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WO/2024/086881A1 |
A robotic block laying machine for use in constructing a block structure, the robotic block laying machine including: a base; a boom extending from the base; a plurality of shuttles, wherein each shuttle is configured to: receive a block...
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WO/2024/086888A1 |
A control system for a robotic block laying machine including processing devices configured to: control a shuttle to cause the shuttle to move from the base to the block laying robot via the boom to thereby transport a block to the block...
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WO/2024/086882A1 |
A boom system for use in a robotic block laying machine used in constructing a block structure, the boom system including a boom having at least two pairs of telescopic boom and stick elements having at least one pivot joint therebetween...
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WO/2024/086886A1 |
A shuttle for a robotic block laying machine used in constructing a block structure, the shuttle being configured to transport a block via a boom of the robotic block laying machine to a block laying robot provided at a distal end of the...
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WO/2024/086887A1 |
A block laying robot for a robotic block laying machine used in constructing a block structure, the block laying robot being provided at a distal end of a boom of the robotic block laying machine, the block laying robot including: a layi...
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WO/2024/086884A1 |
A shuttle sequencing system for a robotic block laying machine used in constructing a block structure, the shuttle sequencing system being configured to store shuttles used for conveying blocks along a boom of the block laying machine, t...
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WO/2024/089912A1 |
The purpose of the present invention is to provide a device and a method for manufacturing a semiconductor crystal wafer, the device and the method being capable of easily and reliably manufacturing a semiconductor crystal wafer of high ...
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WO/2024/086883A1 |
An adhesive application system for a robotic block laying machine used in constructing a block structure, the adhesive application system configured to be supported proximate a block laying robot provided at a distal end of a boom of the...
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WO/2024/086189A1 |
Various aspects of a saw apparatus include a worktable, a cutting head that includes a circular saw blade, and a vacuum source. In a first aspect, the cutting head moves along a rail, and the vacuum source provides a negative pressure re...
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WO/2024/082769A1 |
A method for cutting a monocrystalline silicon square rod include the steps of: loading: providing a square rod on a working platform and clamping the square rod, and lowering the square rod until it comes into contact with a diamond wir...
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WO/2024/083766A1 |
The invention relates to an apparatus for artificially ageing blocks, in particular concrete blocks, vitrified bricks and natural stones, with the following features: an underlying surface (2), on which the blocks (1) can be placed in su...
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WO/2024/084404A1 |
The present disclosure is enclosed in the area of rock extraction, in particular the processing of cutting stone masses in quarries to provide the guiding of a diamond wire, including blind rock cutting. It is an object of the present di...
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WO/2024/086184A1 |
Various aspects of a saw apparatus are disclosed. In a first aspect, a worktable is coupled to a vacuum source configured to provide a negative pressure region beneath the worktable. A partition divides the negative pressure region into ...
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WO/2024/083927A1 |
A surface saw (100) for sawing in a surface (160), the surface saw comprising a circular cutting blade (110), a control unit (130), and at least one metering wheel (120, 170, 310, 400, 450), where the metering wheel (120, 170, 310, 400, ...
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WO/2024/086186A1 |
Various dust collection aspects are disclosed. In a first aspect, a vacuum source is powered by a vacuum motor housed within a filter coupled to the vacuum source, and a worktable includes a center slot aligned to a circular saw blade. T...
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WO/2024/078289A1 |
A precision compensation method and system for a double-shaft scribing machine, relating to the technical field of scribing machine cutting. The method comprises: during compensation for a visual module (308), controlling a first Y-shaft...
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WO/2024/070013A1 |
Provided is a cutting device for cutting a plate-like body that is being conveyed, the cutting device including: a rotary cutter including a lower unit that is disposed below the plate-like body and that has a roll and a lower blade atta...
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WO/2024/067727A1 |
The present application relates to a drilling method and a drilling device. After the drilling device acquires coordinate information of an installation area by means of a coordinate identification element, a first moving mechanism drive...
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WO/2024/070309A1 |
To properly remove the edge portion of a first substrate in consideration of a non-joint region in a notch portion formed on the first substrate in a polymeric substrate in which the first substrate and a second substrate are joined to e...
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WO/2024/068266A1 |
The invention relates to a hard metal tip (502), in particular a hard metal tip for a drilling tool, having at least one cutting edge (506) and a joining surface for connection of the hard metal tip to a main part of the drilling tool. A...
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WO/2024/072657A1 |
A nip roller system includes a nip roller configured to contact a glass ribbon and apply an adjustable downward force to the glass ribbon as the glass ribbon travels between the nip roller and an opposing roller of a glass ribbon conveyi...
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WO/2024/067755A1 |
The present invention relates to the technical field of wire cutting, in particular to a wire cutting machine and a control method therefor. The present application aims to solve the problems of poor stability and low precision of existi...
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WO/2024/067712A1 |
The present invention relates to the technical field of high-hardness and high-brittleness material cutting, and particularly relates to a wire cutting machine and a crystal holder clamping detection method thereof. The present applicati...
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WO/2024/063660A1 |
The object of the invention is a device for clamping and machining thin-walled closed envelopes with curvilinear contours comprising a base (1), an intermediate plate (2) attached to it, and a body (4) placed on the intermediate plate (2...
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WO/2024/060845A1 |
A method for removing silicon powder in a coolant for monocrystalline silicon slicing with a diamond wire, including following steps: preparing an inorganic coagulation-inducing saline solution; mixing the inorganic coagulation-inducing ...
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WO/2024/061734A1 |
A masonry drill head made from a sintered cemented carbide, characterized in that the masonry drill head has an at least section-wise planar joining end for heat induced joining to a shaft, a working end (104) for shattering masonry mate...
