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JP2014143308A |
To provide a resin composition for temporal fixing which can form a coating film for a support member having a low-adhesion surface, can fix a semiconductor wafer and the support member sufficiently, has a sufficient heat resistance, and...
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JP2014518989A |
Slide bearings and methods of producing slide bearings are disclosed. The slide bearing has a metal support, an adhesive layer and a sliding layer. The adhesive layer is applied directly to the metal support. The adhesive layer comprises...
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JP2014141603A |
To provide a highly thermostable adhesive agent composition having a low dielectric constant and a low dielectric dissipation factor, and further excellent in adhesiveness to metals, an adhesive sheet obtained by molding the adhesive age...
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JP2014139265A |
To provide a polylactic acid-based polyester resin having self emulsification function capable of forming aqueous emulsion without using an emulsifier or an organic solvent, and high in biomass degree, and to provide a water dispersion r...
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JP5562574B2 |
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JP5562360B2 |
The invention is based on the discovery that a remarkable improvement in the performance of maleimide thermosets can be achieved through the incorporation of imide-extended mono-, bis-, or polymaleimide compounds. These imide-extended ma...
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JP5554549B2 |
The invention relates to a supramolecular polymer containing units which are linked by hydrogen bonds, said units being monomers of prepolymers comprising at least one functional group selected from the functional groups (1) and (3) and ...
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JP5560250B2 |
A method for using citraconic anhydride and itaconic anhydride as addition cure end caps in reactions for forming polyamic acid oligomers and polyimide oligomers, is provided. Prepregs and high temperature adhesives made from the resulti...
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JP5560208B2 |
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JP5551962B2 |
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JP5549671B2 |
To provide a photosensitive adhesive which is sufficiently excellent in terms of all the properties of attachment, pattern formability, thermocompression bondability and high-temperature adhesion, and which has thermocompression bondabil...
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JP5553108B2 |
Disclosed is an adhesive composition which contains (A) a thermoplastic resin that has a weight average molecular weight of 10,000-150,000 and a viscosity at 25°C of 5-300 poises as dissolved in N-methyl-2-pyrrolidone such that the resi...
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JP5546137B2 |
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JP5544766B2 |
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JP5546304B2 |
To provide an adhesive film and improve moisture-absorption soldering resistance of a flexible metal-clad laminate produced by using the adhesive film.The adhesive film has an adhesive layer containing a thermoplastic polyimide on at lea...
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JP5544144B2 |
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JP5541613B2 |
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JP5545817B2 |
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JP5537772B2 |
The present invention provides a resin composition for use as an adhesive material of a printed circuit board, comprising a polyimide siloxane resin. The present invention also provides a resin composition, a resin film, a cover lay film...
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JP2014114429A |
To provide a solvent-soluble polyimide resin that is superior in low linear expansion coefficients, colorless transparency, and heat resistance.Used is a polyimide resin obtained by an imidization polymerization reaction of bicyclo[4.2.0...
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JP5532658B2 |
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JP5530206B2 |
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JP5533354B2 |
To achieve both of a good adhesiveness and a good post-solder-reflow conductivity in a two-layer structure shield film which has: a dielectric layer (protection layer); and a conductive adhesion layer including a thermosetting resin with...
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JP5533957B2 |
An object of the present invention is to provide a die-adhering adhesive film which can be laminated on a back of a wafer at a temperature lower than a softening temperature of a protecting tape for an ultra-thin wafer, or a dicing tape ...
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JP5531504B2 |
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JP5527861B2 |
Thermosetting adhesive compositions formed from an epoxy resin containing nano-sized core-shell particles, one or more thermoplastic toughening agent containing an amine-terminated polyethersulfone, and at least one multi-functional epox...
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JP5534378B2 |
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JP5531683B2 |
To provide an adhesive, particularly an interlayer adhesive that is favorably for use in the field of electronic parts such as in mounting semiconductors, because the adhesive is excellent in heat resistance, low in water absorbency, eas...
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JP5522426B2 |
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JP5517326B2 |
The present invention is one liquid type cyanate-epoxy composite resin composition that is comprised of cyanate ester resin (A), epoxy resin (B) and latent curing agent (C) and has high thermal resistance as well as excellent fast curing...
