| Document |
Document Title |
|
WO/2023/194099A1 |
The present invention relates to a two-part, room temperature curable heat and fire retardant composition comprising a first part comprising 1) an epoxy resin; and 2) a flame retardant compound; and a second part comprising 1) a first am...
|
|
WO/2023/190508A1 |
An optical member pertaining to an embodiment of the present invention includes a structure represented by formula (i). In the formula: R1 is a hydrogen atom or an aryl group; a is an integer of 0 to 5; b is an integer of 0 to 4; R2 is a...
|
|
WO/2023/190810A1 |
The present invention relates to a photosensitive resin film containing (A) a compound having an ethylenically unsaturated group, (B) a thermosetting resin, (C) a photopolymerization initiator, (D) an inorganic filler, and (E) a fluorine...
|
|
WO/2023/189030A1 |
The present invention provides a thermosetting resin composition which is capable of suppressing the generation of a void space between a sheet and an adherend that has a roughened surface even if pressing is performed with a low pressur...
|
|
WO/2023/191109A1 |
A two-component curable composition comprising: liquid A that contains a thermal-conductive filler, a reactive diluent, and an epoxy compound that has two epoxy groups and has, between the two epoxy groups, at least one selected from the...
|
|
WO/2023/189150A1 |
Provided is a method for producing an automobile structural body, by which it is possible to suppress appearance defects in the automobile structural body. Also provided is a curable composition which is suitably used in the production o...
|
|
WO/2023/189298A1 |
Provided is a resin composition that has exceptional heat resistance and enables bonding of a copper foil and a glass substrate using a lamination method. This resin composition contains: two or more polymers selected from the group cons...
|
|
WO/2023/184202A1 |
The present disclosure provides latent amine compositions which are used as a curing agent for flame resistant epoxy systems, the amine-epoxy resin compositions, and the cured products from amine-epoxy composition.
|
|
WO/2023/190221A1 |
Provided is a thermosetting resin composition capable of reducing the dielectric loss tangent while having high permittivity. A thermosetting resin composition containing (A) an epoxy compound, (B) a compound having a maleimide group, ...
|
|
WO/2023/190571A1 |
Provided is a conductive composition that can form a cured product having excellent conductive properties and adhesion to an adherend even at a lower curing temperature than is conventional. A conductive composition according to the pres...
|
|
WO/2023/189297A1 |
The present invention provides a resin composition which enables the bonding of a copper foil and a glass substrate by a lamination method, while having excellent dimensional stability. This resin composition contains a polyimide resin t...
|
|
WO/2023/188297A1 |
A photosensitive resin film containing (A) a compound having an ethylenic unsaturated group, (B) a thermosetting resin, (C) a photopolymerization initiator, (D) an inorganic filler, and (E) a fluorine-containing resin, wherein the (D) in...
|
|
WO/2023/184762A1 |
Disclosed are a degradable composite material, a fan blade, and a method for preparing same. The degradable composite material of the present invention comprises, in percentages by mass, 30-40% of a degradable epoxy resin composition, 45...
|
|
WO/2023/190694A1 |
The present invention addresses the problem of providing an optical waveguide resin composition having excellent photocuring properties. The optical waveguide resin composition according to the present disclosure contains an epoxy resin ...
|
|
WO/2023/190693A1 |
The problem addressed by the present disclosure is to provide a resin composition for an optical waveguide, said resin composition excelling in photocurability. The resin composition for an optical waveguide according to the present disc...
|
|
WO/2023/182370A1 |
Provided are an electronic device and an epoxy resin composition for sealing having high storage stability and for which the curing rate can be enhanced during curing. This epoxy resin composition for sealing contains an epoxy resin (A),...
|
|
WO/2023/181960A1 |
A polymer including a partial structure represented by formula (1), a partial structure represented by formula (2), and a partial structure represented by formula (3). (In formula (2), Q1 represents a divalent organic group having either...
