| Document |
Document Title |
|
JP2023056347A |
To provide a technique advantageous for improving measuring accuracy of a position of a mark.A measuring device for measuring a relative position between a first mark and a second mark includes a detection part for detecting a first inte...
|
|
JP7257853B2 |
Position detection apparatus includes illumination optical system for illuminating target, detection optical system for forming image of the illuminated target illuminated on photoelectric converter, first array having first aperture sto...
|
|
JP2023053800A |
To provide a technique which is advantageous for accurately determining the arrangement of areas on a substrate.There is provided a method for determining the arrangement of a plurality of areas on a substrate, the method comprising: a f...
|
|
JP2023053803A |
To provides an advantageous technique for improving exposure accuracy in a scanning exposure using a FLEX method.An exposure apparatus for performing scanning exposure of a substrate by projecting a pattern of an original onto the substr...
|
|
JP7253006B2 |
Metrology tools and methods are provided, which estimate the effect of topographic phases corresponding to different diffraction orders, which result from light scattering on periodic targets, and adjust the measurement conditions to imp...
|
|
JP7250063B2 |
Metrology tools and methods are provided, which estimate the effect of topographic phases corresponding to different diffraction orders, which result from light scattering on periodic targets, and adjust the measurement conditions to imp...
|
|
JP7250064B2 |
Metrology tools and methods are provided, which estimate the effect of topographic phases corresponding to different diffraction orders, which result from light scattering on periodic targets, and adjust the measurement conditions to imp...
|
|
JP7249994B2 |
A photomask alignment method for a manufacturing process of an integrated circuit in a semiconductor material wafer (20), the method envisaging: at a first level, defining, by means of a single photolithography process, at least one alig...
|
|
JP2023512917A |
Apparatus and method for sensing multiple alignment marks, wherein the optical axis of the detector is split into multiple axes, each of which can detect a separate alignment mark essentially simultaneously to generate a signal , and the...
|
|
JP2023043534A |
To highly accurately measure deviation between a plurality of interlayers in a production processes of a semiconductor device.A measuring method includes generation of mark positional information, determination of at least one of a first...
|
|
JP2023042482A |
To provide a direct drawing type exposure device which effectively solves a problem in deterioration in productivity derived by a request of high definition.When a stage 6 on which a substrate W is mounted is moved by a stage movement me...
|
|
JP2023042334A |
To provide a technique that is advantageous in terms of detection speed of alignment marks.A detection device is provided for detecting marks arranged on a substrate. The detection device performs a detection process for each of partial ...
|
|
JP2023042479A |
To provide a direct drawing type exposure device which can sufficiently remove dust even there is irregularity on surfaces of a substrate and a stage, and can improve exposure quality.When a stage 6 on which a substrate W is mounted is m...
|
|
JP2023511702A |
The present invention provides a first positioning module configured to support and position a first substrate, a second positioning module configured to support and position a second substrate, the two positioning modules performing a f...
|
|
JP2023039136A |
To achieve both highly-accurate positioning and high productivity.An exposure device includes a first measurement part for detecting an original plate mark and a first mark, a second measurement part for detecting a second mark, a storag...
|
|
JP2023039062A |
To provide a stage device capable of suppressing damage of a substrate and reduction in through put, and positioning a plurality of substrates whose sizes are different each other.A stage device comprises a control part for perform contr...
|
|
JP2023039134A |
To reduce lowering of productivity.An exposure device for superposing and exposing a pattern of a second layer on a substrate formed with a first layer including a first pattern region including a first pattern formed by light transmitti...
|
|
JP7240166B2 |
The present invention provides a connecting exposure technique advantageous for achieving both overlap precision of upper and lower layers and a connecting precision of an adjacent shot. In particular, the present invention relates to a ...
|
|
JP7238041B2 |
A measuring device for measuring a position of a pattern includes a wavelength variable unit configured to vary a spectrum of first light in accordance with an incident position at which the first light is incident to allow the first lig...
|
|
JP2023032759A |
To reduce a workload for a designer required for generation of a template.A matching position determination part sets a temporary template region 951a which has the same size as a template corresponding to a temporary matching position 9...
|
|
JP2023031962A |
To improve throughput in a drawing apparatus that has a first substrate holding part and a second substrate holding part.A drawing apparatus 1 includes a drawing head 41, a first stage 21a, a second stage 21b, and a first distance measur...
|
|
JP2023032758A |
To generate templates easily and quickly.A position detection part 113 detects a position of a substrate by performing pattern matching using a template on a captured image obtained by an imaging part. A storage part 111 stores a second ...
|
|
JP7236481B2 |
Metrology methods, modules and targets are provided, for measuring tilted device designs. The methods analyze and optimize target design with respect to the relation of the Zernike sensitivity of pattern placement errors (PPEs) between t...
|
|
JP7234426B2 |
To facilitate alignment between masks after replacement even in a state where a substrate is left at an exposure operation position.A first mask 1 of a mask pair mounted on a double-side exposure device for exposing both surfaces of a su...
|
|
JP7234345B2 |
The invention provides a stage apparatus, comprising an object support comprising a ring shaped protrusion having an outer radius in a first plane, and configured to support an object with a radius in the first plane larger than the oute...
|
|
JP2023508538A |
The metrology target is a first target structure formed in at least one of the first region and the third region of the first layer of the sample, the first target structure comprising: a first target structure comprising a plurality of ...
