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JP2023104683A |
To provide a technique advantageous for achieving improvement of overlay accuracy and high throughput using a plurality of detection systems for detecting mutually different marks.A detection device for detecting a plurality of marks pro...
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JP7315718B2 |
A metrology tool, an aplanatic singlet lens, and a method of designing an aplanatic singlet lens are provided. The metrology tool is for determining a characteristic of a structure on a substrate. The metrology tool comprises an optical ...
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JP2023530864A |
Systems, apparatus and methods are provided for determining alignment of a substrate. An exemplary method may include emitting a multi-wavelength radiation beam comprising a first wavelength and a second wavelength toward a region of a s...
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JP7310617B2 |
Provided is an alignment mark detection apparatus capable of detecting even a work mark with a small luminance difference with respect to background and an alignment mark detection method thereof. According to the present invention, the ...
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JP2023095988A |
There is provided a method for determining correction to a semiconductor manufacturing process, the method comprising: obtaining (504) first sparse data measured (502) using a sparse sampling layout; obtaining (512) dense data measured (...
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JP2023528761A |
A patterning device pre-alignment sensor system is disclosed. The system comprises at least one illumination source configured to provide an incident beam along a normal direction towards the patterning device. The system further compris...
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JP2023528753A |
The present invention provides a method for calculating a corrected substrate height map of a first substrate using height level sensors. The method is sampling the first substrate with a height level sensor while the first substrate mov...
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JP2023095037A |
To provide a substrate processor advantageous in a point of combining shortening of a measurement time and reduction of an influence on exposure performance.A substrate processor (100) for processing a substrate, comprises: a plurality o...
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JP2023094329A |
To provide a technique advantageous for suppressing vibration after positioning a detecting system for detecting a specimen.There is provided a detector for detecting a specimen, the detector comprises: a detecting system for detecting t...
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JP2023528357A |
A method and associated apparatus are disclosed for performing position measurements for an alignment mark comprising a first periodic structure having a direction of periodicity along at least a first direction. The method comprises obt...
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JP2023528464A |
The present invention relates to a metrology target including a first target structure set having one or more first target structures formed within at least one of a first working zone or a second working zone of a specimen . The metrolo...
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JP2023527952A |
The present invention relates to a method and assembly (200) for locating an optical coupling point (11) and a method for producing a microstructure (100) at the optical coupling point (11). A method for locating an optical coupling poin...
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JP7301695B2 |
A control device for performing position control of a control target by imparting a feedforward operation amount to the control target to curb a control deviation even when a continuous target time of the control exceeds an upper limit i...
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JP2023091485A |
To provide a technique advantageous for combining inspection accuracy and throughput when detecting a position of an inspection target.A detection device for detecting a position of a detection target having a diffraction grating pattern...
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JP2023089658A |
To improve a yield of a semiconductor device.An exposure device in an embodiment includes a stage 140, a measurement device 144, and a control device 10. The control device 10 calculates each of a first correction coefficient correspondi...
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JP7299406B2 |
Apparatus and methods for determining a focus error for a lithographic apparatus and/or a difference between first and second metrology data. The first and/or second metrology data includes a plurality of values of a parameter relating t...
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JP7298752B2 |
To provide a method for manufacturing a semiconductor device capable of improving alignment accuracy.An alignment mark 3 for a rear face on a surface of a semiconductor substrate 1 is detected, and a resist mask patterned on a circuit pa...
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JP2023088697A |
To provide a technique advantageous in suppressing a stage control residual.An exposure apparatus for exposing a substrate via an original plate, includes: a substrate stage for holding the substrate; an obtaining unit for obtaining, for...
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JP2023526864A |
The overlay metrology tool includes a light source, an optical illuminator for illuminating an overlay target having periodic elements with one or more illumination beams, and an optical focus for directing diffracted light from the peri...
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JP2023087450A |
To provide a solid-state image sensor substrate excellent in alignment accuracy between a wafer and an exposure mask by increasing visibility of an alignment mark on the under layer of the wafer to improve detection accuracy of the align...
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JP2023086551A |
To provide an exposure method and an exposure system which can suppress reduction in productivity even when the size of an interposer is increased.An exposure method includes a first exposure step, and a second exposure step. The first e...
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JP2023086568A |
To provide a technique advantageous in improving the robustness against noise so as to measure the position of a measurement target with high accuracy.A measurement apparatus that measures position information of a measurement target is ...
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JP7295315B2 |
Provided are an overlay mark, and an overlay measurement method and a semiconductor device manufacturing method using the overlay mark. Specifically, provided is an overlay mark for determining relative misalignment between two or more p...
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JP2023525964A |
The present invention provides a method of determining the location of product features on a substrate. The method includes obtaining multiple position measurements of one or more product features on the substrate. The reference for this...
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JP2023083824A |
To provide a detecting apparatus that can detect positions of a plurality of marks on a substrate with high speed and high accuracy in a simple configuration.A detecting apparatus configured to detect a position of a predetermined patter...
