550118A |
Alignment system and method for aligning objects (O) with object markers. An image of the object marker is projected onto an image sensor (11) having a sensor element. At least one fiducial marker is projected onto the imaging sensor (11...
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JP2023549656A |
Disclosed is a metrology system that includes a prealignment metrology tool operable to measure multiple targets on a substrate to obtain measurement data, and a processing unit. The processing unit is configured to process the measureme...
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JP2023168349A |
To provide a metrology target that reduces or eliminates process overlay errors.Metrology targets have pair(s) of periodic structures with different segmentations, e.g., no segmentation in one periodic structure and device-like segmentat...
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JP7384283B2 |
This pattern forming device comprises a pattern forming mechanism for forming a pattern on a substrate, and a mark detecting mechanism for detecting a mark formed on a substrate. The mark detecting mechanism includes: an objective lens s...
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JP7383732B2 |
A method for determining a center of a radiation spot irradiated on a surface by a sensor, the sensor including a radiation source and a detector. The method includes: emitting, with the radiation source, a first emitted radiation beam o...
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JP2023548684A |
A method is disclosed for modeling measurement data about a substrate into a substrate area in a lithography process. The method includes obtaining measurement data about a substrate and performing a joint fitting that fits at least a fi...
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JP2023165738A |
To provide a method for a measurement and a tool which can increase the accuracy of a measurement, can simplify a measurement process, and can improve the correspondence between a measurement target and a semiconductor device.In the meth...
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JP7382904B2 |
The invention relates to a device for measuring a mask for microlithography, the device including an imaging device and an autofocusing device. The imaging device comprises an imaging optical unit with a focal plane for imaging the mask,...
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JP2023164945A |
To transfer a mask pattern on a substrate with precision, while improving a throughput, in a projection exposure apparatus.Positions of alignment marks of chips arranged in a matrix on a substrate W are measured in advance by a measuring...
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JP7379267B2 |
The present invention relates to a method of correcting wiring of a semiconductor package, and more particularly, to a method of correcting wiring of a semiconductor package, in which a location of an integrated circuit chip and a locati...
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JP7379314B2 |
A measurement system (500) to be used in a manufacturing line for micro-devices is provided independently from an exposure apparatus. The measurement system (500) is equipped with a plurality of measurement devices (100to 100) that each ...
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JP7378910B2 |
The present invention aims to solve the problem that a substrate is stopped in a state where a substrate mark is detached from a field of view of a camera, in a double sided exposure apparatus that requires calibration of a substrate whi...
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JP2023162568A |
To provide a lithography device that can improve overlapping accuracy.A lithography device has pattern forming means, acquiring means, measuring means, and controlling means. The pattern forming means is for forming a pattern using a pat...
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JP2023161924A |
To provide, for example, an information processing apparatus for lithography that can optimize alignment adjustment on an outer peripheral part of a substrate.An information processing apparatus for lithography has display control means ...
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JP2023162226A |
To provide a method of aligning a plate containing a substrate.Multiple cameras with distinct fields of view are aligned with mark cells 302 that are within the field of view of each of the multiple cameras. In one example embodiment, a ...
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JP7373340B2 |
In order to provide a judgement apparatus capable of determining whether a substrate processing apparatus needs to be maintained, a judgement apparatus according to the present invention, in a substrate processing apparatus, for the imag...
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JP2023545963A |
A lithographic apparatus is disclosed. The lithographic apparatus includes a substrate table configured to support a substrate, an actuator configured to move the substrate table in a plane substantially parallel to a surface of the subs...
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JP2023158946A |
To provide a technique advantageous for reducing overlay errors.A lithography method for reducing overlay errors of a pattern formed by a lithography apparatus on a substrate comprises: an estimation step of estimating strain of the subs...
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JP7370920B2 |
A technology capable of realizing a high-precision of a stage apparatus is provided. The stage apparatus comprises: a first movable body; an X-axis driving unit configured to be movable in the X-axis direction, which drives the first mov...
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JP2023157729A |
To provide a technology advantageous for efficiently performing control satisfying required accuracy of each of a plurality of drive shafts at a limited calculation cost.Provided is a management apparatus for managing a processing appara...
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JP7369306B2 |
A target and method for using the same in the measurement of misregistration between at least a first layer and a second layer formed on a wafer in the manufacture of functional semiconductor devices on the wafer, the functional semicond...
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JP7367786B2 |
A substrate processing system (1000) configured to process a substrate (W) on which a plurality of divided areas are formed along with a plurality of marks. The system comprises a measurement device (100) that has a first stage (10) for ...
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JP2023156164A |
To provide a technique advantageous for shortening a time necessary for focus control to improve a through-put.An exposure method for performing focus control on the basis of data transferred from a detector having a light receiving rang...
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JP7367194B2 |
An improved light laser module is disclosed. The laser module can include a laser source (310) configured to generate laser light, and an infinite impulse response filter configured to reduce coherence effect of the laser light by decorr...
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JP7366626B2 |
A judgement apparatus according to the present invention classifies image data of a mark on a substrate imaged in a substrate processing apparatus regarding image evaluation, and judges the alignment precision in the substrate based on t...
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JP7365510B2 |
Disclosed is a method of measuring a periodic structure on a substrate with illumination radiation having at least one wavelength, the periodic structure having at least one pitch. The method comprises configuring, based on a ratio of sa...
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JP2023153245A |
To make it possible to precisely expose a plurality of divided regions on a substrate without decreasing throughput in exposure processing of the substrate.A lithography system 1000 includes: a measurement apparatus 100 to acquire positi...
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JP7361787B2 |
Apparatus for, and method of, measuring a parameter of an alignment mark on a substrate in which an optical system is arranged to receive at least one diffraction order from the alignment mark and the diffraction order is modulated at a ...
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JP2023149378A |
To improve throughput.An analysis system includes a first measuring section that measures first information that is pattern information of a first pattern on a first substrate, a storage section that stores the first information measured...
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JP7359899B1 |
The present invention provides a semiconductor manufacturing apparatus and a semiconductor manufacturing method thereof. The wafers are grouped into a first wafer group and a second wafer group based on the alignment mark position error ...
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JP7356667B2 |
To provide a small aligning device using a lens having a high magnification.An aligning device 1 includes: an imaging unit 11; a liquid crystal lens 12 disposed between the imaging unit 11 and an imaging object 4 of the imaging unit 11, ...
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JP2023541838A |
The present invention relates to a device for exposure control in a photolithographic direct exposure method for two-dimensional structures in photosensitive coatings, as well as a method for converting recorded data into direct exposure...
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JP2023138922A |
To provide a measuring method for an overlay error in a multilayered sample allowing for matched conditions in a k-space to be achieved by adjusting a diffraction structure or structured light.A method includes the steps of: generating s...
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JP7353916B2 |
To provide a measurement apparatus advantageous in a point of measurement time.The measurement apparatus includes: a first detection unit 191A which generates a detection signal for detecting a mark 211 in a first range; a second detecti...
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