|
|
JP7230937B2 |
A liquid crystal exposure apparatus has a measurement system having scales arranged apart from each other in the X-axis direction provided at a substrate stage holding a substrate and heads each irradiating the scales with a measurement ...
|
|
JP7230909B2 |
This method for producing a silicon carbide semiconductor device comprises: a step of forming a silicon carbide epitaxial layer 120 on a silicon carbide crystal substrate 110 having formed a recessed first alignment mark 111, thereby for...
|
|
JP2023027281A |
To provide a process control method of a semiconductor device which is subjected to lithography processing.A substrate is provided, and a photosensitive layer is provided on a main surface of the substrate. A substrate 100 includes a bas...
|
|
JP7225815B2 |
To provide a semiconductor substrate including an alignment mark that prevents reduction in a recognition rate even when a protective tape is present.A semiconductor substrate 10 according to an embodiment of the present invention includ...
|
|
JP7225388B2 |
Metrology targets, target design methods and menology measurement methods are provided, which estimate the effects of asymmetric aberrations, independently or in conjunction with metrology overlay estimations. Targets comprise one or mor...
|
|
JP2023024511A |
To provide a measurement apparatus (10) and method for determining a substrate grid describing a deformation of a substrate (12) prior to exposure of the substrate (12) in a lithographic apparatus (LA) configured to fabricate one or more...
|
|
JP7221781B2 |
To provide technology for positioning a printing plate with high precision by using a rotating positioning pin.A positioning mechanism 80 is provided with two positioning pins 83, 83 arranged spaced in a second direction D2, and a contin...
|
|
JP2023022066A |
To provide a measurement system detecting marks of sufficient number of marks for realizing required overlay accuracy, without deteriorating throughput.A measurement system (500) used in a microdevice manufacturing line includes a plural...
|
|
JP7220176B2 |
A substrate processing system (1000) configured to process a substrate (W) on which a plurality of divided areas are formed along with a plurality of marks. The system comprises a measurement device (100) that has a first stage (10) for ...
|
|
JP2023017779A |
To provide a method and an apparatus for correcting a pattern placement on a substrate.There is provided a method for correcting a pattern placement on a substrate, comprising: detecting three reference points for a substrate; detecting ...
|
|
JP2023504001A |
A method of quantifying the sensitivity of metrology to process variation, comprising performing measurements with a metrology tool on at least one metrology target located on at least one feature on a semiconductor wafer, thereby genera...
|
|
JP7216568B2 |
The present invention relates to a transportation device which is advantageous for suppressing the fluctuation of positional displacement when transferring an object and, more specifically, to a transportation device, which controls the ...
|
|
JP7216785B2 |
Techniques herein include systems and methods for correcting pattern overlay errors by correcting or adjusting bowing of wafers. Location-specific tuning of stress on semiconductor substrates reduces overlay error. Location-specific tuni...
|
|
JP2023013737A |
To provide a technique beneficial for reducing vibration in a second structure supported by a first structure.A processing device includes: a first structure supported by a vibration reduction mechanism; a drive mechanism supported by th...
|
|
JP2023011504A |
To provide a method of manufacturing a substrate in which an alignment mark is formed on the substrate itself.A method of manufacturing a substrate including an alignment mark, includes: a formation step of forming the alignment mark and...
|
|
JP2023010782A |
To avoid mask design from being complicated and suppress recognition failures of an alignment mark due to diffusion of infrared radiation.A semiconductor device comprises: a semiconductor substrate including an element formation region h...
|
|
JP7203959B2 |
An alignment device, method and equipment for a double-sided exposure, which belongs to the technical field of printed circuit boards. The alignment device comprises: a positioning mark (11), a marking mark (12) and a position acquisitio...
|
|
JP7203974B2 |
A method of applying a measurement correction includes determining an orthogonal subspace used to characterize the measurement as a plot of data. A first axis of the orthogonal subspace corresponds to constructive interference output fro...
|
|
JP7198912B2 |
Methods and apparatuses for determining in-plane distortion (IPD) across a substrate having a plurality of patterned regions. A method includes obtaining intra-region data indicative of a local stress distribution across one of the plura...
|
|
JP7196011B2 |
Provided is a direct drawing-type light exposure device which has a simple structure, can reduce costs, and can execute a light exposure process with high productivity. Multiple stages (3), which are work placement units, are connected, ...
|
|
JP7196269B2 |
To make it possible to easily attach a film mask firmly onto a transparent plate, and eliminate a problem of reduction in form accuracy of a pattern to be transferred.A peripheral part of a film mask 1 being received by a transparent pla...
|
|
JP7195411B2 |
A radiation system comprising a radiation source and a radiation conditioning apparatus, wherein the radiation source is configured to provide a radiation beam with wavelengths which extend from ultraviolet to infrared, and wherein the r...
|
|
JP2022553545A |
Kind Code: A1 An optical component and method of manufacturing the same are disclosed. The first optical component is a hollow-core photonic crystal fiber including an inner capillary for guiding radiation, an outer capillary covering th...
|
|
JP2022187831A |
To provide a measurement device advantageous in position measurement accuracy.A measurement device for measuring a position of an object includes: an imaging part configured to image a mark provided at the object and obtain analog data o...
|
