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WO/2023/232020A1 |
A cutting device. The cutting device comprises a wire cutting mechanism and a power input mechanism. The wire cutting mechanism comprises a cutting wire (11). The cutting wire (11) is used for cutting a rod body (10). The power input mec...
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WO/2023/226841A1 |
A chip removing device for removing a tape chip, comprising: a bearing platform (1), which is provided with a blanking hole (10); a support frame (2), which is provided with a support arm (21); and a cutting tool (3), which slides on the...
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WO/2023/226643A1 |
The present invention provides a real-time automatic control silicon wafer production method and system, a medium, and a device. The solution comprises: positioning silicon rods by means of a robot to obtain positions of the silicon rods...
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WO/2023/226735A1 |
A curved form cutting wire saw machine and a cutting method, the wire saw machine comprising a frame (1), a first cutting roller (2), a second cutting roller (3), a winding roller (4) and a workpiece feeding apparatus; a cutting wire (9)...
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WO/2023/193079A4 |
The present patent of invention relates to a new type of decorative coating consisting of an assembly comprising as its main element a sheet of natural translucent rock (LR) intercalated with polarised films (PP) which, when exposed to a...
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WO/2023/227099A1 |
A semiconductor process apparatus and a calibration device. In the calibration device, a mounting platform (1) is used for mounting a driving mechanism (2) and a calibration mechanism (3), wherein the driving mechanism (2) comprises a ca...
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WO/2023/228166A1 |
The grooved cutting segment is a composite of metals and diamond grains that decreases contact with the surface it's cutting due to grooves formed during the molding process. The grooves are parallel to the axis of the central bush. The ...
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WO/2023/226771A1 |
The present invention relates to a cutting apparatus and a cutting method, relating to the field of machining. The cutting apparatus comprises a frame, cutting rollers, a winding roller, a plurality of annular cutting wires and a workben...
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WO/2023/222132A1 |
A filter device (50) for a cutting fluid, a cleaning method for the filter device (50), and a filter circulation system. The filter device (50) comprises a filter cartridge, a filter screen (56), and an ultrasonic cleaning assembly (120)...
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WO/2023/218961A1 |
This manufacturing method for a glass plate comprises a cutting step S3 for removing an edge section Ga in the width direction of a glass plate G1 in a state where the glass plate G1 is supported in a vertical orientation. The cutting st...
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WO/2023/217542A1 |
The invention relates to a chisel (10) that has a working portion (12), a shank portion (14), an impact surface (16), and a longitudinal axis (L) extending through the working portion (12), the shank portion (14) and the impact surface (...
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WO/2023/218966A1 |
A glass plate manufacturing method according to the present invention includes a cutting step S3 for removing an end section Ga in the width direction of a glass plate G1 in a state in which the glass plate G1 is supported in a vertical ...
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WO/2023/217657A1 |
There is provided a method of mining rock using a disc cutter comprising a cutter body with a diameter, d, and a thickness, t, a plurality of tool holders mounted about a peripheral surface of the cutter body and a plurality of cutting e...
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WO/2023/217610A1 |
The invention relates to a method (100) for producing a drill segment (16) for a drill bit (10), in particular for a drill bit (10) for machining reinforced concrete, wherein the drill segment (16) comprises at least one layer (24) havin...
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WO/2023/216476A1 |
The present application relates to the technical field of wafer processing, and in particular to a cleaving machine. A cleaving machine, comprising: a frame provided with a mounting plate; a rotating disc provided on the mounting plate a...
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WO/2023/215144A1 |
The invention provides a method of locating a position of an electrical fixture behind a panel by using an aperture cutting guide comprising a support plate and a guide tube having a longitudinal aperture. The support plate is formed wit...
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WO/2023/209435A1 |
The method for slot milling (14) into a cladding panel (7), the cladding panel (7) and the method for fastening of cladding panels (7) to a load-bearing subconstruction of a building, according to the invention, are applicable in the fie...
