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JP5854504B2 |
The invention concerns a process for preparing a ribbon of reinforcement strands or filaments associated on each of its faces with a polymeric binder, said ribbon having a given width substantially constant over its entire length, in whi...
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JP5850851B2 |
An object of the present invention is to provide a curable composition that provides high hardness and can be used in adhesives and coating agents. This object can be achieved by a curable composition containing: 100 parts by weight of a...
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JP2016014142A |
To provide adhesives with high tensile shear strength suitable for wood bonding.A crosslinkable material uses, as an adhesive, a crosslinkable material comprising 100 pts. wt. of polyurethane that has polyoxyalkylene or a polyoxyalkylene...
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JP2016011427A |
To provide an adhesive film that is applicable for a semiconductor device manufactured by laminating in multi-stages and has high reliability, to provide a method for producing the adhesive film and to provide a tape for wafer processing...
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JP5846290B2 |
This halogen-free flame-retardant adhesive composition contains (A) solvent-soluble polyamide resin that is solid at 25°C, (B) phenoxy resin, (C) halogen atom-free epoxy resin, and (D) phosphorus-based flame retardant having a structure...
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JP5841536B2 |
The present invention provides a transparent adhesive tape, which is capable of suppressing the occurrence of foaming, lifting and separation at the bonding interface even in cases where an object to be bonded that generates an outgas in...
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JP5842664B2 |
Provided are a thermosetting adhesive composition excellent in storage stability, reliability, and low-temperature adhesion properties; and a curl-resistant heat-resistant film and a wiring film obtained using the composition. The thermo...
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JP5844264B2 |
The present invention aims to provide a moisture-curable reactive hot-melt adhesive composition which contains no vinyl chloride resin, which is excellent in adhesion to oily steel sheets and electroplated steel sheets, which has high st...
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JP5841055B2 |
An object of the present invention is to provide a curable composition that can be used as sealing materials, adhesives, and the like, has excellent curing properties, and gives a cured product excellent in elongation properties. The obj...
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JP5838674B2 |
A film-like anisotropic conductive adhesive, which has connection reliability and repairability, and does not lose adhesive strength even if the heating temperature is reduced during bonding, is provided. Said adhesive contains (A) a phe...
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JP2015232060A |
To provide an adhesive composition for a polarizing plate, which is an adhesive excellent in adhesive force and suitable for bonding various protective films for a polarizing plate with a polarizer, particularly, for bonding a protective...
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JP5833809B2 |
To provide an anisotropic conductive film, which contains: an electric conductive layer containing Ni particles, metal-coated resin particles, a binder, a polymerizable monomer, and a curing agent; and an insulating layer containing a bi...
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JP2015225913A |
To provide: a reliable die bonding material resin composition superior in workability and adhesiveness; and a semiconductor device arranged by use thereof.A die bonding material resin composition comprises, as essential components: (A) a...
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JP5830883B2 |
To provide an adhesive agent composition for semiconductors that enables an adhesive agent layer for adhering between semiconductor elements or between a semiconductor element and a supporting member for semiconductor elements to be form...
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JP2015218287A |
To provide an accurate and simple method for manufacturing a semiconductor chip without use of an underfill, in manufacturing a semiconductor chip by grinding the rear face of a semiconductor wafer having a bump electrode for use in moun...
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JP5827483B2 |
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JP5824030B2 |
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JP5824747B2 |
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JP5819241B2 |
The present invention provides an adhesive tape 10 for electrically connecting a plurality of solar battery cells, which adhesive tape has a metal foil 1 and an adhesive layer 2 composed of an adhesive provided on at least one surface of...
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JP5818169B2 |
A composition for vulcanizing adhesion, comprises a rubber (a), at least one compound (b) selected from the group consisting of salts of 1,8-diazabicyclo(5.4.0) undecene-7, salts of 1,5-diazabicyclo(4.3.0)-nonene-5, 1,8-diazabicyclo(5.4....
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JP5813292B2 |
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JP5813890B2 |
Formulation for an adhesive composition, comprises a first component comprising at least one amino resin, which is a condensation product of an aldehyde with a compound comprising urea, melamine, benzoguanamine, glycoluril and/or acetogu...
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JP5811142B2 |
Provided is an adhesive layer-equipped transparent surface material that can easily be bonded to another surface material (such as a display panel) and that, when bonded to another surface material, is less likely to have voids left at t...
