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JP5470678B2 |
A polyimide resin composed of a repeating unit represented by the following formula (1): or composed of the repeating unit represented by the formula (1) and at least one repeating unit represented by the following formula (2): wherein X...
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JP5474551B2 |
The present invention relates to a polymerization catalyst, comprising at least two components, wherein at least one or more of said at least two components are selected from the group of nitrogen containing heterocycles and/or their der...
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JP5475223B2 |
The present invention is a cyanate-epoxy composite resin composition comprised of a cyanate ester resin (A), an epoxy resin (B), and a latent curing agent (C), characterized in that the latent curing agent (C) is composed of a modified p...
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JP5466070B2 |
To provide a bonding sheet material which has embedding properties in a circuit pattern and strong adhesiveness to a conductor that forms a circuit and an organic insulating layer without losing heat resistance and also has storage stabi...
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JP5450913B1 |
The polyimide resin composition of the present invention at least comprises a polar solvent and a polyimide resin, where the viscosity-average molecular weight of the polyimide resin is 0.6 to 1.60. 95 to 100 mol% of total monomer of the...
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JP5454055B2 |
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JP5454056B2 |
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JP5444986B2 |
To provide an adhesive composition for a semiconductor, the composition showing excellent dispersibility of inorganic particles and enabling an alignment mark on a circuit board or a semiconductor chip coated with the composition to be r...
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JP5447205B2 |
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JP5445455B2 |
The adhesive composition of the invention comprises (A) a thermoplastic resin with a Tg of no higher than 100°C and (B) a thermosetting component, wherein the (B) thermosetting component includes (B1) a compound with an allyl group and ...
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JP2014043511A |
To provide a polyimide film which can reduce the dimensional change in the film width direction (TD) and reduce the dimensional change during high-temperature processing while keeping a thermal expansion coefficient approximate to metal,...
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JP5439842B2 |
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JP5437802B2 |
Provided are adhesive compositions comprising a mixture of a maleimide terminated polyimide resin, a thermoplastic resin compatible with the maleimide terminated polyimide resin, a thermally activated free radical curing agent, and elect...
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JP5439818B2 |
To provide an adhesive composition highly satisfying low-temperature adhesiveness and reflow resistance. The adhesive composition includes a thermoplastic resin (A) and a thermosetting component (B), wherein the thermosetting component (...
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JP5439841B2 |
To provide an adhesive composition that highly satisfies low temperature processability (low temperature adhesiveness) and reflow resistance, and is sufficiently cured by a thermal history received in an assembling process after die bond...
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JP5439863B2 |
To provide an adhesive for semiconductor sealing capable of sufficiently suppressing the generation of voids accompanying high temperature heating and showing sufficiently high imbedding property, and capable of manufacturing a semicondu...
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JP5434240B2 |
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JP5427865B2 |
A novel organic insulating film, which is continuously manufactured and has specific properties over the entire width an adhesive film, a flexible metal plated stacked board, a multiplayer flexible metal-plated stacked board, a coverlay ...
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JP5422878B2 |
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JP5411103B2 |
A semiconductor assembly comprising a semiconductor chip on a substrate is adhered to the substrate using a dual cure B-stageable adhesive comprising two chemical compositions, (i) a first composition comprising a curable monomeric or po...
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JP5409373B2 |
Curable compositions, such as benzoxazine-based ones together with core shell rubbers, are useful in applications within the aerospace industry, such as for example as heat curable composition for use as a matrix resin or an adhesive, an...
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JP5405273B2 |
To provide a polyimide resin composition that has high soldering heat resistance and high dimensional stability after curing while having low-temperature adhesion performance. A polyimide resin has a constituent unit represented by gener...
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JP2014502296A |
Described herein is the synthesis of adhesive from simple adhesive coacervates and their uses thereof. The adhesives are composed of (a) a polyanion in the absence of a polycation, wherein the polyanion comprises at least one crosslinkin...
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JP5398087B2 |
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JP5397378B2 |
A photosensitive adhesive composition that can form an adhesive layer on an adherend and allows an adhesive pattern to be formed by exposure treatment with radiation and developing treatment with a developing solution, the photosensitive...
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JP5397526B2 |
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JP5393791B2 |
The present invention relates to a process of making composite structures comprising applying an adhesive composition comprising a protein component, an azetidinium functionalized polymer component and a viscosity modifying component to ...
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JP5386159B2 |
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JP5367971B2 |
The present invention provides N,N'-dimethyl secondary diamine polymers including methylamine-terminated poly-(N-methylazetidine) and methylamine-terminated poly-(N-methylazacycloheptane). Amine compositions and amine-epoxy compositions ...