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WO/2023/207614A1 |
The present invention provides a cutting saw and a control method for the cutting saw, the cutting saw comprising a casing, a cutting part, a driving part, a power supply part, a lighting part and a control panel. The control panel is el...
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WO/2023/210143A1 |
This glass plate manufacturing method comprises: a first cutting step in which a glass ribbon is cut by a first cutting device 2 while said ribbon is being molded and conveyed, and a glass plate is thereby cut out; and a second cutting s...
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WO/2023/211026A1 |
A cutting robot according to the present invention comprises: a main frame which is mounted to both sides of a vehicle body that can travel, so as to be able to ascend, descend, and rotate; a first hydraulic cylinder that is connected be...
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WO/2023/201977A1 |
The present invention relates to a jacking-type stone slab multi-wire cutting machine having four columns and four guide wheels. The cutting machine comprises a machine platform and a frame. The frame is provided with a cutting assembly,...
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WO/2023/203035A1 |
A method for processing a silicon wafer, the method including cutting an ingot to form a wafer, extracting from measured shape data a cross-sectional profile, the cross-sectional profile passing through the center of the wafer and being ...
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WO/2023/204746A1 |
Electrically powered construction equipment (100, 1200, 1300, 1400, 1500) comprising an electric motor (120) arranged to power an abrasive cutting tool (130) via a drive arrangement (200), the abrasive cutting tool (130) comprising abras...
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WO/2023/202218A1 |
A cutting device of a stone slab multi-wire cutting machine, and a multi-wire cutting machine. The cutting device comprises a frame (2) and a cutting assembly (3). The cutting assembly (3) comprises a first wire winding and unwinding mec...
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WO/2023/202264A1 |
A slicing machine, comprising a frame, and a cutting device and a cutting line cooling system which are arranged on the frame. The cooling system comprises: a liquid supply container (3), in which a cutting liquid is accommodated; a filt...
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WO/2023/203115A1 |
Herein is provided a method of milling a brittle workpiece (46) using a milling tool (10), • - the workpiece (46) comprising a material, the material having a Ductile-Brittle Transition Undeformed Chip Thickness, DBh rn, • - the mill...
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WO/2023/197516A1 |
The present application relates to the technical field of wafer cutting, and provides a rotary adjusting device for a dicing head, and a dicer. The rotary adjusting device for a dicing head comprises: a mounting seat; a transmission stru...
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WO/2023/195886A1 |
A tool arm (130) for a power cutter (100), the tool arm comprising a metal component (131) and a non-metal component (132) arranged to support and to enclose a drive mechanism, the drive mechanism comprising a first drive pulley, a secon...
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WO/2023/193079A1 |
The present patent of invention relates to a new type of decorative coating consisting of an assembly comprising as its main element a sheet of natural translucent rock (LR) intercalated with polarised films (PP) which, when exposed to a...
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WO/2023/195232A1 |
[Problem] Provided are a cleaving system and a cleaving processing method which can cleave smoothly, and in an assured manner, an edge of a sheet glass to be cleaved in a cleaving process. [Solution] A cleaving system 10a operates such t...
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WO/2023/194595A1 |
The method for shaping a carrier sheet of high hardness, in particular a gres sheet, comprises the steps of providing a solid carrier sheet of high hardness having a thickness of at least 6 mm; covering (S100) a front surface of the carr...
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WO/2023/185705A1 |
A cutting device, comprising a box body, a workbench arranged on the box body, and a cutting assembly arranged on the box body, wherein the workbench comprises a bench plate used for bearing a workpiece; the bench plate is provided with ...
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WO/2023/179662A1 |
A method and system for controlling mortar spraying during silicon wafer cutting. A comparison table between operation states and position adjustment values in different execution modes is established in advance, so as to determine an id...
