| Document |
Document Title |
|
WO/2019/185761A1 |
A method of manufacturing a composite product, comprising: - applying a binder composition, notably in the form of an aqueous solution, to non or loosely assembled matter to provide resinated matter, wherein the binder composition consis...
|
|
WO/2019/188436A1 |
A purpose of the present invention is to provide a curable resin composition that has a high flexibility and good workability before curing and shows a high adhesiveness, high thermal resistance and excellent dielectric properties after ...
|
|
WO/2019/182001A1 |
A film-like adhesive having the following characteristics: (I) when an initial detected temperature of the melt viscosity of the film-like adhesive after being stored for 168 hours at 40°C is T168, and when the initial detected temperat...
|
|
WO/2019/172227A1 |
This adhesive composition comprises a resin component and a modified amine-based curing agent that is solid at ordinary temperature. The resin component contains a bismaleimide compound, a urethane-modified polyester resin, and a bisphen...
|
|
WO/2019/169394A1 |
Methods may include coating a substrate with a polyimide precursor composition prepared from a reaction of a diamine component and a dianhydride component, wherein the reaction includes: a diamine component containing one or more diamine...
|
|
WO/2019/162206A2 |
The invention relates to a method for producing articles coated with adhesive, wherein an aqueous dispersion adhesive composition, containing a dispersed adhesive polymer and a dissolved polyvinylpyrrolidone, is applied to a film substra...
|
|
WO/2019/156253A1 |
The present invention provides: an adhesive sheet that, before a peeling step, stays fully and stably stuck to a back surface of a lead frame and a back surface of a sealing resin and does not leak sealing resin, even after being subject...
|
|
WO/2019/111978A1 |
Achieved are: a nitride ceramic resin composite body that has further improved reliability in terms of heat resistance during the reflow process, while exhibiting heat conductivity, electrical insulation and adhesion to an adherend, whic...
|
|
WO/2019/092968A1 |
Provided is a resin composition having excellent preservation stability and solubility in a low-boiling point solvent such as methyl ethyl ketone. The resin composition is produced through a melt-mixing step of melt-mixing a resin mixtur...
|
|
WO/2019/080045A1 |
The present invention relates to a (meth)acrylate copolymer comprising, in polymerized form, (a) a hydrophobic monomer, (b) a hydrophilic monomer, and optionally a vinyl monomer other than monomers (a) and (b). In particular, the (meth)a...
|
|
WO/2019/065819A1 |
A composition for forming a temporary bonding layer, which is used for the purpose of forming a temporary bonding layer that affixes a resin substrate onto a base material, and which contains (A) a polyamic acid of formula (P1), (B) a po...
|
|
WO/2019/044754A1 |
The present invention is: a two-component endoscope adhesive having a main agent and a curing agent, wherein the main agent includes at least one type of epoxy resin (A) from among a bisphenol-A-type epoxy resin, a bisphenol-F-type epoxy...
|
|
WO/2019/031178A1 |
A resin composition comprising a cyanic ester compound represented by formula (1) and a filler having a thermal conductivity of 3W/(m∙K) or more. NCO-Ar1-Ar2-Ar3-OCN (1) (In formula (1), Ar1 and Ar3 are the same or different and repres...
|
|
WO/2018/235854A1 |
An adhesive for semiconductors, which contains a thermoplastic resin having a glass transition temperature of 35°C or less.
|
|
WO/2018/229415A1 |
Sulphurised benzoxazine compound for use in the synthesis of a polybenzoxazine, corresponding to the formula (A), (formula I): wherein: each benzene ring of the two oxazine rings bears at least one radical denoted "G"; the two oxazine ri...
|
|
WO/2018/229416A1 |
Sulphurised polybenzoxazine, the recurring units of which comprise at least one unit corresponding to the formulas (I) or (II): wherein the two oxazine rings are connected to one another by a central aromatic group, the benzene ring of w...
