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WO/2018/008332A1 |
A radical-curable adhesive composition which comprises a rubber (a) having one or more (meth)acryloyl groups in the molecular chain, a polymerizable monomer (b) having both an epoxy group and a (meth)acryloyloxy group in the molecule, an...
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WO/2018/008462A1 |
[Problem] To provide an adhesive composition having a long pot life, it being possible to cure said composition at a lower temperature than in precuring when used in the two stages of precuring and curing. [Solution] An adhesive composit...
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WO/2018/005585A1 |
Ionizing radiation crosslinkable pressure sensitive adhesive precursors containing hydrocarbon tackifiers and having an acid content of no more than 3% by weight. The precursors can be exposed to a source of ionizing radiation, for examp...
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WO/2018/003682A1 |
Provided is a 2-cyanoacrylate adhesive composition having excellent storage stability together with actualizing an excellent adhesion rate to metals and low-polarity thermoplastic elastomers. A 2-cyanoacrylate adhesive composition contai...
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WO/2018/003511A1 |
The silicone rubber composition of the present invention comprises: (A) an organopolysiloxane having at least two alkenyl groups in a molecule and free of an aryl group; (B) (B-1) an organosiloxane having in a molecule at least one aryl ...
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WO/2018/003704A1 |
The present invention provides a thermally curable electroconductive adhesive which, when cured at a high temperature in a short time, can attain high electroconductivity (low connection resistance). The present invention further provide...
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WO/2018/003893A1 |
This adhesive film (100) for semiconductor wafer processing is sequentially provided with a base layer (10), an antistatic layer (30) and an adhesive resin layer (40) in this order, and is used for the purpose of protecting the surface o...
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WO/2018/003981A1 |
A composition having heat resistance, adhesiveness, and strippability is provided. The composition comprises the following components (A) to (E): component (A) is a monofunctional (meth)acrylate having a number-average molecular weight l...
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WO/2017/221694A1 |
The purpose of the present invention is to provide an adhesive composition which is excellent in terms of adhesiveness to low-surface-energy materials such as polyolefins and adhesiveness for bonding between materials of different kinds ...
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WO/2017/221517A1 |
Provided are: a photocurable resin composition having excellent moist-heat resistance and high heat resistance; and a pressure-sensitive adhesive or an adhesive each comprising the photocurable resin composition. The photocurable resin c...
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WO/2017/216108A1 |
The present invention is directed to a pressure sensitive adhesive comprising A) a polymer synthesized from a) 96 to 99.85% by weight, based on the total amount of monomers for the synthesis of polymer A), of two or more monoethylenicall...
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WO/2017/217749A1 |
The present invention relates to a binder composition for bonding, at room temperature, a soft or hard polymer thermoplastic resin material and a thermoplastic resin material having a molecular structure having the same or different phys...
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WO/2017/216913A1 |
This ultraviolet-curable acrylic adhesive composition, which is for forming an adhesive layer positioned between a polarization film and a cover glass or a cover plastic in an image display device, is characterized by including: a monome...
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WO/2017/213025A1 |
Provided is a photo-curable resin composition which comprises a radically polymerizable group-containing compound, a cationically polymerizable group-containing compound, a photoradical initiator, and a photoacid generator, wherein: the ...
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WO/2017/211044A1 |
Disclosed is a drainage structure with integrated waterproofing and drainage, comprising a water filtering layer and a drainage board. One side of the drainage board is provided with several drainage grooves arranged at intervals. The dr...
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WO/2017/209257A1 |
A purpose of the present invention is to provide a pressure-sensitive-adhesive precursor composition capable of providing a pressure-sensitive adhesive sheet which satisfies all of transparency, conformability to rugged portions, and uns...
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WO/2017/209013A1 |
Provided is a photocurable resin composition for an interlayer film of laminated glass which includes a (meth)acrylic polymer, a (meth)acrylic monomer, and a photoinitiator. The photocurable resin composition may further include a plasti...
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WO/2017/202698A1 |
Two-part cyanoacrylate compositions, methods for making same, and uses therefor are described. The compositions can be used to bond a variety of substrates including plastics and metals. The compositions remain effective after thermal ag...
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WO/2017/205445A1 |
Provided herein are adhesive compositions comprising a polyurea-poly(meth)acrylate interpenetrating polymer network. Further provided are two-part curable adhesive compositions comprising a Part A initiator composition and a Part B activ...
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WO/2017/203783A1 |
The present invention pertains to a curable composition which simultaneously ensures adhesive strength to an inorganic substrate and an organic substrate, and which is characterized by containing a (meth)acrylic oligomer (component A) ha...
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WO/2017/196765A1 |
The present invention provides adhesive compositions, sometimes in a two part configuration which includes a first part containing a (meth)acrylic component, an organic peroxide and a silsesquioxane and a second part containing a (meth)a...
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WO/2017/195711A1 |
An adhesive tape 100 for processing semiconductor substrates according to the present invention is characterized by comprising a base material 4 and an adhesion layer 2 stacked on one surface of the base material 4, wherein the base mate...
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WO/2017/196804A1 |
An adhesive is provided that has superior bonding strength and that can be beneficially used as a structural adhesive and, when formed into a sheet shape, has superior shape retention. The adhesive includes an acrylic polymer; an epoxy r...
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WO/2017/195517A1 |
Disclosed is a method for manufacturing a semiconductor device provided with a semiconductor chip having connection parts, and a wiring circuit substrate having connection parts, the respective connection parts being electrically connect...
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WO/2017/191835A1 |
Provided is an adhesive sheet having good adhesion in a normal state, excellent release properties when releasing from an adherend, and excellent nonflammability. This adhesive sheet is provided with an adhesive layer having a surface A ...