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WO/2024/053975A1 |
A wire saw device for an excavator, of the present invention, comprises: a support plate; an excavator connection part coupled to the support plate so as to be detachably coupled to an excavator arm; a support frame coupled to the suppor...
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WO/2024/052758A1 |
Tool holder for a manual tile-cutting machine, comprising a main sliding body (5) equipped with an actuation handle (6), an engraving tool (V) mounted in a front lower part of said main body (5) arranged on a longitudinal axis of the too...
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WO/2024/046402A1 |
A wire saw unit, comprising: a cutting mechanism (1), the cutting mechanism (1) being used for winding a cutting wire; a tension mechanism (2) comprising a tension wheel (21) for adjusting the tension of the cutting wire, the tension whe...
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WO/2024/046699A1 |
The invention relates to a machine tool (10) having a rotating tool (20), wherein, to support a conventional braking operation, the machine tool has an eddy current brake (2), wherein the eddy current brake comprises a means (14) for gen...
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WO/2024/045997A1 |
A cleaning device (100) for a net monitor (200) and a slicer equipped with the cleaning device (100). The cleaning device (100) includes a cleaning member (10). The cleaning member (10) is constructed with a cavity (11) and a plurality o...
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WO/2024/045996A1 |
A processing method of cutting through a workpiece includes following steps: obtaining measured bow values of all areas in a wire net when a feed rate of a workpiece cutting reaches a preset threshold, comparing the measured bow values o...
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WO/2024/045384A1 |
A cutting method for an ultrathin sapphire wafer, comprising the steps that: a) bonding an ingot (1) in a square resin mold (2), and fixing the square resin mold (2) on a worktable by means of a resin strip (3); b) opening cutting fluid ...
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WO/2024/046000A1 |
A monitoring mechanism at least includes a monitoring unit, the monitoring unit is disposed in a slicing chamber and is configured to continuously monitor a state of a wire mesh and have no contact with the wire mesh. The monitoring mech...
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WO/2024/046437A1 |
A wire cutting machine, comprising a cutting assembly. The cutting assembly comprises a cutting frame (1), a first bearing box (3), a second bearing box (4), a main roller (2) and an adjustment assembly (8), wherein the adjustment assemb...
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WO/2024/046002A1 |
An unloading and collecting device for slice and a cutting machine with the same are provided. The device is configured to collect the slice cut from an end of a silicon rod. The device includes a tray, a box, and a movable assembly, and...
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WO/2024/046438A1 |
A squaring-milling integrated machine, belonging to the technical field of hard and brittle material machining apparatuses. The squaring-milling integrated machine comprises at least a second station (2), the second station (2) comprisin...
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WO/2024/045995A1 |
A processing method for a wire mesh abnormality includes the steps of: obtaining position heights of cutting wires in a wire mesh; obtaining a jumping value of each of the cutting wires based on a vertical difference between each of the ...
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WO/2024/042559A1 |
Holding unit (10) for holding a sheet (200) comprising a stabilizer device (11) provided with gripping members (12, 13) of which at least one is mobile with respect to the other along an axis of grip and release (Z) to hold said sheet (2...
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WO/2024/042829A1 |
Provided is a cylindrical grinding device that produces a slicing single crystal by performing cylindrical grinding in which the outer peripheral surface of a grinding single crystal is ground while the grinding single crystal is caused ...
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WO/2024/037742A1 |
The invention relates to a cutting disk, comprising a core disk (12) that is made of a metal material, and cutting segments (14) that are arranged on the circumference of the core disk (12) and each have a metal sinter matrix (18) in whi...
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WO/2024/032734A1 |
The present application relates to the technical field of loading adjustment in equipment such as a grinding machine, and specifically provides a loading device and a grinding machine comprising the loading device. The loading device com...
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WO/2024/034171A1 |
This cutting device cuts an object to be cut. The cutting device comprises a table, a cutting mechanism, and an imaging device. The table holds the object to be cut. The cutting mechanism cuts the object to be cut held by the table. The ...
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WO/2024/021500A1 |
A dust collection device, comprising: a main housing; and a suction pipe, which is arranged on the main housing and has a degree of freedom of movement relative to the main housing in a lengthwise direction of the suction pipe. The dust ...
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WO/2024/018495A1 |
Method for holding and performing work on a sheet (200) which has a first lateral surface (210), an opposing second lateral surface (211) and a perimeter edge (212), comprising: a step of holding said sheet (200), a step of working said ...
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WO/2024/012908A1 |
The invention relates to an apparatus (1) for cutting panels to size, having at least one holding unit (2) for holding a cutting tool (3, 28) for scoring and/or cutting the panels. In order to reduce the effort involved in cutting panels...
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WO/2024/014815A1 |
A wire saw apparatus for an excavator of the present invention comprises: a main body frame having an excavator connection part on the upper side and a driving pulley and a driven pulley therein; a horizontal frame coupled to the front b...
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WO/2024/014307A1 |
This scribe table (6) comprises grooves (62a to 62c) that are formed in a mounting surface (61) on which a frame unit (20) is mounted, and suction holes (63a to 63c) that are connected to the grooves (62a to 62c). The grooves (62a to 62c...
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WO/2024/008452A1 |
A method for simultaneously slicing a multiplicity of slices (34) from a workpiece (1) by means of a wire saw, comprising a slicing grinding process, wherein a workpiece (1) is moved perpendicularly to a longitudinal axis (26) of the wor...
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WO/2024/009163A1 |
A slab cutting system (10) comprising: - at least one support (20) configured to rest on a slab (L) to be cut and provided with at least one sliding rail (212) developing along a longitudinal axis (A); - an engraving slider (50) provided...
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