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JP5751906B2 |
To provide a repeelable adhesive sheet excellent in appearance characteristics, and excellent in prevention property to rise of the adhesive force over time, the low fouling property, the scratch resistance and the antistatic properties ...
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JP5751905B2 |
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JP5743584B2 |
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JP5743211B2 |
To provide an adhesive composition that has initial adhesion, can bind metals together, the metal and an organic material together, and the organic materials together, and can keep its transparency after thermal curing.The adhesive compo...
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JP5738899B2 |
The invention relates to curable compositions comprising a) at least one organic polymer selected from polyethers and polyacrylic acid esters, wherein the organic polymer has at least one defined, cross-linkable end group having at least...
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JP5732047B2 |
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JP5733210B2 |
A curable composition having a low viscosity and good workability which can give a mechanically strong cured product is provided. A curable composition comprising a curable resin component containing a polymer (A) having a polyoxyalkylen...
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JP5733867B2 |
To provide a self-adhesive composition which can prevent electrification of a non-electrification-prevented adherend upon peeling, suppresses occurrence of blistering even with the lapse of time or via treatment under a high temperature,...
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JP2015101699A |
To provide a moisture-curable hot-melt adhesive having high initial adhesive strength and long open time.A moisture-curable hot-melt adhesive obtained using (A) an acrylic polymer having an alicyclic structure; (B) polyether polyol; (C) ...
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JP2015103341A |
To provide a laminate for a battery, having an adhesive force and gas barrier properties or water vapor barrier properties and including an adhesive layer mainly consisting of a resin excellent in gas permeability and transparency.A lami...
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JP2015101618A |
To provide a laminate for a display device, which has an adhesive layer mainly composed of a resin having adhesion and gas barrier properties or water vapor barrier properties and being in excellent in gas permeability and transparency.T...
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JP5726753B2 |
A novel macromer or mixture thereof is described herein, comprising isocyanatophenyl ether terminal moieties and at least two residues of a water-soluble polymer having a molecular weight ranging from 80 to 10,000 adjacent to the ether g...
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JP5728803B2 |
Disclosed is an anisotropic electroconductive adhesive that, even when a heating tool is contacted and pressed at a slow speed, can realize high electrical connection reliability. The anisotropic electroconductive adhesive comprises an...
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JP2015091924A |
To provide an adhesive layer for chemical liquid treatment capable of realizing both chemical liquid infiltration prevention properties, and a suppressed peeling static voltage (antistatic properties) when peeled off from an adherend hav...
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JP5716881B2 |
Provided is a method of manufacturing a liquid crystal panel employing a photocurable adhesive composition which causes no damage to adherends during bonding and which, when used in bonding rugged adherends, can bond the adherends withou...
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JP2015086249A |
To provide a microcapsule type thermosetting resin composition having excellent adhesion strength and storage stability which can be produced remarkably inexpensively since microcapsules containing a curing agent can be mass produced, an...
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JP5712993B2 |
An adhesive resin composition includes 60 to 95 parts by mass of amorphous thermoplastic polyester-based resin (A), 5 to 40 parts by mass of polyphenylene ether-based polymer (B) including a hydroxyl group and a repeating unit of 2,6-dim...
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JP5712665B2 |
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JP5710245B2 |
The invention relates to architectural elements possessing at least two components bonded together employing a silicone rubber composition possessing rapid development of strength and deep-section cure, which is useful for application as...
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JPWO2013084708A1 |
The present invention is a cationically curable resin composition for assembling a hard disk device, which contains a resin having a cationically polymerizable functional group (component A) and a cationic polymerization initiator (compo...
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JP2015067640A |
To provide a thermally conductive pressure-sensitive adhesive composition and a thermally conductive pressure-sensitive adhesive sheet-shaped molded product each having a high thermal conductivity and also a high tensile strength.There i...
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JP2015067663A |
To provide a two-liquid type adhesive which hardens quickly while keeping a good serviceable life and is excellent in film strength.A two-liquid type adhesive consists of a main agent comprising (A) a urethane prepolymer obtained by reac...
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JP5698899B2 |
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JP2015509995A |
The present invention provides a curable composition comprising a non-Sn organometallic catalyst that accelerates condensation curing of moisture curable silicone / non-silicone. In particular, the present invention provides Zn (II) and ...
