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Patent Searching and Data


Matches 1 - 50 out of 21,231

Document Document Title
WO/2021/063769A1
The present invention relates to a cutting method and a cutting device for scoring the surface of, preferably plate-like, components made of glass or ceramic, preferably glass panes, and to a method for splitting, preferably plate-like, ...  
WO/2021/058519A1
Systems and methods for data security with power tools are provided. The systems and methods include transmitting an initialization command, by a processor of a computing device, to a power tool configured with a secure element. The secu...  
WO/2021/058396A1
A brick cutter assembly (800) being able to efficiently cut bricks to desired sizes by means of at least three moving cutters driven by a single actuator through a linkage system. A preferred embodiment of a brick cutter assembly (800) a...  
WO/2021/058108A1
The current invention relates to a device for picking up objects, said objects comprising a pyramidally shaped end (9) and an substantially flat surface (11, 5) on the opposite end, in a predefined orientation.The inventions also relates...  
WO/2021/062190A1
An apparatus can include a first material support member and a second material support member each configured to removably attach to a tile tray. The material support members can define a linear saw blade slot through which a saw blade e...  
WO/2021/058522A1
Systems and methods for data security with power tools are provided. The systems and methods include a power tool that generates a data package, and a secure element of the power tool that generates a unique signature for the data packag...  
WO/2021/056744A1
Provided are a cover plate (1), a display panel, and a manufacturing method for the cover plate (1). The cover plate (1) comprises a glass cover plate (11), the glass cover plate (11) comprising a hole digging area (111); an encapsulatin...  
WO/2021/046864A1
Disclosed is a tool bit structure, comprising a cutting edge part (10), wherein the cutting edge part (10) comprises a cutting main body (11), and an outer surface of the cutting main body (11) comprises a front end face (11a) and an out...  
WO/2021/049570A1
The present invention relates to a method of manufacturing a semiconductor device using an adhesive sheet having, in the following order, an adhesive layer (X1) containing heat-expandable particles, a base material (Y), and an adhesive l...  
WO/2021/043818A1
The invention relates to a suction extraction device (11) for the collected removal of cooling water for wet drill-holes on a first building wall, comprising: a housing (13) on which a through opening (23) is provided for the passage of ...  
WO/2021/039720A1
A support structure 10 for an ultrasonic resonator supports an ultrasonic resonator 16, in which first and second boosters 14, 15 are coaxially secured at the respective axial sides of an ultrasonic horn 13 to which a machining tool 12 i...  
WO/2021/035082A1
A tile saw for cutting tile includes a frame assembly on which a rail assembly is mounted and a table assembly that is movable along the rail assembly. The table assembly includes a table and wheels mounted on the underside thereof that ...  
WO/2021/033924A1
The objective of the present invention is to enable: a tile to be uniformly chamfered regardless tile standard by mechanically chamfering the rear surface part thereof without control or adjustment in a state in which surface parts of a ...  
WO/2021/027985A1
The present invention relates to a device (1), having a tool holder (2) and a tool blade (3) for turning an optically functional surface (24) of a workpiece (13) made of glass or glass ceramic and having an apparatus (4) for producing, g...  
WO/2021/027031A1
A specialised hole-opening device for a back-bolt dry-hanging curtain wall, comprising a bottom plate (1), and a hole-opening apparatus (2) and a clamping apparatus (3) mounted on the upper end of the bottom plate (1). The hole-opening d...  
WO/2021/027326A1
Silicon rod cut-off equipment, comprising: a silicon rod feeding device (2), provided between a storage area and a cutting operation area (17) and used for transferring to the cutting operation area (17) a silicon rod (16) to be cut whic...  
WO/2021/030775A1
Reclamation or recycling of a semiconductor workpiece includes vaporizing the structures and materials deposited, implanted, or formed in or on the substrate with minimally acceptable damage to the crystalline substrate through direct io...  
WO/2021/028374A1
The invention relates to a cable saw (1) for cutting a solid workpiece (W), such as a concrete or stone block, comprising: at least one saw cable (3) which is driven by a drive (2), wherein the saw cable (3) forms a saw portion (4) for e...  
WO/2021/023665A1
The invention relates to a system for securing an anchor (40) in a borehole in a mineral substrate, in particular concrete, mortar, or brickwork, comprising an anchor (40) with a core section and a threaded section and comprising a furro...  
WO/2021/023664A1
The invention relates to a system for securing an anchor (40) in a borehole in a mineral substrate, in particular concrete, mortar, or brickwork, comprising an anchor (40) with a core section and a threaded section (51) and comprising a ...  
WO/2021/022844A1
A silicon rod cutting-grinding integrated machine, and a silicon rod (100, 200) cutting-grinding method. The silicon rod cutting-grinding integrated machine comprises: a base (1), a cutting apparatus (2), a grinding apparatus (3), and a ...  
WO/2021/024163A1
The machine (1) comprises: - one base frame (2, 3); - one worktop (4) for at least one slab (L), associated with the base frame (2, 3); - one cutting head (5) adapted to cut the slab (L), associated with the base frame (2, 3) by interpos...  
WO/2021/022960A1
A utilization method for a silicon rod leftover material. The qualified leftover material is selected according to the extreme difference of minority carrier lifetime in the length direction and the extreme difference of resistivity in t...  
WO/2021/023652A1
The invention relates to a system for securing an anchor (40) in a borehole in a mineral substrate, in particular concrete, mortar, or brickwork, comprising an anchor (40) with a core section and a threaded section (52) and comprising a ...  
WO/2021/014046A1
The present invention relates to a new method for producing marble tiles, the tiles being produced by cutting marble slabs from rough blocks, with the advantage that tiles of up to 3200 x 2000 cm, each 6mm thick, can be produced, since t...  