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WO/2023/181305A1 |
Provided is a multi-wire electric discharge machining apparatus comprising: a plurality of guide rollers around which a wire electrode is wound a plurality of times to guide the travel of the wire electrode; a machining power supply that...
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WO/2023/179685A1 |
The present application provides a blanking temporary storage table. The blanking temporary storage table comprises: a support frame for supporting a silicon wafer assembly; a material hanging device provided on the support frame and use...
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WO/2023/179678A1 |
A feeding temporary storage table, comprising: a support frame (6) used for supporting a crystal bar assembly; a material hanging device (7) disposed on the support frame (6) and used for fixing the crystal bar assembly; and a material r...
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WO/2023/174241A1 |
A production method for a monocrystalline silicon wafer (1) and a monocrystalline silicon wafer (1), relating to the field of production and manufacturing of semiconductor silicon wafers, and capable of producing a monocrystalline silico...
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WO/2023/171903A1 |
The present invention provides an apparatus for cutting rock having a free surface by using a wire saw, the apparatus comprising: a body portion; a power unit installed in the body portion; a wire saw of which one side is inserted into t...
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WO/2023/169515A1 |
A diamond wire saw with a prolonged service life, the diamond wire saw comprising a wire (30), a plurality of beads strung on the wire (30), and a covering layer (40) provided on an outer surface of the wire (30) to fix the beads. Each b...
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WO/2023/166233A1 |
The invention relates to a cooled cutting system (1) comprising a rotating cutting disc (2) coupled to a cutting tool (11) of a cutting device, and a cooling device for cooling said cutting disc (2) when it is in use. The cooling device ...
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WO/2023/158054A1 |
The present invention relates to a core drill for forming a hole in a workpiece and, more specifically, to a core drill formed as a separable type having a structure that facilitates discharge of foreign substances, improves drilling wor...
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WO/2023/149854A1 |
An apparatus formed to dampen the vibrations that occur in the length stud (2) elements of hydraulic rock breakers, and is characterised in that; including a mounting slot (1a) formed from one end to the other on one side that allows the...
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WO/2023/149587A1 |
A small-sized wire saw device may comprise: a stand portion which comprises a main frame formed in a bar shape elongated in back and forth directions, an exterior frame located at the front portion of the main frame, and a connecting fra...
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WO/2023/145228A1 |
[Problem] To achieve a well balance between tool service life and quality maintenance, by imparting a functional shape to a cutting edge of a punch, when performing a shearing process on an amorphous alloy foil. [Solution] This shearing ...
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WO/2023/142639A1 |
A wafer rod (60) squaring system and method. The wafer rod (60) squaring system comprises: a squaring cavity (10) used for removing edge skins (62) of a wafer rod (60); and a movement platform (30) provided on one side of the squaring ca...
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WO/2023/140604A1 |
The apparatus for reverse cutting of a structure, according to the present invention, comprises a pair of reverse pulley devices, the pair of reverse pulley devices comprising: main tubes inserted and mounted so as to penetrate two holes...
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WO/2023/137821A1 |
A method for machining deep and micro holes of a monocrystalline silicon material, comprising the following steps: step 1, dividing hole machining into five times of cutting, and calculating a single effective cutting depth Q value accor...
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WO/2023/139617A1 |
A system (1) for working hard and abrasive surfaces is described, comprising: a support and containment structure (3) equipped with a containment hole (5); and a spindle (7) to be inserted in the containment hole (5), which is elongated ...
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WO/2023/138193A1 |
A silicon wafer cutting apparatus and a silicon wafer cutting device. The silicon wafer cutting apparatus comprises a cutting assembly (1) and a spraying assembly (2). The cutting assembly (1) comprises a wire mesh (10) and at least two ...
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WO/2023/136649A1 |
Provided is a method for removing a dousing tank of a heavy water reactor structure. The method for removing a dousing tank of a heavy water reactor structure comprises: a step in which a dousing tank of a heavy water reactor structure i...
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