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JP2021088649A |
To provide a thermosetting resin composition having heat resistance, adhesiveness and low dielectric properties after curing.The thermosetting resin composition is provided which contains the following components (A)-(D): (A) a polymalei...
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JP6879451B2 |
To provide a cyanate compound that expresses excellent thermal conductivity and a method for producing the same, and a resin composition, a cured product, a monolayer resin sheet, a laminate resin sheet, a prepreg, a metal foil-clad lami...
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JP6881664B1 |
To provide a polyimide resin composition which provides a polyimide resin layer in which an organic solvent easily volatilizes when dried under heating, and has a low dielectric constant, a low dielectric loss tangent, and excellent sold...
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JP6858111B2 |
To provide a method for producing a solvent-soluble polyimide resin capable of forming an adhesive layer which prevents occurrence of a volatile component formed of a cyclic siloxane compound, and prevents lowering of an adhesive force b...
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JP6850432B2 |
To provide a cyanate compound having excellent heat resistance and moisture resistance, particularly thermal decomposition resistance, and provide a resin composition, a cured product, a prepreg for structural material, a sealing materia...
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JP6848916B2 |
A purpose of the present invention is to provide a polyimide resin composition which provides a cured material having excellent applicability, adhesiveness with various metal frames, high moisture proofness, and exhibiting low elasticity...
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JP6847956B2 |
Polymeric materials are disclosed herein that include a reaction product of components comprising: a) a first amine component having at least two and at most three primary amino groups, secondary amino groups, or a mixture thereof, with ...
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JP6844928B2 |
To provide an adhesive for film laminated metal can excellent in printability and adhesiveness of a processing part, and excellent in blocking resistance and storage stability.There is provided an adhesive for film laminated metal can co...
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JP6839092B2 |
The invention relates to the use of an epoxy resin composition, containing at least one reaction product from the reaction of at least one amine of formula (I) with at least one carbonyl compound of formula (II) and hydrogen, as a cold c...
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JP2021034429A |
To provide a flexible print wiring board which is hard to cause an adhesive failure even under a high-temperature, high-humidity environment.A flexible print wiring board 1 comprises: a base film 2 having an insulating property; a conduc...
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JP6834946B2 |
An adhesive composition which contains (a) a thermoplastic resin, (b) a radically polymerizable compound, (c) a radical polymerization initiator and (d) a complex containing boron, and wherein (d) the complex containing boron is a compou...
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JP6835497B2 |
To provide a colored, thermosetting resin composition that has high insulating performance even when colored with a pigment or a dye, and excels at heat resistance, electric characteristics (low dielectric constants and low dielectric lo...
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JP6834941B2 |
A resin composition contains at least (a) a polyimide resin having a specific structure and (b) a crosslinker including a fluorene group. The resin composition is capable of bonding an electronic circuit formation substrate or a semicond...
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JP6831007B2 |
The present invention relates to a curable composition and a use thereof and, more particularly, to a curable composition and a use thereof, the curable composition comprising: (a) a compound capable of being denatured to a quinone-based...
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JP2021503562A |
The present disclosure includes articles formed from substrates with coatings, such as articles with heat-sealed coatings, and methods of making them. At least one of the coatings of the articles herein can act as a water barrier. The co...
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JP6825289B2 |
To provide a novel polyimide-based resin composition which imparts an adhesive layer having good adhesiveness, heat resistance and low dielectric characteristics.There are provided a resin composition which contains polyimide (A1) obtain...
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JP6819293B2 |
The present invention provides a laminate film for temporary bonding which is excellent in heat resistance, capable of providing a flat film even at the periphery of a substrate, and capable of making a semiconductor circuit formation su...
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JP6810188B2 |
A method for temporary bonding workpiece includes steps as follows. A combining step is performed, wherein an adhesive layer (330) is formed on a surface of at least one substrate (310) and/or at least one workpiece (320). A bonding step...
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JP6803369B2 |
A substrate (1, 10) for electrical circuits, comprising at least one metal layer (2,3, 14) and a paper ceramic layer (11), which is joined face to face with the at least one metal layer (2,3, 14) and has a top side and bottom side (11a, ...
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JP2020200389A |
To provide a curable resin composition having excellent storage stability and excellent curability.A curable resin composition contains (A) cyanate ester resin, (B) epoxy resin obtained from the reaction between 4-(4-(1,1-bis(4-hydroxyph...
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JP6790816B2 |
To provide a polyimide-based adhesive having good low dielectric characteristics and excellent adhesion to copper. A polyimide-based adhesive comprises polyimide (A) comprising aromatic tetracarboxylic anhydride (a1) and diamine (a2) con...
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JP6787179B2 |
To provide a glass laminate which is easily fabricated and which is suitably used as a substrate for fabricating an electronic device.A glass laminate includes a first glass layer, a resin layer, and a second glass layer in this order, i...
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JP6776589B2 |
To provide a polyimide resin-containing aqueous dispersion composition that is excellent in heat resistance, adhesion, and coating film mechanical properties and also excellent in and solution storage stability.An aqueous dispersion comp...
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JP6770509B2 |
There is provided a resin composition which has long-term heat resistance, rapid curing properties, high adhesive strength during heating, a low change ratio of adhesive strength, and a low normal temperature elastic modulus. The resin c...
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JP6769912B2 |
To provide a semiconductor adhesive sheet capable of reducing a warp after reflow in a semiconductor device that mounts a semiconductor element that is more thinned and made larger in size in response to tendency toward smaller size, lig...
