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JP2021161431A |
To provide a curable composition with a small color difference before and after curing, which reduces development of gloss after curing and exhibits an excellent anti-fouling effect over a long period of time.A curable composition includ...
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JP6940508B2 |
A resin composition which comprises a thermally curable component, a thermoplastic resin, a filler, and a triazine compound, wherein the triazine compound is represented by general formula (1). In general formula (1), R1 is a hydrogen at...
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JP6940516B2 |
Provided is an adhesive composition which contains: a poly(vinyl acetal) or polyethersulfone; a phenoxy resin; and a novolac type epoxy resin. The glass transition temperature of the phenoxy resin is 90-140°C.
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JP2021524456A |
Compound of formula (I) (R1Is an organic group with H or 1 to 100 C atoms, R2, R3Is H or an organic group having 1 to 100 C atoms, Z is a single bond or a divalent organic group having 1 to 100 C atoms, and A is an organic group having 1...
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JP6930784B2 |
To provide an original board for a printed wiring board of which a printed wiring board in which transmission delay and transmission loss are comparatively small can be formed, as well as a printed wiring board in which transmission dela...
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JP6927798B2 |
To provide a curable perfluoropolyether adhesive composition that gives a cured product (adhesive) being excellent in heat resistance, weather resistance, water repellency, oil repellency or the like, and particularly excellent in chemic...
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JP6926473B2 |
To provide an adhesive sheet for dicing, which is capable of reducing the stickiness of a chip when peeling off edge portion of the chip and capable of being picked up with a small peeling force in a picking up process of a semiconductor...
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JP6922638B2 |
To provide an active energy ray-curable adhesive composition which has excellent adhesive force, is suitable for bonding various protective films for polarizing plates with a polarizer and has excellent durability such as curability, wat...
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JP6919776B1 |
To provide an adhesive film which has high adhesiveness between a resin base material such as polyimide and a metal base material, can obtain high solder heat resistance, and has low dielectric properties and excellent film handleability...
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JP6913891B1 |
To provide a tile construction method capable of enhancing the durability of an adhered tile against vibration and linear expansion of a construction surface and having excellent stain resistance of an adhesive layer. In the tile constru...
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JP6909342B1 |
To provide a resin composition having a sufficiently low dielectric constant and dielectric loss tangent, a low elastic modulus and a high elongation factor, and an adhesive sheet using the same. A hydrogenated block copolymer (A) compos...
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JP6912030B2 |
To provide a resin composition excellent in thermal conductivity, adhesiveness and film formability, particularly a resin composition excellent in thermal conductivity after curing.The resin composition includes (A) an aminophenol type e...
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JP6911024B2 |
A composition for a bond ply, and a circuit subassembly that comprises such bond ply, are disclosed. The circuit subassembly can have a UL-94 rating of V-0. The composition of the bond ply layer comprises 25 to 45 volume percent of liqui...
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JP6909967B2 |
A liquid thermally expandable curable resin composition for use such as bonding by filling a clearance has difficulty in achieving both drying property and film forming property and also has a problem with storage stability. The problems...
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JP2021105070A |
To provide a random copolymer compound having high heat resistance and adhesive property while having excellent film formability and low dielectric constant and dielectric tangent, and a terminal-modified polymer compound.A random copoly...
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JP6906448B2 |
Methods of bonding together substrates that do not require use of primers, mixing, fixturing, or autoclaving. These methods can include the steps of disposing an adhesive layer on a bonding surface of either substrate, the adhesive layer...
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JP6905160B1 |
A curable adhesive sheet for devices having an adhesive layer containing the following components (A) and (B). This curable adhesive sheet for devices has an adhesive layer that gives a cured product having excellent low dielectric prope...
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JP6902641B1 |
To provide a dicing die attach film which is less likely to cause a pickup defect even when a pickup collet is in a heat storage state in a pickup process and can suppress the generation of voids when thermocompression bonding is perform...
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JP6883558B2 |
To provide a two-liquid mixed curable resin composition which is rapidly cured after mixing two liquids, and excellent in internal curability and storage stability.There is provided a two-liquid mixed curable resin composition consisting...
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JP6879451B2 |
To provide a cyanate compound that expresses excellent thermal conductivity and a method for producing the same, and a resin composition, a cured product, a monolayer resin sheet, a laminate resin sheet, a prepreg, a metal foil-clad lami...
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JP2021076814A |
To provide a polarizing plate in which discoloration of the polarizing plate is suppressed even under severe environment.There is provided a polarizing plate in which a thermoplastic film is stuck to at least one surface of a polarizing ...
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JP6870258B2 |
Disclosed is an electrically conductive adhesive containing: (A) a polyether polymer having a backbone comprising a repeating unit of the formula: -R 1 -O- wherein R 1 is a hydrocarbon group having 1 to 10 carbon atoms, and an end group ...
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JP6868555B2 |
A film-like adhesive composition containing each of an epoxy resin, an epoxy resin curing agent, a phenoxy resin and an aluminum nitride filler, wherein the content of the aluminum nitride filler is 30-60% with respect to the total amoun...
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JP2021510744A |
The present invention comprises curing with at least one organic polymer containing a silane group and / or an isocyanate group, at least one compound containing an acetal group and having a molecular weight of at least 280 g / mol, and ...
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JP6866957B1 |
[Task] To provide a skin-adhesive adhesive having excellent skin adhesiveness and low keratin exfoliation even when applied for a long period of time and having excellent productivity, and a skin-adhesive tape using the same. It contains...
