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Matches 51 - 100 out of 1,523

Document Document Title
WO/2019/210006A1
The present disclosure relates to monomers, oligomers and polymers useful as additives for adhesive and/or sealant compositions, and particularly to one drop fill ("ODF") sealant compositions for liquid crystal display applications. The ...  
WO/2019/190187A1
The present application relates to an optical device. The present application provides an optical device having a variable transmittance, and the optical device can be used for various uses such as sunglasses, eyewear for augmented reali...  
WO/2019/066225A1
The present invention relates to a conductive adhesive film having excellent heat resistance and moisture resistance, and has an adhesive layer, which is made of a conductive adhesive composition comprising 100 parts by weight of a polya...  
WO/2019/054426A1
Provided is a laminated body that contains at least a metal plate, an adhesive layer, and a resin layer and in which these layers are laminated in this order, the laminated body being characterized in that: the resin constituting the res...  
WO/2019/054392A1
Provided is an epoxy resin composition having excellent adhesiveness to copper and aluminum and, furthermore, having excellent adhesiveness in a low temperature environment. The epoxy resin composition comprises (A) an epoxy resin, and (...  
WO/2019/036378A1
In various embodiments a general medical tissue adhesive with high adhesive strength that can be applied inside the body in wet environments either as patch or as injectable formulation is provided. The material can also be used to coat ...  
WO/2019/028307A1
A sleeve is provided for covering a pipe joint formed between two pipes that are coupled to one another to form a tube. The sleeve comprises a heat-shrinkable material that is configured to conform to the first and second pipes when heat...  
WO/2019/020585A1
The present invention relates to a specific polyamide polymer which is obtainable by two specific processes according to the invention. The invention further relates to the use of this polyamide polymer as a functional additive and to de...  
WO/2019/013230A1
The purpose of the present invention is to provide a conductive adhesive composition that, even when repeatedly subjected to temperature changes, is unlikely to result in peeling off of an adherend material. The present invention pertain...  
WO/2018/180158A1
[Problem] To provide a coating film modifier for creping which, when used together with an adhesive agent for creping, enables the uniform formation of fine wrinkles in wet paper. [Solution] The present invention is a coating film modifi...  
WO/2018/090182A1
Disclosed is a degradable adhesive composition. The composition consists of the following components in parts by weight: 30 - 80 parts of a degradable polymer, 3 - 9 parts of a tackifier, 10 - 20 parts of an accelerator, 6 - 15 parts of ...  
WO/2018/079356A1
Provided are: a dielectric-heating bonding film that can achieve secure bonding even when a dielectric heating treatment is short; and a bonding method that uses the dielectric-heating bonding film. A dielectric-heating bonding film that...  
WO/2018/052104A1
A laminated article in which an adhesive layer is provided to at least one surface of a resin film, wherein the laminated article is characterized in that the resin that constitutes the resin film is a semi-aromatic polyamide and/or poly...  
WO/2018/041930A1
The invention relates to adhesive compositions based on γ-lactone compounds and polyether amine compounds, to methods for the production thereof and to the use of the thus produced compositions.  
WO/2018/034893A1
An adhesive film can include a barrier layer and an adhesive layer. In an embodiment, the barrier layer can have a melting temperature of at least 230°C and the adhesive layer having a melting temperature of no greater than 200°C. In a...  
WO/2018/008592A1
[Problem] To provide an adhesive agent composition which exhibits not only adhesiveness to a polyimide film or a copper foil, but also high adhesiveness to a gold-plated copper foil, and superior heat resistance, such as soldering heat r...  
WO/2017/220896A1
The invention relates to a tyre provided with a member attached on/in said tyre, said member comprising an adhesive strip, said tyre including an inner and/or outer surface with a receiving area, an adhesive layer arranged on said receiv...  
WO/2017/222123A1
The present invention relates to a loop nonwoven fabric laminate sheet for a hook fastening member, having a nonwoven fabric loop layer (10) made of a thermoplastic nonwoven fabric sheet, and a film layer (20), which are coupled to each ...  
WO/2017/149498A1
A humidity nonsensitive material based on reduced-graphene oxide (r-GO) and methods of making the same are provided, in an embodiment, the materia! has a resistance/humidity variation of about -15% to 15% based on different sintering tim...  
WO/2017/136188A1
The present disclosure generally relates to adhesive compositions and articles including at least one of polydiorganosiloxane polyoxamide copolymer and/or silicone polyurea block copolymer and a silicate tackifying resin. Some embodiment...  
WO/2017/107859A1
The present invention relates to a novel hot-melt adhesive and a preparation method therefor, and particularly to a hot-melt adhesive for bonding or compounding metal materials, such as aluminium and stainless steel, with PVC plastics, a...  
WO/2017/080494A1
Disclosed are a high-performance polyamide hot melt adhesive for surface decoration and a preparation method therefor. The preparation method is a simple preparation method mainly comprising the steps: selecting specific raw materials co...  
WO/2017/033956A1
The purpose of the present invention is to provide: a resin composition which exhibits good adhesion to a copper surface, a polyimide surface and a gold-plated surface, while having excellent adhesiveness after heat resistance test and a...  
WO/2017/030083A1
The purpose of the present invention is to provide a resin composition which is composed of an epoxy resin having a specific structure and a rubber-modified polyamide resin having a phenolic hydroxyl group and exhibiting excellent adhesi...  
WO/2016/210066A1
Creping adhesives can include one or more crosslinked resins having the chemical formula (O), (P), or (Q), where RX can be a crosslinking moiety, each RY can independently be a substituted or unsubstituted organic diyl moiety, and each A...  
