To provide a treatment device which can easily perform control of keeping the liquid level of phosphoric acid constant in an etching tank.
The treatment device includes: an etching tank 3 with an overflow section 3a for treating a semiconductor wafer 1 with hot phosphoric acid by etching; a circulation filtering passage 5 for leading the phosphoric acid flowing over the overflow section 3a outside the tank 3 and returning it back to the tank 3 after filtering, heating and adding pure water; a phosphoric acid regenerator 6 for heating the phosphoric acid taken out of the circulation filtering passage 5 through branch piping 60 by adding hydrofluoric acid thereto; supply piping 140a for supplying the phosphoric acid regenerated by the phosphoric acid regenerator 6 to the etching tank 3; and a new liquid feeding section 8 for feeding a new phosphoric acid solution.
| JP5024048 | Wet etching method and wet etching equipment |
| JPS62133723 | MANUFACTURE OF SEMICONDUCTOR DEVICE |
| JPS55125633 | PRODUCTION OF SEMICONDUCTOR DEVICE |
KUBOTA NAOTO
SHINDO AKINORI
IZUTA NOBUHIKO
UEDA KOJI
Mitsue Obuchi
Tatsuya Ina