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JP6763139B2 |
This composition has excellent handleability due to its fluidity and thixotropy.
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JP6759932B2 |
To provide a polyimide that gives an adhesion layer having excellent adhesiveness, heat-resistant adhesiveness, and flow controlling and low dielectric properties.A modified polyimide (1) is a reactant between: an acid anhydride group te...
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JP6758330B2 |
Creping adhesives can include one or more crosslinked resins having the chemical formula (O), (P), or (Q), where RX can be a crosslinking moiety, each RY can independently be a substituted or unsubstituted organic diyl moiety, and each A...
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JP6756155B2 |
A resin composition according to an embodiment of the present invention for a flat cable-reinforcing tape contains a polyester, a polyurethane, and a polycarbodiimide, in which the mass ratio of the polyurethane to the polyester is 40/60...
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JP6750202B2 |
To provide a resin composition capable of forming an insulation layer having excellent workability during the polishing and grinding step and excellent adhesion reliability. There is provided a resin composition which comprises (A) an ep...
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JP6748999B2 |
To provide an adhesive composition having excellent connection reliability in a high temperature-high humidity environment.An adhesive composition contains an inorganic nanoparticle coated with (a) an assembly of polyethyleneimine and fa...
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JP2020136600A |
To lighten the warp of a semiconductor device mounting substrate after each of the steps of self-adhesive film lamination, mounting of a semiconductor element, and resin sealing.A self-adhesive film for semiconductor production is to be ...
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JP2020125284A |
To provide fluoropolymers and methods for forming and using the fluoropolymers.The invention provides compounds represented by formula (I). (Ris H, substituted/unsubstituted C-Calkyl, or the like; Qand Qare O, or S; Qand Qare H, amino, o...
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JP6743697B2 |
Disclosed is a multilayer polyimide film which comprises a layer (A) containing a thermoplastic polyimide (A) having a glass transition temperature of lower than 240ºC and a layer (B) containing a heat-resistant polyimide (B) having a g...
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JP6744859B2 |
There is provided a resin composition having long-term heat resistance and a low change ratio of adhesive strength. The resin composition includes (A) a compound having in its molecule an OH group and any one of primary to tertiary amine...
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JP6744094B2 |
An object of the present invention is to provide an adhesive composition for a printed wiring board, the adhesive composition having a good heat resistance. Another object of the present invention is to provide a coverlay for a printed w...
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JP6733845B1 |
Provided is an excellent adhesive composition which is excellent in adhesiveness, heat resistance, handleability and insulation reliability and is suitable for an adhesive film, a coverlay film, a copper-clad laminate and the like. An ad...
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JP2020105493A |
To provide a novel polyimide that has a high softening point and flexibility, and that can be used as a varnish of homogeneous organic solvent.Provided are a polyimide (A) which is a reaction product of a monomer group comprising an arom...
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JP6716939B2 |
To obtain an adhesive having excellent stability to a heating drying treatment as well as a heating treatment during an implementation process.An adhesive has (a) a polyimide, (b) an epoxy compound, (c) an acid-modified rosin and (d) an ...
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JP6715033B2 |
To provide a heat-conductive adhesive composition which reduces an amount of boron nitride particles to be blended and achieves cost reduction, does not lower heat conductivity, adhesiveness and heat resistance when cured, and can be sta...
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JP6713784B2 |
To provide a polyimide capable of forming an adhesive layer which is soluble in an organic solvent, does not generate a volatile component formed of a cyclic siloxane compound, has excellent solder heat resistance, and does not lower an ...
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JP6706995B2 |
To provide an insulating film for underfill which shows plasticity and fluidity in an early stage of a process for bonding a semiconductor chip to a substrate, and which still has superior storage stability over a long time even after ha...
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JP2020084067A |
To provide a novel resin composition for obtaining a coated film excellent in durability to heat, light, weather or the like, adhesiveness, scratch resistance, solvent resistance, antifouling property, adhesiveness, and further a sheet h...
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JP6698306B2 |
The purpose of the present invention is to provide an adhesive tape for an electronic component, the adhesive tape having excellent wire bonding properties and workability. Provided is an adhesive tape for an electronic component, charac...
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JP6699546B2 |
Provided is a polycarbonate-imide-based resin paste which is excellent in terms of (1) solubility in nitrogen-free solvents, (2) low-temperature dryability/curability, (3) low warpage, (4) flexing characteristics, (5) printability, and (...
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JP2020512209A |
Adhesives and methods for injection or compression bonding based on a grafted polypropylene resin and at least one of a maleimide compound, a phenol formaldehyde, a blocked isocyanate, a functionalized silane or an epoxy resin. [Selectio...
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JP6686619B2 |
Provided is a novel polyimide-based adhesive which includes an adhesive layer having a low loss modulus in the B step, good heat sealability and low dielectric properties. The polyimide-based adhesive comprises: (1) a terminal-modified p...
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JP2020056011A |
To provide a resin film that has dielectric characteristics suppressed in humidity dependency while meeting the demand for a higher frequency in an electronic apparatus by improving dielectric characteristics and to provide a polyimide.T...
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JP6655605B2 |
The purpose of the present invention is to provide a means that exhibits excellent heat resistance and mounting reliability when bonding a semiconductor power element to a metal lead frame, which is also free of lead and thereby places l...
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JP6651824B2 |
To provide a curable composition comprising: (A) a compound having a dihydro-1,3-benzoxazine ring; and (B) a salt of a compound having a cyclic amidine and an organic acid.EFFECT: Use of a curable composition of the present invention mak...
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