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JP5811143B2 |
Provided is an adhesive layer-equipped transparent surface material that can easily be bonded to another surface material (a display panel, etc.) and that, when bonded to another surface material, is less likely to have voids left at the...
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JP5811985B2 |
An adhesive composition is provided comprising (A) a linear polyfluoro compound having at least two alkenyl groups and a perfluoropolyether structure in its main chain, (B) a fluorinated organohydrogensiloxane having at least two SiH gro...
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JP5807299B2 |
An adhesive material and articles incorporating the same is disclosed. The adhesive material includes at least three of epoxy resin; impact modifier; flexibilizer, blowing agent; curing agent; and filler. The adhesive material is prefera...
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JP2015196729A |
To provide a curable resin composition whose cured product has extremely high heat resistance, and a method of producing the curable resin composition.The curable resin composition contains 0.05-100 pts.mass of a polyphenylene ether comp...
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JP2015193687A |
To provide a resin composition excellent in thermal conductivity, adhesion, and film formability, particularly a resin composition excellent in thermal conductivity after curing.The resin composition contains (A) an aminophenol type epox...
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JP5803870B2 |
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JP5805113B2 |
To provide a radiation non-curing type adhesive tape that is free of a kerf shift, and allows a chip to be easily peeled off from the tape when picked up and does not peel off a ring frame when expanded.The present invention relates to a...
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JP2015187744A |
To provide an adhesive for a polarizing plate having superior adhesive force, water resistance and heat resistance, and the polarizing plate including the adhesive.An adhesive composition for a polarizing plate includes: 100 parts by wei...
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JP5801902B2 |
An object of the invention of the present application is to provide a photocatalyst-carrying structure provided with a carrier and a photocatalyst layer carried on the carrier with an adhesive layer there between, wherein the adhesive la...
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JP5792924B2 |
Provided is an adhesive resin composition containing an epoxy resin and/or a phenoxy resin; an epoxy-containing copolymer obtained by copolymerizing a monomer having an epoxy group and an ethylenically unsaturated monomer that is copolym...
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JP5794725B2 |
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JP2015529696A |
The present invention is the use of thermoplastic starch in the production of adhesive ultrathin waterproof breathable films, wherein the thermoplastic starch is hydrophilic TPE and is at least 10% by weight based on the weight of the TP...
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JP5789087B2 |
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JP5790946B2 |
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JP5791945B2 |
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JP5790945B2 |
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JP5784403B2 |
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JP5774375B2 |
A pressure-sensitive adhesive film, including a substrate and a pressure-sensitive adhesive layer provided on at least one side of the substrate, wherein the pressure-sensitive adhesive layer contains a (meth)acryl-based polymer, an alka...
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JP5775475B2 |
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JP5776621B2 |
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JP5771646B2 |
To provide a glue adhesive tape which can adhere to materials instantly, develops glue force with time by curing with moisture in an ambient air to obtain peel strength of a glue adhesive range amounting to 1.5 to 4 or more times the adh...
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JP2015151401A |
To provide an adhesive sheet excellent in slidability and strength while excellent in adhesiveness.An adhesive sheet adhering to an adherend has a substrate layer, and a surface layer which is laminated on the substrate layer and is an a...
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JP5761639B2 |
To provide an adhesive resin composition in which its cured product has excellent thermal conductivity, and deterioration of adhesiveness and insulation is hardly occurred.The adhesive resin composition contains: an epoxy resin in which ...
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JP5758157B2 |
Provided are: a pressure-sensitive adhesive composition for optical members having excellent durability, adhesiveness (adhesion), and removability; a pressure-sensitive adhesive layer for optical members that uses the pressure-sensitive ...
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JP2015137287A |
To provide a protective film for a semiconductor wafer which has few voids present between a semiconductor wafer, an adhesive layer and a reinforcing film layer and is well-balanced in a flexural strength of a semiconductor wafer.There i...
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JP2015137326A |
To provide a radiation-curable composition allowing the manufacture of a polarizing plate in which a polarizing film and a protective film are firmly bonded together.The radiation-curable composition of the present invention contains (A)...
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JP5757292B2 |
Provided is an adhesive layer-equipped transparent surface material that can easily be bonded to another surface material (a display panel, etc.) and that, when bonded to another surface material, is less likely to have voids left at the...
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