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WO/2017/184986A1 |
The present teachings contemplate a method comprising coating an polymeric material with a composition including a dicarbonyl compound and having a viscosity of from about 50 cps to about 500 cps, wherein the coating initiates either: (i...
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WO/2017/183333A1 |
Disclosed is an active-energy-ray-curable adhesive composition comprising at least a radical-polymerizable compound, the active-energy-ray-curable adhesive composition being characterized in that the radical-polymerizable compound includ...
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WO/2017/183335A1 |
Disclosed is a polarizing film having a transparent protection film provided on both surfaces of a polarizer with respective adhesive layers (a) and (b) sandwiched therebetween, wherein: the adhesive layer (a) on one surface has a glass ...
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WO/2017/183332A1 |
Disclosed is an active-energy-ray-curable adhesive composition comprising at least a radical-polymerizable compound, the active-energy-ray-curable adhesive composition being characterized in that, when the total amount of the radical-pol...
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WO/2017/183334A1 |
Disclosed is a polarizing film having a transparent protection film provided on both surfaces of a polarizer with respective adhesive layers (a) and (b) sandwiched therebetween, wherein: the adhesive layer (a) on one surface has a glass ...
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WO/2017/169661A1 |
The objective of the present invention is to provide a photocurable resin composition which exhibits sufficient curability in a deep portion. This photocurable resin composition is characterized by containing an allyl polymer (a) that is...
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WO/2017/169574A1 |
The purpose of the present invention is to provide a photosensitive adhesive composition that has an excellent filler dispersibility at the time of preparation of a coating material, and a photosensitive adhesive sheet that has a high me...
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WO/2017/170955A1 |
Provided is a composition which exhibits sufficient adhesive strength even after a high-temperature treatment. The composition comprises (1) polymerizable monomers comprising an ingredient (1-1) which is a monofunctional polymerizable mo...
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WO/2017/170957A1 |
A composition having heat resistance is provided. The composition comprises (1) (meth)acrylates comprising (1-1) a monofunctional (meth)acrylate having an aromatic group, (1-2) a monofunctional (meth)acrylate having a hydroxy group, and ...
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WO/2017/168001A1 |
Anaerobically curable (meth)acrylate compositions, methods for their preparation, and uses thereof. The anaerobically curable compositions proved effective at bonding a wide variety of substrates, and the tensile strength performance of ...
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WO/2017/163721A1 |
Provided is a method for manufacturing a connection structure in which the allowable range of a terminal interval in a member can be enlarged and which can be mounted at low temperature. The method comprises: an arranging step for arrang...
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WO/2017/159788A1 |
The purpose of the present invention is to provide an adhesive sheet which is formed from a dual curing adhesive composition, and which has a sufficiently low relative dielectric constant and excellent durability. The present invention r...
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WO/2017/157711A1 |
Inhibition by oxygen of the peroxide-initiated cure of a composition based on (meth)acrylates or other compounds containing free radical-polymerizable functional groups is mitigated by inclusion of one or more polythiols in the compositi...
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WO/2017/154660A1 |
The purpose of the present invention is to obtain a curable composition of (meth)acrylic polymer that can be easily kneaded at the time of production, that can provide a cured product with excellent dynamic viscoelastic properties, and t...
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WO/2017/154415A1 |
A curable resin composition characterized by comprising a compound represented by the following general formula (1) (wherein X is a functional group including a reactive group, and R1 and R2 each independently represent a hydrogen atom o...
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WO/2017/153705A1 |
A process of forming a cross-linked electronically active hydrophilic co- polymer comprising the steps of: a. mixing an intrinsically electronically active material with water to form an intermediate mixture; b. adding at least one hydro...
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WO/2017/154616A1 |
[Problem] The purpose of the present invention is to provide an anaerobic curable resin composition having characteristics whereby a cured product thereof is fragile and easily made into fine particles. [Solution] An anaerobic curable re...
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WO/2017/151711A1 |
This invention relates to photocurable electron deficient olefin-containing compositions, such as those containing certain 2-cyanoacrylates, 2-cyanopentadienoates, methylidene malonates, and vinylidine cyanide, and photolatent bases. Whe...
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WO/2017/146444A1 |
The present invention relates to a method for preparing (meth)acrylate group-containing benzophenone for an optical adhesive, comprising the steps of: preparing a raw material composition by mixing a benzophenone-based compound containin...
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WO/2017/143316A1 |
Methods for forming melt processable, actinic radiation polymerizable and crosslinkable adhesives are described. In certain versions, the adhesives or pre-adhesive compositions include two initiators and are polymerized and/or crosslinke...
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WO/2017/141668A1 |
Provided is a polysulfide adhesive tape having excellent oil resistance, etc. and sufficient adhesive force. The polysulfide adhesive tape of the present invention is provided with an adhesive layer formed from a polysulfide adhesive com...
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WO/2017/138253A1 |
The purpose of the present invention is to provide: an electrically conductive adhesive film which is suitably used as an electrically conductive bonding material when bonding a semiconductor chip (particularly a power device) to the top...
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WO/2017/138567A1 |
[Problem] To improve long-term storage stability of a polymerizable composition containing an organoborane and a polymerizable monomer. [Solution] Provided is a polymerizable composition which contains an organoborane (A), a polymerizabl...
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WO/2017/138252A1 |
The purpose of the present invention is to provide: an electrically conductive adhesive film which is suitably used as an electrically conductive bonding material when bonding a semiconductor chip (particularly a power device) to the top...
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WO/2017/134171A1 |
The invention relates to a layered product comprising at least one natural fiber layer comprising a web of natural fibers and at least one SAP layer comprising a non-woven substrate comprising a thermoplastic polymer fibers and a superab...
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