|
|
WO/2023/182046A1 |
The present invention provides an ester compound which is represented by at least one of general formula (1) and general formula (2). In general formula (1), each of R1 to R3 represents a hydrogen atom, an alkyl group or a caprolactone s...
|
|
WO/2023/182495A1 |
[Problem] To provide a curable resin composition for black light shielding for an inkjet, the curable resin composition having excellent surface curability in addition to high light-shielding properties, exhibiting stable adhesion under ...
|
|
WO/2023/181831A1 |
The present invention addresses the problem of providing a low-temperature-curable resin composition and an adhesive which are able to be inhibited from suffering bleeding. Provided is a resin composition comprising (A) an epoxy compou...
|
|
WO/2023/182141A1 |
Provided is a glycidyl amine-type fluorine-containing epoxy compound. The present disclosure relates to a fluorine-containing epoxy compound represented by general formula (1). In general formula (1), n each independently represents an i...
|
|
WO/2023/183272A1 |
Provided herein is a two-component thermally-conductive epoxy adhesive.
|
|
WO/2023/179521A1 |
A polymeric scaffold useful for conjugating with a targeting moiety can form a targeting moiety-polymer-drug conjugate. A targeting moiety-polymer-drug conjugate is prepared from the polymeric scaffold. Compositions comprise the conjugat...
|
|
WO/2023/182358A1 |
The present invention pertains to a thermosetting resin composition which contains a thermosetting agent (B) and a compound (A) having a backbone represented by general formula (1) and having two or more functional groups that are at lea...
|
|
WO/2023/182522A1 |
The present invention provides an epoxy resin which has a skeleton represented by formula (1). In formula (1), each of R4 and R5 independently represents a hydrogen atom, an alkoxy group or -OG; * may be a binding site to be bonded with ...
|
|
WO/2023/182492A1 |
The present invention provides a curable composition which can form cured objects having both a low degree of thermal expansion and a low modulus. The present invention relates to a curable composition comprising (A) an epoxy compound ...
|
|
WO/2023/178472A1 |
The invention relates to a composition, which has excellent durability and adhesive strength after curing. The composition contains component (A) silane-crosslinking polymer, Component (B1) epoxy resin, Component (B2) epoxy resin curing ...
|
|
WO/2023/181953A1 |
A resin film is formed using a resin composition containing a carboxyl group-containing resin, a corrosion inhibitor having a solubility parameter (SP value) ranging from 17.0 (MPa)1/2 to 25.5 (MPa)1/2 inclusive, and a crosslinking agent.
|
|
WO/2023/182273A1 |
The purpose of the present invention is to provide: an alkali-soluble resin and an alkali-soluble resin composition, each of which is capable of forming a cured product that has excellent thermal coloring resistance and a high refractive...
|
|
WO/2023/180631A1 |
There is provided a method for producing an epoxy resin comprising mixing modified tall oil pitch with at least one epoxidized vegetable oil. Additionally, is provided an epoxy resin comprising modified tall oil pitch cross-linked with a...
|
|
WO/2023/180035A1 |
The invention relates to a cationically curable compound which is liquid at room temperature and comprises a) at least one cationically polymerisable component (A), the cationically polymerisable component (A) comprising 60 to 100 wt.%, ...
|
|
WO/2023/176845A1 |
One purpose of the present invention is to provide a sealing agent for display elements, the sealing agent having excellent flexing responsiveness, excellent adhesion to an alignment film, excellent adhesion in a high-temperature high-hu...
|
|
WO/2023/176680A1 |
A composition containing a cationic polymerizable component and an antioxidant, wherein the cationic polymerizable component contains at least one selected from alicyclic epoxy compounds, aliphatic epoxy compounds, aromatic epoxy compoun...
|
|
WO/2023/176703A1 |
The present invention provides a compound which is represented by formula (1). In the formula, R1 represents a hydrogen atom or a methyl group; each of R2 to R5 independently represents a hydrogen atom, an alkyl group having 1 to 10 carb...