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JP7292397B2 |
The present disclosure generally relates to photolithography systems, and methods for correcting positional errors in photolithography systems. When a photolithography system is first started, the system enters a stabilization period. Du...
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JP2023524217A |
The present disclosure provides methods and systems for correcting the projection of an image from a spatial light modulator (SLM) onto a substrate in the presence of cross-scan vibrations, including sub-pixel cross-scan vibrations. The ...
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JP7288896B2 |
A wafer holding device (200, 415) is configured to hold a wafer (205, 416) during operation of a microlithographic projection exposure apparatus and includes at least one sensor that is positionable in different rotational positions.
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JP2023078899A |
To reduce reduction of productivity.An exposure method includes the steps of: forming a first pattern formed by transferring a pattern of an original plate, a first alignment mark corresponding to a first mark formed on the original plat...
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JP7288020B2 |
A diffraction measurement target that has at least a first sub-target and at least a second sub-target, and wherein (1) the first and second sub-targets each include a pair of periodic structures and the first sub-target has a different ...
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JP2023522919A |
A system for measuring a beam. The system includes a measuring device configured to measure the beam and determine a signal based on the measured beam; and a feeding device. The system is configured to calculate noise in the signal and a...
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JP7284850B2 |
Techniques for delivering sub-5 nm overlay control over multiple fields. One such technique reduces overlay from the wafer side using wafer-thermal actuators. In another technique, the topology of the template is optimized so that the in...
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JP2023073772A |
To provide a manufacturing method for a semiconductor device that can suppress restrictions on design freedom and the complexity of a manufacturing process.After applying photoresist 2 on an SiC substrate 1, which serves as a translucent...
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JP2023073249A |
To provide a measuring device that can reduce an error in the wavelength of light with which a pattern is irradiated.A measuring device is to detect second light from a pattern irradiated with first light to measure the position of the p...
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JP7279197B2 |
The invention provides a method of obtaining a fingerprint model for modelling a spatial distribution of a performance parameter over a portion of a substrate, the method comprising: defining an initial fingerprint model related to the s...
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JP2023071150A |
To provide a technique advantageous for improving alignment accuracy.An information processing method includes: an acquiring process of acquiring an objective area including a plurality of shot regions; and a selecting process of selecti...
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JP7279032B2 |
A resonant amplitude grating mark has a periodic structure configured to scatter radiation incident on a surface plane of the alignment mark. The scattering is mainly by excitation of a resonant mode in the periodic structure parallel to...
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JP2023070992A |
To provide an information processor capable of performing high-accuracy correction by a small amount of data.An information processor (100) has: first acquisition means (101) for acquiring first data regarding a process of forming a patt...
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JP7278138B2 |
A substrate processing apparatus is provided. The apparatus includes an imaging unit that images a mark on a substrate, and a processor that aligns the substrate based on an image of the mark obtained by the imaging unit. If the alignmen...
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JP7270072B2 |
An interferometer system including: an optical system arranged to split a radiation beam from a laser source into a first beam along a first optical path and a second beam along a second optical path, and recombine the first beam and the...
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JP7266864B2 |
The present invention can accommodate variations in a height direction due to various kinds of substrates with different thicknesses, assembly error, and the like without using a complicated mechanism. On the upper surface of a stage o...
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JP7265827B2 |
To provide an exposure system advantageous in cost and productivity. The exposure system includes: a first exposure device exposing a first shot region of a substrate; a second exposure device exposing a second shot region other than the...
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JP7265493B2 |
An apparatus for determining information relating to at least one target alignment mark in a semiconductor device substrate. The target alignment mark is initially at least partially obscured by an opaque carbon or metal layer on the sub...
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JP7265020B2 |
The invention provides a stage system comprising a stage (ST) which is movable in respect of a reference structure. One of the stage and the reference structure comprises a reflective surface (REFS). An optical position sensor (IF1) is a...
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JP7264034B2 |
To provide a technique that inhibits the asymmetric deposition of epitaxial layers in a trench of an alignment mark.A method for producing a semiconductor device includes the steps of forming a trench 20 of an alignment mark on one princ...
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JP2023058247A |
To hold an object in a given place.A supporting device includes: a guide rail extending in a first direction; a carriage unit movable in the first direction with respect to the guide rail; a first member supported by the carriage unit or...
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JP7264290B2 |
A measurement device (100) is provided with: a slider (10) which holds a substrate (W) and which is movable parallel to the XY plane; a drive system that drives the slider; a position measurement system (30) which emits a plurality of be...
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JP7262921B2 |
Provided is an information processing apparatus for obtaining a correction value used for position alignment of an original plate and a substrate in a lithography apparatus forming patterns on a substrate, comprising: a first obtaining u...
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JP2023057858A |
To provide a technique useful for improving the reproducibility of position of a scope when fixing the scope.A mark detection device has: a support member; a scope for detecting a mark; a driving mechanism for changing the position of th...
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JP7261298B2 |
A mirror mounting member is formed of a ceramic structure with a prismatic or angular cylindrical shape and includes, as outer surfaces, a joining surface configured to join to a to-be-joined surface, and an inclined surface inclined rel...
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