|
|
WO/2018/229417A1 |
Metal or metal-plated reinforcement, at least the surface of which is at least partly made of metal, at least the metal portion being coated with a sulphur polybenzoxazine, the recurring units of which comprise at least one unit correspo...
|
|
WO/2018/213668A1 |
The present invention relates to resins useful in adhesive and sealant compositions and particularly as one drop fill sealants for liquid crystal applications. In particular, the present invention permits assembly of LCD panels without m...
|
|
WO/2018/199117A1 |
Provided is a substrate laminate comprising a first substrate, an adhesive layer, and a second substrate that are laminated in this order, the adhesive layer containing a reaction product of a compound (A) having a cationic functional gr...
|
|
WO/2018/191954A1 |
This invention relates to a (meth) acrylate-functionalized poly (meth) acrylate-block-polyimide-block-poly (meth) acrylate copolymer, preparation method and use thereof. The (meth) acrylate-functionalized poly (meth) acrylate-block-polyi...
|
|
WO/2018/194133A1 |
The purpose of the present invention is to provide a semiconductor substrate manufacturing method, for example, which prevents detachment and the like of a semiconductor wafer being ground, and which prevents cracking or chipping in a se...
|
|
WO/2018/193983A1 |
A purpose of the present invention is to provide an imide oligomer which is able to be used for a cured product that has excellent long-term heat resistance. Another purpose of the present invention is to provide: a curing agent which is...
|
|
WO/2018/180158A1 |
[Problem] To provide a coating film modifier for creping which, when used together with an adhesive agent for creping, enables the uniform formation of fine wrinkles in wet paper. [Solution] The present invention is a coating film modifi...
|
|
WO/2018/152497A1 |
An adhesive and method for injection or compression bonding, where the adhesive is based on a grafted polypropylene resin and at least one of maleimide compound, phenolic resin, blocked isocyanate, functionalized silane, or an epoxy resin.
|
|
WO/2018/109711A1 |
The present invention relates to an adhesive film including a photothermal conversion layer including a light absorber and a thermally decomposable resin; and an adhesive layer, in which the thermally decomposable resin has a -COOH or -O...
|
|
WO/2018/087858A1 |
Provided is a semiconductor-bonding resin composition that exhibits superior thermal conductivity and electrical conductivity, and is optimal for bonding a power semiconductor element and an element-supporting member. The semiconductor-b...
|
|
WO/2018/078227A1 |
The invention relates to polybenzoxazine comprising repeating units comprising at least one motif of formula (I) or (II) in which Z1 and Z2 are the same or different and represent an at least divalent, aliphatic, cycloaliphatic or aromat...
|
|
WO/2018/065399A1 |
The invention relates to a cyanate ester based adhesive comprising a component A which has at least one cyanate ester with at least two OCN groups, and a component B which comprises at least one catalyst for the trimerisation reaction of...
|
|
WO/2018/062835A1 |
The present invention relates to a curable composition and a use thereof and, more particularly, to a curable composition and a use thereof, the curable composition comprising: (a) a compound capable of being denatured to a quinone-based...
|
|
WO/2017/209043A1 |
This resin composition for an underfill material contains a maleimide compound (A) and a secondary monoamino compound (B), wherein said secondary monoamino compound (B) has a boiling point of greater than or equal to 120°C.
|
|
WO/2017/204188A1 |
The resin composition for flat cable reinforcement tapes according to an aspect of the present invention comprises a polyester, a polyurethane, and polycarbodiimide, the mass ratio of the polyurethane to the polyester being 40/60 to 80/2...
|
|
WO/2017/190949A1 |
The invention relates to a thermally curable adhesive compound consisting of the following components: (A) 4.9 to 34.9 wt% (relative to the total amount of the curable adhesive compound) of an epoxide-functionalized (co)polymer having a ...
|
|
WO/2017/169574A1 |
The purpose of the present invention is to provide a photosensitive adhesive composition that has an excellent filler dispersibility at the time of preparation of a coating material, and a photosensitive adhesive sheet that has a high me...
