| Document |
Document Title |
|
JP6776577B2 |
The invention provides a resin compound, which has good compatibility and good melt viscosity, and is capable of providing an insulation layer having lower dielectric loss angle tangency and good substrate sealing ability. The resin comp...
|
|
JP6775005B2 |
Provided is an electronic device package tape that can inhibit the occurrence of warpage in a layered product of a semiconductor, bonding adhesive layer, and semiconductor chip when precuring the bonding adhesive layer and that can inhib...
|
|
JP6771802B2 |
The present application relates to a curable composition, a cured product and uses of the curable composition and the cured product. By comprising the curable compound having a certain structure, the present application can provide a cur...
|
|
JP6764134B2 |
There is provided a novel photosensitive adhesive composition. A photosensitive adhesive composition comprising the following components (A), (B), (C), and (D):Component (A): a polymer having a structural unit of the following formula (1...
|
|
JP6753382B2 |
To provide a heat-curable fluoropolyether-based adhesive composition which cures in a short time, and adheres to various base materials such as metal, ceramic, and plastic, and an electric and electronic component using the same.The heat...
|
|
JP2020111630A |
To provide a random copolymer compound and a terminal-modified polymer compound, which have high heat resistance and adhesion while having excellent film forming capability, and which have low dielectric constant and low dielectric loss ...
|
|
JP6722451B2 |
To provide: a phenoxy resin that is excellent in the low viscosity, the transparency, the adhesion and the storage stability and suitably used for a dry film type adhesive used in bonding a touch panel and a frame-printed cover panel tog...
|
|
JP6723161B2 |
The invention relates to a composition comprising at least one polymer that contains silane groups and at least one catalyst of formula (I), said catalyst having specific amidine groups or guanidine groups. The composition is low in emis...
|
|
JP6722485B2 |
To provide a phenoxy resin excellent in low viscosity, transparency, adhesiveness and storage stability and suitably usable in a dry film type adhesive used when a touch panel and a frame printed cover panel are laminated, and a composit...
|
|
JP6720340B2 |
The invention relates to crosslinkable materials comprising (A) 100 parts by weight of silane-crosslinking polymers, selected from polymers (A1) of the formula R2-O-Z1-O-CO-NH-(CH2)-SiRa (OR1)3-a (I) and polymers (A2) of the formula R4-O...
|
|
JP6712414B2 |
To provide a room temperature curable adhesive for adhering a floor finishing material to an underfloor material set on a floor basement, exhibiting sufficient adhesive strength without generating solvent odor like solvent-based adhesive...
|
|
JP6706995B2 |
To provide an insulating film for underfill which shows plasticity and fluidity in an early stage of a process for bonding a semiconductor chip to a substrate, and which still has superior storage stability over a long time even after ha...
|
|
JP6705623B2 |
To provide a cationically polymerizable composition excellent in coatability, curability, and adhesiveness.The cationically polymerizable composition of the present invention contains: a cationically polymerizable monomer mixture (1) con...
|
|
JP6695793B2 |
The present invention provides a curable composition comprising an organic polymer having a reactive silyl group that is applicable to a sealant and an adhesive by improving depth curability, curing retardation after storage, and tensile...
|
|
JP2020513427A |
The one-component RTV-1 moisture-curable tile adhesive, which has better properties than conventional cement-based and RTU tile adhesives, is one of the low viscosity alkoxysilyl functional polymers, silicone resins, aminoalkyl functiona...
|
|
JP6687201B2 |
To provide a polyamide fiber, suitable as a hot-melt bonding fiber for a shoes material use, etc.The polyamide fiber comprises a copolymer polyamide obtained by block copolymerization of a polyalkylene glycol as a soft segment with a pol...
|
|
JP6682227B2 |
To provide a curable composition low in viscosity and having good workability before curing and having good mechanical properties of a cured article thereof.There is provided a curable composition containing a (meth)acrylic acid ester-ba...
|
|
JP6672759B2 |
To provide a novel resin composition having good toughness, holding power, and impact resistance, and an adhesive using the same.The resin composition contains: a first polymer containing, as monomer units, reactive monomers including a ...
|
|
JP6671174B2 |
Provided are: an adhesive agent which can exert strong adhesiveness and can adhere and fix an object of interest even under a high-temperature environment during a period in which fixing is needed, and can be removed without damaging the...
|
|
JP6667124B2 |
To provide a curable composition which uses a compound having a fluorosilyl group as a curing catalyst for an organic polymer having a crosslinkable silicon group and silica as a thixotropy-imparting agent, hardly causes increase in visc...
|
|
JP6667125B2 |
To provide a curable composition to which thixotropic property can be imparted even in the case of a small amount of silica, which is a curable composition in which a compound having a fluorosilyl group is used as a curing catalyst of an...
|
|
JP6665442B2 |
To provide a joining member whose shape can be recovered by heating sufficiently.A joining member comprises a resin molding comprising a first polymer comprising a radical-polymerizable compound represented by formula (I) and a monofunct...
|
|
JP6663008B2 |
A room temperature curable sealant/adhesive composition is disclosed. The room temperature curable sealant/adhesive composition comprises: (A) one or more organopolysiloxanes; (B) a hydrophilic material; (C) a cross-linker; (D) a titanat...