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JP2015061919A |
To provide a structural adhesive with improved low temperature impact strength particularly useful for bonding metal especially in the automotive industry.An adhesive formulation comprises i) an adduct of an epoxy resin and an elastomer;...
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JP5691538B2 |
To provide a composition for provisional fixation, capable of forming provisional fixation materials having retention retaining substrates in a process where the high temperature load is applied, and having easily peelable property in a ...
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JP5688213B2 |
The present disclosure is generally directed to electrically conductive adhesives. More particularly, the disclosure is directed to electrically conductive adhesives comprising an organic polymer resin and an electrically conductive poly...
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JP5689541B2 |
The present invention relates to a film for a tire inner liner including a base film layer including a copolymer or a mixture of a polyamide-based resin and a polyether-based resin, and an adhesive layer including a resorcinol-formalin-l...
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JP5684820B2 |
The invention aims to allow a curable composition to have an extended working phase followed by a short time period in which said compound becomes fully cured. This is achieved by the provision of a curable composition comprising the fol...
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JP5686518B2 |
To provide an adhesive for camera module assembly capable of performing easy coating even with a dispenser using a narrow nozzle and having high adhesion, and to provide a camera module. There is provided a photocurable adhesive composit...
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JP2015507677A |
The present invention relates to an insulating adhesive composition for a metal printed circuit board, an adhesive-coated metal plate using the same, and a method for producing the coated metal plate, which is excellent in adhesive stren...
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JP2015507671A |
The present invention relates to a method of preparing a hydrophilic silicone gel adhesive by curing a silicone composition. The method comprises a polyoxyethylene-organopolysiloxane copolymer having an average of at least one functional...
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JP2015044995A |
To provide modified alkoxylation products which have alkoxysilyl groups and contain urethane groups, and their use.The present invention relates to alkoxylation products, their preparation, compositions comprising the alkoxylation produc...
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JP5682926B2 |
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JP2015042756A |
To provide dry-to-the-touch moisture-curable compositions and products made thereof.A dry-to-the-touch moisture-curable composition useful as a sealant and adhesive includes a reactive modified methylene diisocyanate polymer component, h...
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JPWO2013018707A1 |
An object of the present invention is to provide a composition capable of obtaining a biomass material with low energy by a simple process / equipment, a molded product obtained from the composition, and a method for producing the same. ...
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JP2015505874A |
To provide a base material composition of a foam tape having high bubble stability and excellent peel strength, and a foam tape using the same. A foam tape base material composition according to the present invention contains an acrylic ...
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JPWO2012173054A1 |
To provide an active energy ray-curable adhesive which has low viscosity and excellent curability, excellent adhesive strength to various plastic films, especially hydrophilic plastic films, and exhibits sufficient performance even in ap...
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JP2015504453A |
To provide a plasticizer for an adhesive composition, a coating composition and a sealing agent composition to be applied or attached to asphalt. In the present specification, an asphalt-containing substrate to which an adhesive composit...
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JP5667554B2 |
The invention provides a photo-curing adhesive composition which adheres a polarizer and a protective film to a polaroid, a polaroid which uses the adhesive composition to adhere the protective film to the polarizer, and method of manufa...
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JP5668597B2 |
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JP2015501344A |
The present invention relates to an adhesive suitable for adhering a polymer film such as a polyester film to another base material. In certain embodiments, for example, the adhesive is used to bond a polyester film to a layer containing...
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JP2015007234A |
To provide a temporarily fixing agent of a semiconductor wafer, the agent allowing the semiconductor wafer to be removed easily while reducing damage to the semiconductor wafer and being able to shorten the time required for pyrolysis, a...
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JP5651941B2 |
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JP5650069B2 |
A process for preparing a surfactant, useful for dispersing tackifier resins in aqueous media, comprises reacting an alpha,beta-unsaturated carboxylic acid or anhydride, or an ester thereof, with a terpene- or hydrocarbon-based resin to ...
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JP5641943B2 |
Provided is an adamantane compound which contains a specific adamantane backbone, a polymerizable group, and a ligand having a specific structure for linking the adamantane backbone and the polymerizable group, and has high solubility in...
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JP5640951B2 |
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JP5639442B2 |
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JP5630334B2 |
To provide an adhesive composition for a semiconductor that enables an adhesive layer which bonds semiconductor elements to each other or a semiconductor element to a support member for mounting the semiconductor element to be formed thi...
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JP5630639B2 |
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