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JP6857839B2 |
To provide a portable information terminal capable of easily bonding a housing and a cover panel, and a manufacturing method thereof.A portable information terminal 100 includes: a housing 10 for housing a display panel 6; a cover panel ...
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JP6858315B1 |
An adhesive composition containing an epoxy resin (A), an epoxy resin curing agent (B), a polymer component (C), and an inorganic filler (D). The inorganic filler (D) satisfies the following conditions (1) and (2). The ratio of the inorg...
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JP6852030B2 |
To provide an electronic device packaging tape capable of reducing peel-off of an adhesive layer from an electronic device when a metal layer is bonded to the electronic device via the adhesive layer and the adhesive layer is cured.An el...
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JP6852332B2 |
The present invention addresses the problem of providing an adhesive film or the like with which it is possible to form an insulating layer that does not cause warping, cracking, or the like when manufacturing a wiring board having an em...
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JP6847597B2 |
To provide novel silsesquioxane, or provide silsesquioxane that can form a cured product having excellent crack resistance (or thermal shock resistance) and excellent adhesion to an adherent.The present invention provides random-type sil...
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JP6846540B2 |
Disclosed are a thermosetting resin composition, a prepreg made therefrom, a laminate clad with a metal foil, and a high-frequency circuit board, wherein the thermosetting resin composition contains thermosetting ingredients. The thermos...
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JP6837443B2 |
A curable composition comprising a tetrahydrofurfuryl (meth)acrylate copolymer; an epoxy resin component; a liquid polyether polyol; a hydroxy-functional film-forming polymer; and a cationic photoinitiator. An adhesive article comprising...
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JP2021031530A |
To provide a thermosetting resin composition which gives a cured product having a high glass transition temperature, a low dielectric loss tangent, and excellent adhesion to a metal foil, and to provide an adhesive, a film, a prepreg, a ...
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JP6834946B2 |
An adhesive composition which contains (a) a thermoplastic resin, (b) a radically polymerizable compound, (c) a radical polymerization initiator and (d) a complex containing boron, and wherein (d) the complex containing boron is a compou...
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JP6827952B2 |
Low viscosity mixtures of polysilylated polyethers are described. The mixtures include a) 50 to 95 weight percent of one or more first polysilylated polyethers which are free of urea groups, have an average of two or more terminal hydrol...
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JP6825289B2 |
To provide a novel polyimide-based resin composition which imparts an adhesive layer having good adhesiveness, heat resistance and low dielectric characteristics.There are provided a resin composition which contains polyimide (A1) obtain...
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JP2021008600A |
To provide a moisture curable resin composition that ensures compatibility between initial moisture curing properties with appropriately excellent workability and moisture curing properties after a storage stability test.A moisture curab...
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JP6817959B2 |
A tire comprises an inner surface and/or outer surface with an accommodating region, an adhesive layer arranged on the accommodating region and a protective film arranged on said adhesive layer. The adhesive layer is based on a block the...
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JP6816262B2 |
The present application relates to a curable composition. The curable composition of the present application exhibits excellent adhesion ability and liquid crystal orientation ability simultaneously before or after curing, so that it can...
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JP6818540B2 |
To provide a curable composition which is excellent in workability and depth curability, is improved in curing retardation after storage, and contains an organic polymer having a reactive silicon group.The curable composition contains, b...
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JP6808972B2 |
To provide a curable composition which provides a cured product having more excellent stain resistance than a conventional one, and can keep the effect over a long period of time.A curable composition contains (A) component: 44 pts.mass ...
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JP6807692B2 |
To provide a curable composition which is cured to obtain a cured product exhibiting rubber elasticity and having excellent mechanical strength.The curable composition of the present invention contains polymer fine particles (B) having a...
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JP6801638B2 |
The invention provides a thermosetting fluoropolyether type adhesive composition and an electrical component/electronic component using the thermosetting fluoropolyether type adhesive composition. Thethermosetting fluoropolyether type ad...
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JP6800188B2 |
This invention relates to a structural adhesive film suitable for bonding metal parts, and in particular for hem flange bonding of metal parts. More specifically, the present invention is directed to a structural adhesive film comprising...
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JP6785195B2 |
A resin-metal composite member for a tire, the member including: a metal member; an adhesive layer; and a covering resin layer in this order, wherein: the adhesive layer includes a continuous phase that contains a polyester-based thermop...
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JP6778902B2 |
The acrylic composition for sealing contains an acrylic compound, a polyphenylene ether resin including a radical-polymerizable substituent at a terminal, an inorganic filler, a thermal radical polymerization initiator, and a thermoplast...
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JP6776785B2 |
To provide an active energy ray-curable adhesive composition having excellent adhesion, suitable for bonding various protective films for polarizing plates to polarizers, and also has excellent durability such as thermal shock resistance...
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JP6776577B2 |
The invention provides a resin compound, which has good compatibility and good melt viscosity, and is capable of providing an insulation layer having lower dielectric loss angle tangency and good substrate sealing ability. The resin comp...
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JP6775005B2 |
Provided is an electronic device package tape that can inhibit the occurrence of warpage in a layered product of a semiconductor, bonding adhesive layer, and semiconductor chip when precuring the bonding adhesive layer and that can inhib...
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JP6771802B2 |
The present application relates to a curable composition, a cured product and uses of the curable composition and the cured product. By comprising the curable compound having a certain structure, the present application can provide a cur...
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