|
|
WO/2023/174891A1 |
A curable epoxy resin adhesive for bonding together structural parts of a wind turbine blade, a marine vessel or a civil engineering structure, the adhesive comprising an epoxy resin component and a curing agent component, wherein the ep...
|
|
WO/2023/176644A1 |
The present invention relates to water absorbent resin particles containing a crosslinked polymer having at least one ethylenically unsaturated monomer selected from the group consisting of (meth)acrylic acids and salts thereof as a mono...
|
|
WO/2023/176610A1 |
The curable composition contains an infrared absorbing dye, a compound having an epoxy group, an epoxy curing agent having a phenol group, and a solvent. Also provided are a film, an optical filter, a solid-state imaging element, and an ...
|
|
WO/2023/176843A1 |
The purpose of the present invention is to provide a liquid crystal display element sealant which has excellent moisture permeation prevention and adhesiveness with respect to an alignment film, and with which a liquid crystal display el...
|
|
WO/2023/174747A1 |
The present invention relates to a method for preparing a curable composition based on ground composite material from the recycling of discarded composite elements such as old pipes or rotor blades of wind power plants. The ground compos...
|
|
WO/2023/176883A1 |
A cured resin product obtained by curing the epoxy resin composition containing an epoxy resin of the present invention for two hours at 180°C has a thermal diffusivity at 25°C, measured based on ASTM E1461-01 (2001), of from 0.17 mm2/...
|
|
WO/2023/176641A1 |
A composition containing tricyclodecanedimethanols, said tricyclodecanedimethanols including a chiral compound A of which one mirror isomer is indicated by formula (I), a chiral compound B of which one mirror isomer is indicated by formu...
|
|
WO/2023/176934A1 |
The present invention addresses the problem of providing: an epoxy resin composition having excellent viscosity stability and attaining high compression characteristics under wet heat conditions and high fracture toughness; and a fiber-r...
|
|
WO/2023/176820A1 |
Provided are: a resin composition for optical-semiconductor encapsulation which has a black color for heightening the contrast of a display and has adequate light-transmitting properties; and a shaped resin object for optical-semiconduct...
|
|
WO/2023/176935A1 |
[Problem] To provide an epoxy resin composition for resin transfer molding having low viscosity and volatility, a cured resin product of which will have excellent balance among elastic modulus under damp heat conditions, heat resistance ...
|
|
WO/2023/171027A1 |
One aspect of the present invention relates to a stretchable resin composition which comprises an epoxy resin and a hardener, wherein the epoxy resin has a weight-average molecular weight of 50,000-3,000,000 and an average-molecular-weig...
|
|
WO/2023/170891A1 |
Provided are: an insulating resin composition which contains a biomass material as a starting material and nevertheless can give cured objects having a better surface touch; a cured object obtained from the insulating resin composition; ...
|
|
WO/2023/171572A1 |
The purpose of the present invention is to provide an epoxy resin composition which contains a reactive diluent that is capable of decreasing the viscosity of an epoxy resin with a minimum deterioration in the normal performance of the e...
|
|
WO/2023/171028A1 |
Provided is a resin composition that is used as a capillary underfill (CUF) capable of further reducing filament cracking. Provided is a resin composition containing (A) an epoxy resin, (B) a curing agent, and (C) a filler. A cured pro...
|
|
WO/2023/169893A1 |
The invention relates to a curable adhesive substance comprising the following, in relation to the mass of the curable adhesive substance: a) one or more (meth)acrylate block copolymers X with an A-B-A structure in a combined mass fracti...
|
|
WO/2023/166212A1 |
The invention provides a coating composition comprising components A and B, wherein component A comprises: i) 15 to 70 wt% of one or more epoxy-based binder, relative to the total weight of component A; ii) 20 to 60 wt% water, relative t...
|
