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WO/2020/198022A1 |
The present invention provides certain chemical compounds or materials having adhesive properties or functionality that act as adhesives or sealants in a variety of applications. In particular, the invention, including its various embodi...
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WO/2020/195982A1 |
Disclosed is a method for producing a cured product of a urethane prepolymer composition containing a urethane prepolymer. The production method includes a step of moisture-curing a urethane prepolymer composition to obtain a first cured...
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WO/2020/196757A1 |
The present invention relates to an adhesive sheet that has: a base material (Y); and an adhesive layer (X1) that contains a polymer of energy-ray polymerizable components, and thermally expandable particles the expansion start temperatu...
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WO/2020/188066A1 |
The invention is directed to a method for adhesively bonding two substrates by means of a moisture-curable adhesive composition, characterized in that at least one of the substrates comprises at least 40 wt.-% of a mixture, said mixture ...
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WO/2020/178063A1 |
The invention relates to a piezoceramic hydrophone at least comprising the following elements: a first hemispherical shell (1) and a second hemispherical shell (2) which have been assembled to form a hollow sphere (3); wherein the first ...
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WO/2020/174394A1 |
Provided are dispensing devices and methods for a filament adhesive. The dispensing devices use a barrel including one or more heating elements, and a rotatable screw received in the barrel, the rotatable screw optionally including at le...
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WO/2020/174396A1 |
Methods of bonding a pressure-sensitive adhesive to a substrate are provided. The methods include heating a styrenic block copolymer composition to provide an adhesive melt composition, wherein the styrenic block copolymer composition co...
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WO/2020/171863A1 |
Aspects of the present disclosure provide for composite structures including a bonding layer that adheres a substrate (e.g., including a polymeric composition such as rubber) to a material (e.g., including a polymer such as polyurethane)...
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WO/2020/164898A1 |
An apparatus includes a first substrate, a second substrate, and an intermediate layer disposed between the first and second substrates. The intermediate layer is configured to be a first point of failure or breakage of the apparatus und...
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WO/2020/165347A1 |
A self-adhesive seal assembly includes an elastomer seal (1), wrapped in a textile (2) and a double-sided adhesive tape (3) comprising a carrier tape (4), a first layer (5) of a pressure-sensitive adhesive (PSA) on one side of the carrie...
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WO/2020/162434A1 |
The present invention provides a thermosetting adhesive comprising a polyurethane, an isocyanate, an epoxy, and a phenoxy resin, wherein the dynamic viscoelastic spectrum of a cured product has a peak showing the softening temperature in...
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WO/2020/161426A1 |
The invention relates to a method for separating a first mechanical part (12) from a second mechanical part (14), wherein the second mechanical part (14) is bonded to the first mechanical part (12) by an adhesive film (16) along a connec...
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WO/2020/160636A1 |
The single strand hair extension method (SSHE), installs hair extensions by only using one hair strand extension per one head hair strand. The SSHE's purpose is to connect a single strand of hair extension to a single strand of head hair...
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WO/2020/159907A1 |
An adhesive (500) suitable for use in security documents (100) (for example, currency, passports, tickets, etc.) includes a plurality of polymers (505), that collectively exhibit tackification (510), resistance to aqueous agents (515), a...
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WO/2020/158381A1 |
The present invention provides a method for manufacturing an electronic component, the method including securing a brittle substrate to a support and separating the brittle substrate from the support, and being such that it is possible t...
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WO/2020/158453A1 |
Provided are a surface modification method that modifies a surface of a polymeric material, particularly a polymeric material including a ketone group, and also a bonding method, a surface modification material, and an assembly. This sur...
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WO/2020/160463A1 |
The invention concerns adhesives comprising a polymer network capable of conversion between two different elastic modulus states with essentially no residual stress evolved in conversion between the two different elastic modulus states, ...
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WO/2020/152147A1 |
The invention relates to a reactive 2-component adhesive system in film form for adhering various materials, such as metal, wood, glass and/or plastic, comprising two reactive adhesive films A and B based on acrylic monomers having a low...
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WO/2020/153357A1 |
This adhesive tape (10) is provided with: a substrate (11); and an adhesive layer (20) provided on a surface (11A) of the substrate (11) and containing bubbles (21) therein, wherein the bubbles (21) include a first bubble (21A) that is i...
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WO/2020/153803A1 |
The present invention relates to a method for manufacturing a polarizing plate, and an adhesive composition for a polarizing plate, the method comprising the steps of: preparing a polarizer; providing an adhesive composition on one surfa...
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WO/2020/146914A2 |
Methods for processing a metal substrate for use in a power electronics device are provided.In one example, the method includes placing a metal substrate on a support associated with a laser system.The method includes performing a pulsed...
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WO/2020/145185A1 |
Provided is a pressure-sensitive adhesive sheet which can be held easily during use so as to prevent the adhesive surfaces from being affixed to one another; and a pressure-sensitive sheet for reapplication, with which a health device ca...
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WO/2020/136976A1 |
Provided is a method for identifying the elastic characteristics of an adhesive in a state where adherends are mutually adhered by the adhesive. In the method, an adhesive strength test is carried out, the strain distribution of the adhe...
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WO/2020/138619A1 |
A method for producing a card, according to the present invention, comprises the steps of: manufacturing an attachment film by applying an adhesive to one surface of a thin film sheet; forming fine holes in the attachment film; forming a...
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WO/2020/136511A2 |
The present disclosure provides a method for bonding parts, comprising the following steps (a) Providing a two-component adhesive composition precursor, comprising a first part (A) comprising at least one epoxy curing agent and preferabl...