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JP2014101519A |
To provide an adhesive film which can be pasted at low temperatures and patterned with an alkali developer.The provided adhesive film is an adhesive film comprising: a polyimide obtained by reacting tetracarboxylic dianhydride and diamin...
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JP5514060B2 |
To provide an adhesive resin composition capable of forming an adhesive layer without decline of adhesion between a wiring layer and the adhesive layer even in the case of being disposed in a high temperature environment repeatedly. The ...
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JP5501759B2 |
A thermosetting adhesive composition comprising (A) a modified polyamideimide resin that dissolves in organic solvents, (B) a thermosetting resin and (C) a curing agent or curing accelerator.
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JP5499454B2 |
To provide a photosensitive adhesive composition which is excellent in pattern formation, adhesiveness after pattern formation, heat resistance after adhesion and moisture resistance reliability, to provide an adhesive sheet, an adhesive...
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JP5499459B2 |
To provide an adhesive film making the temperature in adhering to the rear side of a wafer sufficiently low and easily detached from a dicing sheet in a pickup process. This adhesive film 1 for semiconductor includes a first adhesive lay...
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JP5499564B2 |
To provide an adhesive composition that is sufficiently good in any of low-temperature adhesiveness, fluidity when heated, and reliability after heat curing, and a film-shaped adhesive, an adhesive sheet, and a semiconductor device using...
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JP5488086B2 |
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JP5489261B2 |
Provided is an electric insulation thermal conductive adhesive having excellent adhesion to a heating member and a radiating member, and excellent thermal conductibility. The thermal conductive adhesive contains (A) 100 weight parts of p...
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JP5494341B2 |
To provide a thermosetting polyimide resin composition excellent in dimensional stability of a cured product, excellent in low-temperature melting properties when partially cured (when entering B-stage), and shows less time change in vis...
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JP5488001B2 |
To provide a method of manufacturing a semiconductor chip an adhesive protrusion of which is sufficiently reduced, and to provide a method of manufacturing a semiconductor device using the same. The method of manufacturing the semiconduc...
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JP2014080494A |
To provide a new curable imide compound having excellent moldability and capable of providing a cured matter having a high glass transition temperature, a high thermal decomposition temperature and a high residual carbon ratio and having...
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JP5484464B2 |
The present invention relates to polymerizable compositions, comprising at least two specific benzoxazines and to cured products obtained from the polymerizable compositions. More particularly, the present invention relates to increasing...
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JP5486309B2 |
The present invention relates to a primer resin for semiconductor devices which comprises a polyamide resin represented by the following formula (1): (wherein, R1 represents a tetravalent aromatic tetracarboxylic acid residue selected fr...
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JP5484706B2 |
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JP5484792B2 |
To provide an adhesive composition capable of satisfying processability (low temperature attachment performance) at a low temperature and reflow resistance at a high degree and capable of achieving sufficient thermal fluidity at a stage ...
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JP2014074137A |
To provide a new polyimide resin which has an excellent low coefficient of thermal expansion and can produce a uniform and transparent cured product when added to a curable resin composition containing an epoxy resin, a method for produc...
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JP5480490B2 |
To provide an adhesive film having excellent adhesiveness and hygroscopic soldering resistance, and to provide a flexible metal-clad laminate obtained by using the adhesive film. The adhesive film is obtained by coating and drying a solu...
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JP2014070182A |
To provide an adhesive sheet for manufacturing a semiconductor device capable of firmly fixing a semiconductor wafer on a pedestal, as well as easily separating the pedestal from the semiconductor wafer.An adhesive sheet for manufacturin...
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JP2014072440A |
To provide a semiconductor device manufacturing method which enables a semiconductor device to be simply manufactured when the semiconductor device is manufactured by mounting a work on wiring formed on a base and subsequently separating...
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JP2014067789A |
To provide a wiring board on a surface of which an uncured adhesive layer with a high degree of freedom in composition design is efficiently and easily formed without a void.The process of manufacturing a wiring board with an uncured adh...
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