WO/2016/096305A1
The present invention relates to a thermoplastic composition which comprises at least one polyamide, which preferably has a melting point of less than 185°C, and at least one liquid polysiloxane compound which preferably has a viscosity...  
WO/2016/073566A1
A system (10) for dispensing hot melt adhesives, comprising an adhesive dispenser (78) including a fluid passage (100) leading to an outlet (102). The system further comprises a supply conduit (72) fluidly connected to the fluid passage ...  
WO/2016/046478A1
The invention relates to a composition for thermoplastic adhesive, said composition comprising an aqueous dispersion of at least one branched copolyamide with unsaturated ends, in the form of particles such that the volume mean diameter ...  
WO/2016/045983A1
This invention relates to polyetheramines based on 1,3-dialcohols, in particular to an etheramine mixture comprising at least 90% by weight, based on the total weight of the etheramine mixture, of an amine of Formula (I) and/or (II), whe...  
WO/2016/001512A1
A semi-crystalline polyamide comprising at least one monomer resulting from the condensation of a diacid and of a diamine of formula AP.Y, said semi-crystalline polyamide having the following general formula (I): AP.Y/(A)m/(Pip.Y')n/(B.Y...  
WO/2015/184070A1
Heat seal coatings including an aqueous dispersion having a mixture of a polyamide and a copolymer of ethylene and acrylic acid are provided for use on a variety of substrates. In various embodiments, the aqueous dispersion is substantia...  
WO/2015/184106A1
Lamination adhesives including an aqueous dispersion having a mixture of a polyamide and an ethylene acrylic acid copolymer are provided for use on a variety of substrates. In various embodiments, the aqueous dispersion is substantially ...  
WO/2015/184046A1
Primer coatings including an aqueous dispersion having a mixture of a polyamide and a copolymer of ethylene and acrylic acid are provided for use on a variety of substrates. In various embodiments, the aqueous dispersion is substantially...  
WO/2015/174550A1
Provided is a transfer sheet comprising a support layer, a first layer, and a second layer. The second layer is a layer that is thermocompression bonded to an object to be transferred and is at least one type selected from the group cons...  
WO/2015/152164A1
This thermosetting adhesive composition contains (A) a (meth)acrylic polymer having a glass transition temperature of 5°C or more, (B) a liquid epoxy resin, (C) a solid resin that is composed of one or more resins selected from among (C...  
WO/2015/140441A1
Composition comprising, by weight, the total being equal to 100%: from 98% to 100% of at least one copolyamide comprising amide units and polyether units, having a melting point (Mp) from approximately 90 to approximately 150°C, in part...  
WO/2015/119229A1
Provided is an adhesive resin composition having good acclimation to fiber-reinforced thermoplastic and that can be used as an adhesive capable of demonstrating sufficient adhesive strength to another adherend. Also provided is an adhesi...  
WO/2015/104992A1
An electric wire with connector (1) having a coated electric wire (2), a terminal fitting (3), a connector housing (4), and an adhesive (5). The coated electric wire (2) has a conductor (21) and a coating material (22) comprising a cross...  
WO/2015/087885A1
Provided is a material which obviates the need for etching after a hot pressing step and with which it is possible to obtain an insulation layer having a suitable surface roughness for a semi-additive process and to produce a single-laye...  
WO/2015/042696A1
A pipe joining material for connecting pipes and fittings and a method of making a pipe joining material are provided. In one embodiment, the pipe joining material comprises a thermoplastic material such as polyvinyl chloride (PVC) and/o...  
WO/2015/046984A1
The present invention relates to a film used for overlapping metal plates and attaching the metal plates to each other and, more particularly, to a film which is inserted between metal plates and is then heated and pressed, thereby lamin...  
WO/2014/195618A1
The invention relates to a method for producing a polyamide-ester, comprising at least the following steps: preparing a mixture of gelatin, at least one organic acid, glycerol and at least one mineral acid; subjecting the mixture to a th...  
WO/2014/157151A1
A resin according to the present invention is produced by reacting a reaction product, which is a product produced by carrying out a Michael addition reaction between a component (A) as mentioned below and a component (B) as mentioned be...  
WO/2014/118213A1
The invention relates to an adhesion promoter composition containing at least one polymer A selected from at least one epoxy resin-phenolic resin pre-condensate, a mixture of at least one epoxy resin-phenolic resin pre-condensate and epo...  
WO/2014/118210A1
The invention relates to hybrid components comprising at least one fibre-composite as material B and at least one material A. Material A is selected from plastics, metals , ceramic pastes, wood, glass, composites, textile fibres and prod...  
WO/2014/118211A1
The invention relates to a method for producing a hybrid component comprising metal and plastic. The method comprises the steps: a) pre-treating the metal surface by the application of at least one conversion coating; b) applying at leas...  
WO/2014/114766A1
The invention relates to an adhesive composition comprising predominantly one or two polyamide(s) consisting of units chosen from: - at least one unit denoted A having an average number of carbon atoms per nitrogen atom, denoted CA, rang...  
WO/2014/058058A1
The present invention provides an adhesive composition containing an epoxy resin and a polyamide resin.  
WO/2014/058056A1
This adhesive composition contains: a condensed polymer; and a reactive compound that forms a graft or cross-links by reacting with a functional group of the condensed polymer and/or a polymerizable compound that is polymerized and gener...  
WO/2014/054409A1
Provided is a thermally restorable article, which has good embeddability during heat-shrinking and is capable of improving adhesion to the substrate being processed, and which is capable of reducing variations in the thickness of the adh...  

Matches 51 - 100 out of 1,523