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JP5365762B1 |
It is a thermoplastic polyimide resin containing a repeating structural unit represented by the following formula (1) and a repeating structural unit represented by the following formula (2), and the repeating structural unit of the form...
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JP5362315B2 |
To provide a semiconductor sealing film-like adhesive having sufficient insulating reliability between wires and sufficient conductivity between a semiconductor chip and a substrate while suppressing the occurrence of void when connectin...
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JP2013245245A |
To provide a pressure-sensitive adhesive for reinforcing a copper-clad laminate or a flexible wiring board, which has no occurrence of flotation from an adherend during a heat-treatment, has a slight rise in adhesive force by the heat-tr...
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JP2013245243A |
To provide a pressure-sensitive adhesive that is a pressure-sensitive adhesive for bonding a support film to a glass plate, can maintain sufficient adhesion even exposed to a high-temperature environment when a following ITO sputtering t...
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JP2013245244A |
To provide a pressure-sensitive adhesive that is a pressure-sensitive adhesive for pasting a support film to reinforce a glass substrate, can maintain adhesion even in formation of an image display element to be exposed to a high-tempera...
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JP5354215B2 |
To provide an adhesive composition excellent in adhesiveness to both inorganic materials and organic materials, and heat resistance and solvent resistance; and to provide an adhesive cured material and a laminate obtained therefrom, and ...
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JP5353064B2 |
To provide a photo-sensitive adhesive composition superior in a pattern forming property by an alkaline developer and having sufficient re-adhesion after exposed, and to provide an adhesive film also superior in pattern forming property ...
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JP5355993B2 |
To provide an adhesive film for obtaining a flexible metal plated laminate sheet in which the occurrence of dimensional change is controlled when produced by a lamination method. In the adhesive film formed by forming an adhesive layer c...
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JP5344880B2 |
To improve heat conductivity as well as both adhesivity and flexibility in a resin composition containing a polyimide resin and an inorganic filler. There is provided an adhesive resin composition containing an inorganic filler and a pol...
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JP5338753B2 |
PURPOSE: An adhesive composition and a connection structure for a circuit member using the adhesive composition are provided to obtain excellent adhesive strength in a curing condition of short time and low temperature and to maintain st...
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JP5343450B2 |
To provide an adhesive film having enough lamination processability at low temperature, combining with high heat resistance and low stickiness, and an adhesive sheet using the adhesive film. The adhesive film 1 for fixing a semiconductor...
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JP2013227499A |
To provide a polyimide resin excellent in high transparency, heat resistance and a low coefficient of linear expansion.A polyimide resin to be used is obtained by imidation polymerization reaction of bicyclo[4.2.0]octane-3,4,7,8-tetracar...
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JP5337348B2 |
To provide a manufacturing method of an adhesive film wherein an adhesive layer is formed using a crystalline thermoplastic polyimide, whereby its optical transparency is improved. In the manufacturing method of the adhesive film having ...
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JP5332799B2 |
To provide a film-like adhesive for sealing a semiconductor that is fully superb in working efficiency when used for sealing a semiconductor apparatus, and can manufacture a semiconductor apparatus fully superb in connection reliability ...
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JP5332419B2 |
To provide a photosensitive adhesive composition which is excellent in patterning ability by the use of an alkali developing liquid, has satisfactory thermo-compression adhesiveness even after patterning, is excellent in heat resistance ...
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JP5333060B2 |
To provide a manufacturing method for a semiconductor device which makes an adhesive layer hardly peeled off from a support member, and allows the adhesive layer to fill recesses of irregularities formed on the surface of the support mem...
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JP5332183B2 |
To provide an adhesive composition allowing both of low-temperature adhesiveness and heat resistance to be sufficiently excellent. The adhesive composition comprises a modified amide-imide resin obtained by reacting an amide-imide resin ...
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JP2013224428A |
To provide a resin composition suppressing exudation when heated and pressurized, excellent in bonding strength and heat resistance; a resin film, a cover lay film, an interlayer adhesive, a metal-clad laminate and a multilayer printed c...
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JP5328006B2 |
The invention is based on the discovery that a remarkable improvement in the performance of maleimide thermosets can be achieved through the incorporation of imide-extended mono-, bis-, or polymaleimide compounds. These imide-extended ma...
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JP2013539493A |
Methods for preparing double-sided multi-layer adhesives, double-sided multi-layer adhesives and articles prepared with double-sided multi-layer adhesives are disclosed. The methods for preparing double-sided multi-layer adhesives includ...
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JP2013539424A |
A composite article comprises a plurality of lignocellulosic pieces and an adhesive system disposed on the plurality of lignocellulosic pieces for bonding the plurality of lignocellulosic pieces. The adhesive system comprises a binder co...
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