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JP5902139B2 |
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JP5901349B2 |
To provide a reliable adhesive film applicable to a multiply-stacked semiconductor device, a method for producing the same, and a tape for processing a wafer using the same.An adhesive film includes at least one kind of thermoplastic res...
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JP2016041797A |
To provide a resin composition for an adhesive having excellent adhesive force and low water absorption, and also having high thermostability and a low dielectric constant-dielectric loss tangent; and to provide an adhesive sheet using t...
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JP5890253B2 |
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JP5887693B2 |
Disclosed is a photosensitive adhesive composition including: (A) an epoxy compound, (B) a soluble polyimide having a residue of the diamine represented by the general formula (2), (C) a photopolymerizable compound, and (D) a photopolyme...
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JP5886027B2 |
To provide a double-sided metal clad laminated sheet with high heat resistance, which suppresses microvoids generated between a metal layer and a polyimide resin layer, and suppresses circuit separation due to permeation of acid cleaning...
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JP5881931B2 |
To provide a semiconductor device in which respective connection parts of a semiconductor chip and a wiring circuit board are mutually electrically connected, or a semiconductor device in which respective connection parts of a plurality ...
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JP5868753B2 |
To provide a flexible metal laminate plate obtained by pasting together an adhesive film, that suppresses the generation of dimensional variation, and a metal foil. (Resolution Means) A polyimide film having a manufacturing film width of...
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JP5867508B2 |
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JP5861915B2 |
To provide a thermosetting resin composition in which a cured product excellent in dimensional stability is obtained, an insulating layer excellent in low temperature meltability is obtained, and that is also excellent in dissolution sta...
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JP5857410B2 |
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JP5853704B2 |
The purpose of the present invention is to provide an adhesive composition, which has high thermal conductivity and excellent adhesion, and wherein dispersibility of a thermally conductive filler is controlled. The adhesive composition i...
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JP5854504B2 |
The invention concerns a process for preparing a ribbon of reinforcement strands or filaments associated on each of its faces with a polymeric binder, said ribbon having a given width substantially constant over its entire length, in whi...
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JP2016023293A |
To provide a resin film-provided prepreg having a low water absorption rate and being excellent in heat resistance, and to provide a metal-clad laminate and a printed wiring board.A resin film-provided prepreg consists of a prepreg forme...
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JP2016020437A |
To provide an adhesive composition for a printed wiring board, which can maintain high adhesiveness for a long time in a high temperature environment and has excellent heat resistance, a bonding film for a printed wiring board, a coverla...
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JP2016500742A |
A curable composition comprising a mixture of a) an epoxy resin and b) a curing agent containing a polyfunctional amine is disclosed. The curing agent composition can be used in a variety of applications including, but not limited to, co...
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JP2016001317A |
To provide pressure-sensitive adhesive compositions which can: realize prompt stabilization of adhesive strength by using adhesive strength stabilizer having a functional group capable of rapidly reacting with a multifunctional crosslink...
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JP5830288B2 |
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JP5830830B2 |
To provide a photosensitive adhesive composition having a thermocompression bonding property enabling improvement of connection reliability, and to provide a film adhesive, an adhesive sheet, an adhesive pattern, a semiconductor wafer wi...
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JP2015218287A |
To provide an accurate and simple method for manufacturing a semiconductor chip without use of an underfill, in manufacturing a semiconductor chip by grinding the rear face of a semiconductor wafer having a bump electrode for use in moun...
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JP5824402B2 |
AS A MASK SHEET, A MASK SHEET IS DESIRED IN WHICH TAPING WITH RESPECT TO A L/F CAN BE PERFORMED AT A LOWER TEMPERATURE THAN A THERMOPLASTIC MASK SHEET, THERMAL DEGRADATION, WHICH MAY CAUSE AN ADHESIVE REMAINS DURING PEELING OFF THE MASK ...
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JP5816752B2 |
A resin composition which has low stress, and good adhesive property in high temperature and high moisture environments and which is useful in adhesive applications in low stress, high moisture sensitivity level electronic packages. Pref...