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WO/2020/130073A1 |
Provided is a solventless two-part adhesive which has excellent worked appearance and workability while exhibiting excellent adhesive strength even after short term aging of 12 hours at a normal temperature (about 25°C). The present i...
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WO/2020/128718A1 |
A thermosettable precursor of an expanded structural adhesive composition comprising: an epoxy compound; an epoxy curing agent; an expanding agent; and a mineral pigment selected from the group of phosphate metal complexes. In addition, ...
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WO/2020/118456A1 |
A method for curing adhesive during assembly of glass syringes, including: dispensing adhesive onto a glass syringe; and curing the adhesive using a UV LED line array. The method may include one or both of pre-curing the adhesive using a...
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WO/2020/121715A1 |
This pressure-sensitive adhesive composition contains a pressure-sensitive adhesive component, and gas-generating particles containing gas-generating particles dispersed in the pressure-sensitive adhesive component. The tensile modulus a...
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WO/2020/115289A1 |
A method of activating a surface of a plastics substrate formed from: (a) polyaryletherketone such as polyether ether ketone (PEEK) polyether ketone ketone (PEKK), polyether ketone (PEK); polyether ether ketone ketone (PEEKK); or polyeth...
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WO/2020/115867A1 |
This OSR attaching device attaches an optical solar reflector (OSR) (30) to a panel (31) such as a heat pipe panel or a structural panel for an artificial satellite using a compression pad (11) having a hard layer (21) formed of an elast...
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WO/2020/116497A1 |
The purpose of the present invention is to provide: a method for removing a pressure-sensitive adhesive tape, the method making it possible that a component fixed with the pressure-sensitive adhesive tape is less apt to be damaged when r...
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WO/2020/109968A1 |
An adhesive composition comprises a resin base material, a peroxide crosslinking agent, a non-peroxide crosslinking agent, a coupling agent, an ultraviolet absorber, and an ultraviolet stabilizer, wherein the adhesive composition undergo...
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WO/2020/106413A1 |
Disclosed herein are embodiments of a method of forming a curved glass article. In the method, a first adhesive is applied to a first region of a frame or of a glass cover sheet. The frame includes a curved surface. A second adhesive is ...
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WO/2020/100965A1 |
The present invention comprises a first step and a second step. In the first step, when bonding a first substrate 11 made from a semiconductor-forming substrate and a second substrate 12 made from a support substrate that allows the pass...
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WO/2020/100966A1 |
Provided is an adhesive composition for infrared peeling, which can be peeled by irradiation with infrared light, comprising: a component (A) which is cured by a hydrosilylation reaction; and at least one type of component (B) selected f...
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WO/2020/096762A1 |
The present invention is directed to tack solutions comprising formic acid, and their use in applying adhesive-coated films to substrates. In particular, paint protection films (PPFs) can be applied to vehicle bodies using the solutions ...
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WO/2020/087403A1 |
Provided are a cleaning accelerant and a using method thereof. The cleaning accelerant consists of 0.1-1.0 wt% of an accelerant and 99-99.9 wt% of a cleaning agent. The using method thereof comprises: preparing the accelerant and the cle...
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WO/2020/085183A1 |
This substrate layered body manufacturing method includes: a step in which a bonding material is applied to the surface of a first substrate and/or a second substrate; a step in which the bonding material which was applied to the surface...
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WO/2020/086454A1 |
The present application provides an electrochemically de-bondable adhesive composition for forming an adhesive layer that has high adhesiveness, reduced corrosive effects upon the substrate it is attached to and one that may be easily de...
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WO/2020/080618A1 |
A mixture for adhering fluororesin material comprises 80% to 90% by weight of tetrahydrofuran (THF), 5% to 15% by weight of naphthalene, 1% to 5% by weight of metallic sodium, and 1% to 5% by weight of coating additive.
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WO/2020/071471A1 |
The method for bonding metallic members according to an aspect of the present invention is a method for bonding metallic members to each other which comprises: a step in which a silver ink composition adherent to a surface of a first met...
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WO/2020/069884A1 |
The invention relates to a thermally curable adhesive film comprising at least one layer of an adhesive comprising at least one epoxy-functionalized (co)polymer (A) having a weight-average molar mass in the range from 5000 g/mol to 5 000...
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WO/2020/070687A1 |
The present disclosure relates to a curable precursor of a structural adhesive composition, comprising: a) a cationically self-polymerizable monomer; b) a polymerization initiator of the cationically self-polymerizable monomer which is i...
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WO/2020/067222A1 |
The present invention pertains to a bonding and separation method for adherends, including: a first bonding step in which an adhesive sheet including at least an adhesive layer containing an electrolyte is bonded to a first adherend; a f...
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WO/2020/067270A1 |
The present disclosure provides an adhesive composition which contains an epoxy resin, an acrylic resin that is compatibilized with the epoxy resin, a curing agent and a foaming agent. This adhesive composition contains, as the epoxy res...
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WO/2020/067221A1 |
The present invention pertains to an adherend separation method having: a first voltage application step in which, in a state in which an electrolyte-containing adhesive layer in an adhesive sheet including at least the adhesive layer co...
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WO/2020/061201A2 |
The present disclosure is directed to a formulations of cements and methods for bonding dissimilar materials. The formulations and methods can bond a Non-polyvinyl chloride (PVC) containing first polyolefin that is amorphous or has low c...
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WO/2020/053651A1 |
Methods for applying high shrink wrap labels to a shaped article are disclosed. The leading edge of the label is bonded to the article. A seaming agent is applied, and the label is wrapped around the article. The seaming agent is then ex...
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WO/2020/053005A1 |
The invention relates to a method for curing an adhesion point (24) between two components (12, 14) by means of electromagnetic radiation (54), preferably in the UV range, wherein said adhesion point (24) is located between a recess stru...
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