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JP5991476B2 |
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JP5991056B2 |
To improve storage stability of a liquid curable composition while giving it thixotropy, despite of its viscosity remaining low.The curable composition includes an organic polymer (A) having a crosslinkable silicon group and whose main c...
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JP2016527344A |
The present invention provides the hardenability constituent containing the non-tin metal catalyst which accelerates condensation hardening of humidity hardenability silicone / non-silicone. In detail, the present invention provides the ...
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JP5985145B2 |
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JP5986423B2 |
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JP5980223B2 |
[Problem] The present invention pertains to an ultraviolet ray cured resin composition characterized by containing a compound (A) having a structure indicated by general formula (1) (in the formula, n is an integer from 0 to 40, m is an ...
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JP5973476B2 |
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JP5975088B2 |
Disclosed is an anisotropic electroconductive adhesive that, even when a heating tool is contacted and pressed at a slow speed, can realize high electrical connection reliability. The anisotropic electroconductive adhesive comprises an...
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JP5976361B2 |
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JPWO2014046124A1 |
To provide a method for adhering hydrogels to each other by interposing a polyalkylene glycol between the gel surface to which the hydrogel is to be adhered and the surface of the gel. A method of adhering hydrogels of the same type or d...
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JP5969357B2 |
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JP5969375B2 |
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JP5970462B2 |
Provided is a composition that is highly workable, fast-curing, highly thermally conductive, and low-outgassing. A thermally conductive composition containing: (A) an insulating thermally conductive filler; (B) a polyalkylene glycol havi...
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JP5970950B2 |
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JP2016523988A |
The present invention provides specific alkoxylation products, methods for preparing the same, compositions containing these alkoxylation products, and uses thereof.
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JP5966069B2 |
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JP2016138237A |
To provide a polyol composition for a pressure-sensitive adhesive, capable of improving wettability of a pressure-sensitive adhesive layer.The polyol composition contains a polyol (A) and is reacted with a polyisocyanate compound (B) to ...
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JP5964086B2 |
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JP5964131B2 |
To provide a photosensitive composition giving a cured film developing high adhesiveness, high transparency, excellent mold releasability and antistaticity, without impairing high heat resistance of the coating film.A photosensitive comp...
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JP5953319B2 |
The present invention relates to: an ultraviolet-curable adhesive to be used for laminating a first optical base material and a second optical base material having a light-shielding portion on a surface thereof to each other, the ultravi...
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JP5951323B2 |
To provide a pressure-sensitive adhesive agent composition for an optical film, capable of forming a pressure-sensitive adhesive agent layer capable of simultaneously satisfying the reworkability capable of easily peeling an optical film...
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JP5950348B2 |
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JP2016121306A |
To provide an adhesive composition and an adhesive sheet, capable of suppressing deterioration of low-speed and high-speed peeling properties when peeling the adhesive sheet from an adherend, after adhering the adhesive sheet to the adhe...
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JP5946417B2 |
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JP2016118779A |
To provide a photocurable adhesive that exhibits coatable low viscosity in room temperature when pasting a protective film on a polarizer and has little effect on properties of the polarizing plate.A photocurable adhesive provided herein...
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JP2016519171A |
It is the directions for a hydronalium colloid constituent, a wound bandage, this constituent, and this wound bandage, and a starting formation method of a hydronalium colloid constituent, and is a hydronalium colloid constituent here, H...
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JP2016113518A |
To provide an active energy ray-curable resin composition having a low viscosity and excellent operability before cured, having high curability even in the presence of oxygen, and giving a cured product that is free from bleed-out of a n...
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JP2016108403A |
To provide an active energy ray-curable pressure-sensitive adhesive composition which has stickiness in adhesion to an adherend, can firmly bond when irradiated with an active energy ray, is excellent in heat resistance and is scarcely c...
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JP5931191B2 |
The present invention relates to phosphoric acid derivatives, which are present as urea urethanes and contain a radical with an affinity for the binder in addition to at least one phosphoric acid ester group. Said phosphoric acid derivat...
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JP5924477B2 |
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JP5924102B2 |
To provide a pressure-sensitive adhesivity imparting agent capable of imparting adhesivity such as excellent adhesive power and constant-load retainability to an aqueous pressure-sensitive adhesive agent, and capable of not causing a dec...
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JP5922985B2 |
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JP2016074899A |
To provide an adhesive composition for surface protective film capable of forming an adhesive layer excellent in antistatic property and transparency, low in stain property and corrosive nature to an adherend and exhibiting good high spe...
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JP5915541B2 |
Provided is an electroconductive adhesive which exhibits excellent electroconductivity and adhesiveness and which can be inhibited from settling or bleeding and exhibits excellent electroconductivity stability. This electroconductive adh...
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JP5912833B2 |
A pressure-sensitive adhesive composition for an optical film of the invention includes a (meth)acryl-based polymer(A), a polyether compound (B) having a polyether skeleton and a reactive silyl group and an ionic compound (C). The pressu...
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JP5901715B1 |
To provide a film-like adhesive capable of reducing the generation of voids even when curing is performed at a high temperature for a short time in multi-stage lamination of semiconductor chips, a semiconductor package using the film-lik...
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JP5901349B2 |
To provide a reliable adhesive film applicable to a multiply-stacked semiconductor device, a method for producing the same, and a tape for processing a wafer using the same.An adhesive film includes at least one kind of thermoplastic res...
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JP5895585B2 |
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JP5892192B2 |
A thermopolymerization initiator system which comprises (A) a iodonium salt represented by general formula (I) and (B) a radical polymerization initiator. In general formula (I), R1 and R2 are each independently substituted or unsubstitu...
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JP5891644B2 |
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JP5890737B2 |
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JP2016029134A |
To provide a connection material which has low-temperature connectivity at 200°C or lower and short-lasting connectivity in manufacture of a solar cell module and from which a solar cell module excellent in long-term reliability is manu...
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JP5875584B2 |
The present invention pertains to an additive combination comprising at least two sterically hindered amines, at least one further stabilizer, a dispersing agent and a plasticizer. The present invention also pertains to a composition com...
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JP5877133B2 |
Provided is a conductive adhesive for a solar cell, which is for connecting a tab wire with an electrode of a solar cell unit and comprises at least a fluorene-type phenoxy resin, a fluorene-type epoxy resin, a curing agent and conductiv...
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JP5877087B2 |
To provide an adhesive film and a tape for wafer processing, capable of eliminating residual void by normal-pressure heating without using expensive facilities, such as a pressurizing oven, and of obtaining a package in which thinned chi...
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JP5871428B2 |
The invention provides a high thermal conductivity membrane adhesive, an adhesive composition and a semiconductor package using the adhesive and a manufacturing method thereof. The high thermal conductivity membrane adhesive composition ...
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JP2016028288A |
To provide an adhesive polarizing plate which has an antistatic function, which includes an adhesive layer with sufficient durability, and which shows small deterioration in optical characteristics.An adhesive polarizing plate includes a...
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JP5867508B2 |
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JP5855350B2 |
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JP5855947B2 |
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