WO/2021/013238A1
Disclosed is a method for cutting a silicon rod, comprising: adjusting, during a cutting process, the wire-supply amount and/or feed rate of new wire at different positions of a crystal cross-section, or using a cooling tube (4) to suppl...  
WO/2021/009960A1
[Problem] To provide a method for dividing a composite material, said method causing no cracks in end surfaces of a brittle material layer and causing no deterioration in the quality of end parts of a resin layer. [Solution] The present ...  
WO/2021/009961A1
[Problem] To provide a method which is capable of dividing a composite material, wherein a brittle material layer and a resin layer are superposed upon each other, without causing cracks in end surfaces of the brittle material layer. [So...  
WO/2021/001205A1
The invention relates to a ring saw (2) comprising a tool holder (5) for guiding a ring saw blade (1) in a cutting plane, a motor, a drive wheel, at least one guide roller (41) and at least one guide drum (43). The drive wheel is arrange...  
WO/2021/001228A1
A circular saw blade (1) has a flat, annular support (7) that has a lateral face (14) and an outer circumference (8). One or more cutting elements (3) are arranged along the outer circumference of the support. At least one annular groove...  
WO/2021/000966A1
A process of forming a non-optically detectable authentication marking (210,320, 410,535) in a diamond (200,300). Authentication marking (210,320,410,535) is formed adjacent the outer surface of an article formed from a diamond material ...  
WO/2021/001194A1
A ring saw (2) comprises a tool holder (5) for guiding a ring saw blade (1). The tool holder is disposed in a receiving space (33). A drive wheel (6) serves to drive the ring saw blade and is arranged in the cutting plane and is coupled ...  
WO/2021/001157A1
The invention relates to a machining tool (1) comprising a strip-shaped teeth support body (2) and a plurality of teeth (3) each having a tooth tip (4) which is coated with cutting particles (5) to form a plurality of geometrically undef...  
WO/2020/261079A1
Workbench (1) for supporting and moving articles comprising a frame (22), a support surface (24) able to tilt relative to the frame (22) and pass from an initial horizontal position into a final inclined position, at least one rigid elem...  
WO/2020/261172A1
Machine for the surface processing of products (L) under controlled pressure conditions different than the ambient pressure, comprising • at least one sealed chamber (12, 13), provided with at least one opening (15, 16), that can be cl...  
WO/2020/126787A3
The invention relates to a method for producing semiconductor wafers from a workpiece by machining the workpiece using a wire saw, to a wire saw, and to semiconductor wafers made of monocrystalline silicon. The method has the steps of fe...  
WO/2020/260093A1
The invention relates to a method for detecting whether a slip clutch has been triggered in a machine tool and to a machine tool which is designed to carry out the proposed method. For this purpose, the machine tool comprises in particul...  
WO/2020/263154A1
A work tool (100) comprising: a cutting chain (110), a drive mechanism for driving the cutting chain (110), an annular member (120) arranged rotatably supported by one or more support rollers (130,140,150), wherein the annular member com...  
WO/2020/259866A1
The invention relates to a milling bit for a ground milling machine, a bit holding system, a milling drum and a ground milling machine.  
WO/2020/259867A1
The invention relates to a bit holding system comprising a milling bit, a bit holding system and a clamping device, in particular a clamping screw. The invention also relates to a milling bit for a ground milling machine with a bit holdi...  
WO/2020/254059A1
A method of obtaining multiple measurements of a rough gemstone comprises feeding a rough stone into a measurement system using a feed system; detecting that a single rough stone has been fed into the measurement system and halting the f...  
WO/2020/244406A1
A splitting rod (5) of a rock splitting machine, wherein the main body of the splitting rod (5) is made of a flexible material. In operation, pressurized liquid acts on the inside of the flexible splitting rod (5), and the splitting rod ...  
WO/2020/245153A1
The invention relates to a tool (1) for treating a road surface, having at least: • a plurality of annular cores (10. i), each having an opening (16) for placing on a rotatable shaft, wherein the plurality of cores (10. i) are arranged...  
WO/2020/246928A1
The present disclosure relates to a dust container arrangement (15, 120, 210) adapted to be fluidly coupled to a fan arrangement (13) comprised in a power tool (1) via an at least partly flexible dust conduit (14). The dust container arr...  
WO/2020/246152A1
The present invention realizes a method which prevents metal contamination when cutting a polycrystalline silicon rod. The present invention pertains to a method, for cutting a polycrystalline silicon rod (S), that includes a cutting ste...  
WO/2020/239348A1
The invention relates to a method for separating a plurality of slices from workpieces during a number of separating processes by means of a wire saw, which comprises a wire gate formed of moving wire sections of a saw wire, which is cla...  
WO/2020/240264A1
This device is designed to minimize human error. Milling machine and its components are placed vertically on the glass and portability, is the main advantage of this machine. Given that this machine is portable, all components are mounte...  
WO/2020/233279A1
Provided is a method for processing a single crystal optical fiber with a uniform diameter. The single crystal optical fiber with an uniform diameter is obtained by obtaining a crystal having a length of 30-300 mm by means of a Czochrals...  
WO/2020/236246A1
Silicon carbide (SiC) wafers (8A) and related methods are disclosed that include intentional or imposed wafer (8A) shapes that are configured to reduce manufacturing problems associated with deformation, bowing, or sagging of such wafers...  
WO/2020/234119A1
A cutting machine (1, 101), preferably a contour-cutting machine for cutting expanded resins, fibers or fabrics, which comprises a tensioning system (8, 108) for tensioning a cutting element (3, 103), which is configured to exert at leas...  

Matches 1 - 50 out of 21,231