|
|
JP2020506980A |
The present invention provides a resin composition for metal bonding, a molded product obtained by bonding with the metal, and a manufacturing method, and the combined product mainly contains component (I) (polyetherketone, polyetherethe...
|
|
JP6655814B2 |
The cationically photopolymerizable composition according to the present disclosure includes: (A) a polyfunctional epoxy compound having two or more epoxy groups per molecule; (B) a monofunctional epoxy compound having one epoxy group pe...
|
|
JP6645495B2 |
Provided is a method of producing a pressure-sensitive adhesive containing a cured product of a curable composition containing a crosslinkable silicon group-containing organic polymer and an adhesion-imparting resin as a pressure-sensiti...
|
|
JP6644866B2 |
As a pressure-sensitive adhesive polarizing plate, for example, a pressure-sensitive adhesive polarizing plate allowing a pressure-sensitive adhesive layer in the polarizing plate to have an excellent interfacial adhesion with another la...
|
|
JP2019536859A |
The present invention relates to:-a hot melt adhesive composition comprising a mixture of a silylated polymer, a tackifier resin and a catalyst at a specific content, particularly a catalyst having self-adhesiveness after cross-linking w...
|
|
JP6615150B2 |
Provided are: an adhesive film comprising an adhesive agent layer containing a thermosetting resin, a thermoplastic resin, and a heat conductive filler, wherein the heat conductive filler has a thermal conductivity of 12 W/m·K or more a...
|
|
JP6613649B2 |
To provide an adhesive composition that is not affected by moisture in the production of a laminated sheet, shows high adhesive force between various sheet-like members, in particular between layers including plastic film surface-treated...
|
|
JP6610690B2 |
|
|
JPWO2018101438A1 |
An electrode structure having an adhesive layer showing sufficient conductivity and excellent adhesiveness without the problem of drying due to volatilization of water or an organic solvent, a biological signal measuring device provided ...
|
|
JP6598499B2 |
|
|
JP6597025B2 |
An aqueous resin dispersion wherein a polymer (C) obtained by bonding a polyolefin (A) to a polyether resin (B) is dispersed in water; and the polyether resin (B) contains a polyether resin (B1) having an HLB of less than 8 and a polyeth...
|
|
JP2019183061A |
To provide an adhesive for optical member that is excellent in curability even for thin film, and, by making a cured product that can be securely bonded, that can form an adhesion material, and to provide, by curing the adhesive with act...
|
|
JP2019183048A |
To provide a heat, and active energy ray curable composition containing no toxic metal, having a cation polymerizability or crosslinking reactive performance similar to or more than tetrakis (pentafluorophenyl) borate, and using a resin ...
|
|
JP6589638B2 |
The purpose of the present invention is to provide an adhesive composition which allows an alignment mark to be recognized, ensures sufficient solder wettability of a joining section, and is excellent in suppression of void generation. T...
|
|
JP6590068B2 |
The present disclosure relates to a thermosetting adhesive film. This adhesive film comprises (a) a polymer, (b) an epoxy resin that is in liquid form at 50°C, (c) a curing agent and/or a curing accelerator, and (d) a filler having a th...
|
|
JP6585373B2 |
|
|
JP6580595B2 |
Tyre comprising an inner liner facing an internal cavity of the tyre, an adhesive layer positioned on the inner liner and a strip of noise-damping foam attached to the inner liner by the adhesive layer, characterized in that the adhesive...
|
|
JP6579421B2 |
|
|
JP6578142B2 |
|
|
JP2019143116A |
To provide an adhesive composition containing a curable composition excellent in workability and also excellent in mechanical properties and weather resistance of a cured product.The adhesive composition contains the curable composition ...
|
|
JP6558055B2 |
Provided are: a resin composition which forms an insulating layer having excellent adhesion to a conductor layer even if having low illumination and having a high glass transition point: and an adhesive film, a prepreg, a printed wiring ...
|
|
JP6556050B2 |
The object of the present invention is to provide a moisture-curable hot melt adhesive having high initial adhesive strength, long open time, excellent coating property and reduced stringing property. The present invention relates to a m...
|
|
JP6552819B2 |
The present invention relates to a self-adhesive article comprising a support layer of foam or similar type and an adhesive layer obtained by cross-linking an adhesive composition. The present invention also relates to a mixture of at le...
|
|
JP2019123768A |
To provide a fluororesin film with an adhesive layer, where in a use of being in contact with organic liquid such as fuel oil and lubricant, cleaning liquid and the like, the durability of an adhesive layer is improved, so that the adhes...
|
|
JP2019122890A |
To provide a ventilation filter which prevents deterioration of an adhesive layer and maintains initial adhesion by improving durability of the adhesive layer in use in which the filter is in contact with an organic liquid, and a cleanin...
|
|
JP6550148B2 |
Provided is a transparent curable composition which uses a polyoxyalkylene-based organic polymer having a reactive silicon group and a weathering stabilizer having a specific structure, a cured product of the curable composition having n...
|
|
JP6540250B2 |
|