|
|
WO/2017/158917A1 |
Provided is an adhesive composition which is suitable for laminating a polyimide film to copper foils to produce a double-sided copper-clad laminate for use in producing flexible printed wiring boards. The adhesive composition comprises ...
|
|
WO/2017/138447A1 |
The present invention provides a resin composition with which a substrate for electronic-circuit formation or a substrate for semiconductor-circuit formation can be bonded to a supporting substrate and which, in the state of being bondin...
|
|
WO/2017/136669A1 |
Provided herein are debondable adhesive compositions comprising (A) one or more bis-maleimide (BMI), nadimide or itaconimide oligomer(s), (B) at least one ethylenically unsaturated co-monomer (e.g. co-monomers selected from the group con...
|
|
WO/2017/110576A1 |
A solvent-free silicone-modified polyimide resin composition having fluidity and including no solvent, the composition containing (A) a silicone-modified polyimide resin of formula (1), Ee-Ff-Gg (1) (E is formula (2), F is formula (3), a...
|
|
WO/2017/103376A1 |
The invention relates to a metallic or metallised reinforcement, of which at least the surface is at least partially metallic, at least said metallic part being coated with a polybenzoxazine of which the repeat units comprise at least on...
|
|
WO/2017/103375A1 |
A polybenzoxazine of which the repeating units comprise at least one unit corresponding to formulae (I) or (II): in which: - Z1 represents an at least divalent, aliphatic, cycloaliphatic, or aromatic linking group, comprising at least on...
|
|
WO/2017/095884A1 |
A metal-on-ceramic substrate comprises a ceramic layer (210), a first metal layer (240), and a bonding layer (220) joining the ceramic layer to the first metal layer. The bonding layer includes thermoplastic polyimide adhesive that conta...
|
|
WO/2017/077912A1 |
Provided is a laminate that exhibits good adhesion properties with respect to not only conventional polyimide and polyester films but also to metal substrates and low polarity resin substrates, such as LCP, and that can attain high solde...
|
|
WO/2017/073507A1 |
The present invention provides a laminate film for temporary affixing, which has excellent heat resistance, which can form a flat coating across a substrate, extending to a periphery of the substrate, which can be used to bond a semicond...
|
|
WO/2017/057519A1 |
The purpose of the present invention is to provide an adhesive tape for an electronic component, the adhesive tape having excellent wire bonding properties and workability. Provided is an adhesive tape for an electronic component, charac...
|
|
WO/2017/029917A1 |
Provided is an adhesive composition that is highly adhesive not only to conventional polyimide and polyester films but also to low polarity resin base materials such as LCP and metal base materials, ensures a high solder heat resistance ...
|
|
WO/2017/022523A1 |
The purpose of the present invention is to provide a means which exhibits excellent heat resistance and mounting reliability when a semiconductor power element is bonded to a metal lead frame, and which is free from lead, thereby placing...
|
|
WO/2017/011207A1 |
The present invention relates to curable novel bismaleimide resins and prepolymers, methods of manufacture. Particularly useful applications include one drop fill sealant used in liquid crystal assembly. In particular, the inventive poly...
|
|
WO/2016/194920A1 |
A solvent-free light-curable adhesive composition includes: for example, a triazine ring-containing polymer including a repeating unit structure represented by formula [3] and having a weight-average molecular weight of 500-5000; and a r...
|
|
WO/2016/185956A1 |
Provided is a laminate which has superior low dielectric constant characteristics, which exhibits excellent adhesion between metal substrates and not only conventional polyimide and polyester film substrates, but also low polarity resin ...
|
|
WO/2016/173387A1 |
The present invention relates to an electrode binder for a lithium ion battery, which is a polymer obtained by polymerizing a diamine monomer and a dianhydride monomer. At least one of the diamine monomer and the dianhydride monomer comp...
|
|
WO/2016/167245A1 |
The purpose of the present invention is to provide a means which exhibits excellent heat resistance and mounting reliability when joining a semiconductor power element to a metal lead frame, and which is lead free and places little burde...
|