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JP5803123B2 |
To provide an adhesive sheet for a semiconductor; which has a function as a dicing tape such as a retention capacity of a semiconductor in a dicing process and adhesion to a wafer ring in transportation or expansion; which is capable of ...
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JP5803105B2 |
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JP5796788B2 |
A curable resin composition which can achieve a cured product in which the generation of cracks upon curing is suppressed and which has both a low thermal expansion rate and a low water absorbability is provided. The curable resin compos...
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JP5788173B2 |
New compositions and methods of using those compositions as bonding compositions are provided. The compositions are preferably thermoplastic and comprise imides, amideimides, and/or amideimide-siloxanes (either in polymeric or oligomeric...
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JP5782583B1 |
Provided is an adhesive composition using a polyamide-imide resin suitable for applications such as flexible printed wiring boards. An adhesive composition containing a polyamide-imide resin and an epoxy resin, wherein 15 parts by mass t...
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JP5784993B2 |
To provide a cross-linked polyimide resin capable of forming cross-linked structure of a degree expressing wet-resistant solder heat resistance in a short time, and capable of forming an adhesive layer of preventing an adhesive force fro...
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JP5779895B2 |
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JP5779225B2 |
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JP5777944B2 |
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JP5777323B2 |
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JP5769588B2 |
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JP5768926B2 |
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JP5770106B2 |
Embodiments of the present disclosure present electrically conductive, thermosetting compositions for use in surfacing films and adhesives. The surfacing films possess enhanced electrical conductivity, comparable to metals, without the u...
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JP5758456B2 |
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JP5758457B2 |
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JP2015137287A |
To provide a protective film for a semiconductor wafer which has few voids present between a semiconductor wafer, an adhesive layer and a reinforcing film layer and is well-balanced in a flexural strength of a semiconductor wafer.There i...
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JP5750424B2 |
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JP5751284B2 |
An adhesive sheet comprising a base 3 and an adhesive resin layer 4 formed on one side of the base 3, wherein the adhesive resin layer 4 has a glass transition temperature of 170-200° C. and a post-curing elastic modulus of 100-500 MPa.
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JP5748937B2 |
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JP5750049B2 |
Disclosed is a resin composition which prevents B-stage cracking, and prevents dust fall which can occur, for example, during a manufacturing process of flexible printed circuit boards, and which exhibits a good balance of fold resistanc...
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JP5746939B2 |
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JP2015124296A |
To provide an adhesion, when a substrate and a film are adhered, usable even at a high temperature of 450°C while securing its productivity, and an adhesion method.Provided is an adhesive for adhering a substrate and a film, including a...
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JP5740979B2 |
Provided is an adhesive composition having both excellent storability and excellent connection reliability. The adhesive composition comprises (a) a polyimide soluble in organic solvents, (b) an epoxy compound, (c) particles of a curing ...
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JP5742501B2 |
To provide a laminated sheet for semiconductor, capable of easily forming a semiconductor chip with adhesive layer which includes an adhesive layer having a shape suitable for mounting of a semiconductor chip.The laminated sheet 100 for ...
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JP2015117278A |
To provide a polyimide resin excellent in characteristics, a method for producing a polyimide resin, and an epoxy resin composition including the polyimide resin, and to provide an adhesive or a coating using an epoxy resin composition, ...
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JP5735467B2 |
A resin composition including from about 1 to about 100 weight percent of a thermoplastic oxazolidone ring-containing compound having a molecular weight of at least 5000, which is the reaction product of:a) from about 20 to about 43 weig...
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JP5735989B2 |
To provide a resin composition that contains a solvent-soluble polyimide and can provide a film exhibiting high viscoelasticity and flexibility at high temperatures. To attain this, a polyimide resin composition is provided that includes...
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JP2015108139A |
To provide a polyimide resin composition capable of providing a thermal conductive adhesive film specifically good in electrical insulation property and thermal conductivity, having adhesiveness at low temperature such as 170 to 200°C a...
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